datecode
Abstract: DS2181 DS2164Q DS2165Q DS1212Q DS1284Q DS1285Q DS2130Q DS2167Q MP8000C
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: April 23rd , 1999 Subject: PRODUCT CHANGE NOTICE - D92301 Description: Qualification of Nitto MP8000C Mold Compound for 28 and 32 L PLCC Packages
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D92301
MP8000C
DS1212Q,
DS1262Q,
DS1284Q,
DS1285Q,
DS2130Q,
DS2132Q,
DS2164Q,
datecode
DS2181
DS2164Q
DS2165Q
DS1212Q
DS1284Q
DS1285Q
DS2130Q
DS2167Q
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M24C16K
Abstract: Nitto MP8000 QREE0016 Nitto MP8000 601 so8
Text: QREE0016 QUALIFICATION REPORT MP8000 Mold Compound SO8 Shenzhen THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO8 package Small Outline Package in Shenzhen plan. This
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QREE0016
MP8000
R99008)
M24C16K
M24C08L
M24256N
M24C16K
Nitto MP8000
QREE0016
Nitto
601 so8
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Nitto
Abstract: CY7C199 JESD22
Text: Qualification Report August 1996, QTP# 96114, Version 1.0 NITTO LOW ALPHA MOLDING COMPOUND PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:
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CY7C199
28-pin,
300-mil
7C199C
0075V)
CY7C199-VC
85C/85
Nitto
CY7C199
JESD22
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MP8000
Abstract: MP-8000 Nitto MP8000 QREE0023 mold compound
Text: QREE0023 QUALIFICATION REPORT MP8000 Mold Compound SO14 Muar THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify new Nitto Mold Compound called MP8000 used on SO14 package Small Outline Package in Muar plan. This material
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QREE0023
MP8000
R99008)
M93CS66F
M93CS66F
MP-8000
Nitto MP8000
QREE0023
mold compound
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Nitto
Abstract: MOLDING MATERIAL MP8000 Nitto MP 8000 MP-8000 JEDEC22 mp8000 Nitto MP8000 CY7C611 84-1lmis JESD22
Text: Cypress Semiconductor Qualification Report QTP# 98422 VERSION 1.0 May, 1999 Nitto MP-8000 Molding Compound 160 Ld Plastic Quad Flat Pack PQFP (CY7C611) Asat, Hong Kong Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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MP-8000
CY7C611)
MP-8000
CY7C611A-NC
JEDEC22
30C/60
Nitto
MOLDING MATERIAL MP8000
Nitto MP 8000
mp8000
Nitto MP8000
CY7C611
84-1lmis
JESD22
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MP8000CH
Abstract: MP8000C 8361H MP800 CY7C373I-JC JESD22 nitto chip Nitto
Text: Cypress Semiconductor Package Qualification Report QTP# 000102 VERSION 1.0 March, 2000 84 Lead Plastic Leaded Chip Carrier NITTO 8000CH Molding Compound Level 3 Anam-Manila, Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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8000CH
MP8000CH
37KPHIL-M
CY7C373I-JC
30C/60
MP8000C
8361H
MP800
CY7C373I-JC
JESD22
nitto chip
Nitto
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PCN0310
Abstract: EME-6300 MP-8000 MP8000 Nitto MP 7000 ASE QFP 8000 Series mold compound EME6300 Nitto MP 8000
Text: PROCESS CHANGE NOTICE PCN0310 MOLD COMPOUND CHANGE FOR 100 LEAD QFP PACKAGE Change Description: ASE Malaysia will be extending the use of Nitto’s MP-8000 series mold compound to Altera’s 100 lead Quad Flat Package. Currently this package is using Sumitomo’s EME-6300 series
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PCN0310
MP-8000
EME-6300
MP8000
PCN0310
Nitto MP 7000
ASE QFP
8000 Series
mold compound
EME6300
Nitto MP 8000
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Nitto MP8000
Abstract: Nitto ON SEMICONDUCTOR TRACEABILITY MP180S mp8000 MP-8000 TO220 Semiconductor Packaging DS1821 package to220 PHILIP
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: January 18, 1999 Subject: PRODUCT CHANGE NOTICE – A001801 Description: Qualification of MP8000 for TO220
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A001801
MP8000
MP180S
MP8000.
DS1633
DS1821
Nitto MP8000
Nitto
ON SEMICONDUCTOR TRACEABILITY
MP-8000
TO220 Semiconductor Packaging
DS1821
package to220
PHILIP
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Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077,
JESD78,
Sumitomo G700K
sumitomo 6600h
Compound c7025
JESD22-B101
Nitto MP8000
G700K
SUMITOMO-G600
epoxy 8290
ablebond ablestik 8290
SUMITOMO g600 UL
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Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086,
JESD78,
Nitto MP8000
Sumitomo G700K
g700k
JESD78
JESD-78
sumitomo 6600h
ablebond ablestik
BCB4026
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Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1094L,
JESD78,
Sumitomo G700K
SUMITOMO g600
Ablestik 84-1
sumitomo 6600h
G700K
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PCN0702
Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line
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PCN0702
PCN0702,
6300HJ
G700M
PCN0702
MP8000CH4
48hrs)
X10-5
UL-94
SUMITOMO G700
SUMITOMO G600
SUMITOMO EME G700
sumitomo 6300h mold compound
SUMITOMO EME G600
EME G600
material properties G600 mold compound
sumitomo G700 Tg
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ABLEBOND
Abstract: No abstract text available
Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1086L,
JESD78,
ABLEBOND
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G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1077L,
JESD78,
G700K
Nitto MP8000
Sumitomo G600
Sumitomo G700K
JESD78
sumitomo 6600h
Compound c7025
JESD-78
BCB4026
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1818, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1818,
JESD78,
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mark a7 sot23
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1815, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1815,
JESD78,
mark a7 sot23
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Ablebond 84-1 LMISR4
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1812, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1812,
JESD78,
Ablebond 84-1 LMISR4
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Untitled
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1813, Rev A6 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1813,
JESD78,
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EME-6300
Abstract: Nitto MP8000 EME6300 MP8000 MP-8000 On semiconductor SOIC Traceability DALLAS SOIC PRODUCT CHANGE
Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: June 29, 2000 Subject: PRODUCT CHANGE NOTICE – F001601 Description: SOIC Mold Compound Change to MP8000
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F001601
MP8000
EME6300
MP8000.
EME-6300
Nitto MP8000
MP8000
MP-8000
On semiconductor SOIC Traceability
DALLAS SOIC PRODUCT CHANGE
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mark a7 sot23
Abstract: J-STD-20A atec 6710S CDA194 mp8000
Text: 08/23/2004 RELIABILITY REPORT FOR DS1816, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1816,
JESD78,
mark a7 sot23
J-STD-20A
atec
6710S
CDA194
mp8000
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CDA194
Abstract: mark a7 sot23
Text: 08/23/2004 RELIABILITY REPORT FOR DS1810, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1810,
JESD78,
CDA194
mark a7 sot23
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LMISR4
Abstract: No abstract text available
Text: 08/23/2004 RELIABILITY REPORT FOR DS1811, Rev A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS1811,
JESD78,
LMISR4
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PCN0801
Abstract: hitachi epoxy en4900 Ablestik 8290 en4900 EN-4900 hitachi en4900 epcs1n Nitto* mp8000ch4 epoxy 8290 mp8000ch4
Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0801 ALTERNATIVE MANUFACTURING SITE FOR EPCS FAMILY Change Description This is an update to PCN0801; please see the revision history table for information specific to this update. Altera introduced Amkor Philippines as an alternative assembly manufacturing site for the Altera
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PCN0801
PCN0801;
PCN0801
hitachi epoxy en4900
Ablestik 8290
en4900
EN-4900
hitachi en4900
epcs1n
Nitto* mp8000ch4
epoxy 8290
mp8000ch4
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capacitor vehicle mttf
Abstract: J-STD-020 S9730 ablebond 293 Nitto
Text: 05/27/2002 RELIABILITY REPORT FOR DS2153, A7 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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DS2153,
MIL-STD-883-2004
capacitor vehicle mttf
J-STD-020
S9730
ablebond 293
Nitto
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