NX5P1000E Search Results

NX5P1000E Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
NX5P1000E		NXP Semiconductors	WLCSP12: wafer level chip-scale package; 12 bumps		Original	PDF

NX5P1000E Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch Backside coating included A E NX5P1000E NX5P3001/NX18P3001 B A2 ball A1 index area A D A1 detail X e1 e C Øv Øw b C A B C y D e C e2 1/2 e B A ball A1	Original	WLCSP12: NX5P1000E NX5P3001/NX18P3001 wlcsp12 NX5P100005	PDF

Catalog Datasheet

Type

Document Tags

PDF

Untitled

Abstract: No abstract text available
Text: Package outline WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch Backside coating included A E NX5P1000E NX5P3001/NX18P3001 B A2 ball A1 index area A D A1 detail X e1 e C Øv Øw b C A B C y D e C e2 1/2 e B A ball A1

Original

WLCSP12: NX5P1000E NX5P3001/NX18P3001 wlcsp12 NX5P100005

PDF