Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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000pF
90Sn/10Pb)
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Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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000pF
90Sn/10Pb)
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Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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000pF
90Sn/10Pb)
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563 j 400v
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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000pF
90Sn/10Pb)
563 j 400v
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Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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000pF
90Sn/10Pb)
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Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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PDF
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000pF
90Sn/10Pb)
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Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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000pF
90Sn/10Pb)
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Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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000pF
90Sn/10Pb)
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novacap epoxy silver
Abstract: No abstract text available
Text: CAPACITOR ARRAYS The Cap-Rack US Patent 6,058,004 is an assembly of individual chip capacitors, bonded with high temperature epoxy. This construction permits the assembly of dissimilar capacitance values or dielectrics into one single component, providing extended freedom for
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MIL-PRF-55681
90Sn/10Pb)
novacap epoxy silver
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capacitors coefficient of thermal expansion
Abstract: novacap epoxy silver IPC-SM-782 free capacitor
Text: APPLICATION NOTES CHIP SELECTION Multilayer capacitors MLC are categorized by dielectric performance with temperature, or “temperature coefficient”, as these devices vary in behavior over temperature. The choice of component is thus largely determined by the temperature stability required of the device, i.e. type
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MIL-PRF-55681)
09-08-PC
capacitors coefficient of thermal expansion
novacap epoxy silver
IPC-SM-782
free capacitor
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Untitled
Abstract: No abstract text available
Text: SMT-X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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000pF
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Technical Brochure
Abstract: Catalytic capacitors coefficient of thermal expansion Kester sn62 tinning SN62 Ceramic Dielectric Axial Capacitors Glass Encapsulated CERAMICS CAPACITORS 0402 88Au novacap epoxy silver
Text: NOVACAP TECHNICAL BROCHURE O. CHIP USER GUIDELINES Multilayer ceramic capacitors are sold as chip leadless components, or as encapsulated leaded devices. Traditionally, the chip version has been used in densely packed hybrid and delay line circuits, while the
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capacitor 104 ceramic
Abstract: SN60 Capacitor Assembly MTBF multilayer ceramic capacitor Lead novacap epoxy novacap epoxy silver
Text: Polymer Termination for Y5V and Z5U Ceramic Multilayer Capacitors Contents: 1. 1. What is Mechanical Cracking? 2. Polymer Termination helps to Prevent Mechanical Cracking. 3. Standard Silver versus Polymer Termination Comparative Data for Surface Mount Applications.
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000pF
capacitor 104 ceramic
SN60
Capacitor Assembly MTBF
multilayer ceramic capacitor Lead
novacap epoxy
novacap epoxy silver
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Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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000pF
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Untitled
Abstract: No abstract text available
Text: SMT-X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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000pF
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Untitled
Abstract: No abstract text available
Text: High Reliability Chip - C0G 16Vdc to 10kVdc A range of MLC chip capacitors in Ultra stable EIA Class I C0G, or NP0, dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically
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16Vdc
10kVdc
MIL-PRF-55681,
MIL-PRF-123,
MIL-PRF-49467,
MIL-PRF-55681
MIL-PRF-123
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Untitled
Abstract: No abstract text available
Text: High Reliability Chip - C0G 16Vdc to 10kVdc A range of MLC chip capacitors in Ultra stable EIA Class I C0G, or NP0, dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected
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PDF
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16Vdc
10kVdc
MIL-PRF-55681,
MIL-PRF-123,
MILPRF-49467,
MIL-PRF-55681
MIL-PRF-123
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Untitled
Abstract: No abstract text available
Text: High Reliability Chip - X7R 16Vdc to 10kVdc A range of MLC chip capacitors in Stable EIA Class II dielectric with special testing for long term reliability. They are designed for optimum reliability; burned in at elevated voltage and temperature, and 100% physically and electrically inspected
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Original
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PDF
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16Vdc
10kVdc
MIL-PRF-55681,
MIL-PRF-123,
MIL-PRF-49467,
MIL-PRF-55681
MIL-PRF-123
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Untitled
Abstract: No abstract text available
Text: SMT-X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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PDF
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000pF
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Untitled
Abstract: No abstract text available
Text: SMT-X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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PDF
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000pF
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563 j 400v
Abstract: No abstract text available
Text: SMT-X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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PDF
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000pF
563 j 400v
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Untitled
Abstract: No abstract text available
Text: SMT-X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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PDF
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000pF
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Untitled
Abstract: No abstract text available
Text: SMT- X7R DIELECTRIC Stable EIA Class II dielectric, with +/-15% temperature coefficient and predictable variation of electrical properties with time, temperature and voltage.These chips are designed for surface mount application with nickel barrier terminations suitable for solder wave, vapor phase or reflow solder board attachment. Also available in silver-palladium
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Original
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000pF
90Sn/10Pb)
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Untitled
Abstract: No abstract text available
Text: SMT-COG DIELECTRIC Ultra stable Class I dielectric EIA COG or NPO: linear temperature coefficient, low loss, stable electrical properties with time, voltage and frequency. Designed for surface mount application with nickel barrier termination suitable for solder wave, vapor phase or reflow solder board attachment. Also available with silver-palladium terminations for hybrid use with conductive epoxy.
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