NITTO MP8000CH4 Search Results

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Catalog Datasheet	MFG & Type	PDF	Document Tags
PCN0702 Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line	Original	PDF	PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg
PCN0801 Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4 Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera	Original	PDF	PCN0801 PCN0801; PCN0801 hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
8361J Abstract: mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700 Text: February 24, 2005 CN 022405 Customer Notification Assembly Subcontractor Change for QFP and PLCC Packaged Devices Dear Valued Customer: This notification is for the purpose of informing you of a change by Mindspeed Technologies in the packages used for the following devices:	Original	PDF	CX28392-25 CX28394-25 CX28342-11 CX28343-11 CX28344-11 R6786-24 28XXX-PCN-002-A 8361J mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
mp8000 Abstract: MP8000CH4-A2 CY62128-SC 8361H JESD22 MP8000CH4 Text: Cypress Semiconductor Qualification Report QTP# 99412 VERSION 1.0 October, 1999 32 Ld, 450 mil SOIC Package Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor	Original	PDF	400-mil 450-mil MP8000CH4-A2 8361H CY62128-SC 619922743M 619922743M2 mp8000 MP8000CH4-A2 CY62128-SC 8361H JESD22 MP8000CH4
nitto 201 Abstract: mp8000ch4 8361H CY62128B MP8000CH4-A2 MP8000C 7C62128 Text: Cypress Semiconductor Technology Derivative Qualification Report QTP# 99396 VERSION 1.2 November, 2000 R52LD-5R Technology Fab 4 Cypress CY62128B 128K x 8 Static RAM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069	Original	PDF	R52LD-5R CY62128B CY62128B-ZAC CY62128B-SC nitto 201 mp8000ch4 8361H CY62128B MP8000CH4-A2 MP8000C 7C62128
CY62128-SC Abstract: mp8000ch4 mp8000ch4-a2 Nitto* mp8000ch4 8361H CY62148 JESD22 Text: Cypress Semiconductor Package Qualification Report QTP# 002605 VERSION 1.0 December, 2000 32.45-lead Plastic Small Outline Package SOIC Level 3 Cypress Philippines (CSPI-R) CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director	Original	PDF	45-lead CY62148 CY62128-SC 619922743M CY62128-SC mp8000ch4 mp8000ch4-a2 Nitto* mp8000ch4 8361H CY62148 JESD22