104 k 100
Abstract: RN73
Text: RESISTORS FLAT CHIP METAL THIN FILM PRECISION RN73 STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu) End termination (Ni Cr) Protective coat Ni Barrier Solder Plating IDENTIFICATION COATING
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D-25578
104 k 100
RN73
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PDF
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RN73
Abstract: K 511
Text: RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP METAL THIN FILM PRECISION RN73 STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu) End termination (Ni Cr) Protective coat Ni Barrier Solder Plating
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PDF
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RN73
Abstract: 104k100 104 k 100
Text: RESISTORS RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP METAL THIN FILM PRECISION RN73 STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu) End termination (Ni Cr) Protective coat Ni Barrier Solder Plating
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Original
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D-25578
RN73
104k100
104 k 100
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PDF
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RN73
Abstract: No abstract text available
Text: RESISTORS RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP METAL THIN FILM PRECISION RN73 STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu) End termination (Ni Cr) Protective coat Ni Barrier Solder Plating
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Original
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D-25578
RN73
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PDF
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Untitled
Abstract: No abstract text available
Text: RESISTORS TECHNOLOGY OF TOMORROW FLAT CHIP METAL THIN FILM PRECISION RN73 STRUCTURE 1 2 3 4 5 6 7 8 Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu) End termination (Ni Cr) Protective coat Ni Barrier Sn-Pb Plating IDENTIFICATION
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Original
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D-25578
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PDF
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RN73H
Abstract: 47 k resistor color RN73H2A
Text: RESISTORS FLAT CHIP METAL THIN FILM PRECISION HIGH HEAT RESISTANT RN73H STRUCTURE 1 2 3 4 5 6 7 8 W NE Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu) End termination (Ni Cr) Special protective coating Ni Barrier Solder Plating (sn)
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Original
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RN73H
RN73H
D-25578
47 k resistor color
RN73H2A
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PDF
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RN73H
Abstract: RC-2133A E192 2133A 510k10 RN73H2B
Text: RESISTORS METAL THIN FILM PRECISION HIGH HEAT RESISTANT RN73H RESISTORS FLAT CHIP STRUCTURE W NE 1 2 3 4 5 6 7 8 Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu) End termination (Ni Cr) Special protective coating
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Original
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RN73H
RN73H
D-25578
RC-2133A
E192
2133A
510k10
RN73H2B
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PDF
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AR02
Abstract: No abstract text available
Text: Thin Film Precision Chip Resistor－AR Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 871 7 8 9 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 2 Resistor Layer (NiCr)
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Original
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1000pcs)
AR02
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PDF
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Untitled
Abstract: No abstract text available
Text: Anti-Corrosive Thin Film Precision Chip Resistor－PR Series •Construction L D1 W 3 4 5 6 T 9871 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 2 7 8 9 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) Resistor Layer (NiCr)
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viking AR
Abstract: AR01 AR12 sn78
Text: Thin Film Precision Chip Resistor－AR Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 871 7 8 9 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 2 Resistor Layer (NiCr)
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Original
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PDF
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Untitled
Abstract: No abstract text available
Text: Thin Film Precision Chip Resistor－RN Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 871 7 8 9 2 Resistor Layer (NiCr)
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Original
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1000pcs)
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PDF
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RN06
Abstract: 4R70 RN20 resistor 5W 1Ohm RN06B
Text: Thin Film Precision Chip Resistor－RN Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 871 7 8 9 2 Resistor Layer (NiCr)
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Original
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1000pcs)
RN06
4R70
RN20
resistor 5W 1Ohm
RN06B
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PDF
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Untitled
Abstract: No abstract text available
Text: Thin Film Precision Chip Resistor－RN Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 871 7 8 9 2 Resistor Layer (NiCr)
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Original
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PDF
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Untitled
Abstract: No abstract text available
Text: Thin Film Precision Chip Resistor－RN Series •Construction L D1 W 3 4 5 6 T 9 D2 1 Alumina Substrate 2 Bottom Electrode Ag 3 Top Electrode (Ag-Pd) 4 5 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 871 7 8 9 2 Resistor Layer (NiCr)
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Original
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1000pcs)
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PDF
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Untitled
Abstract: No abstract text available
Text: Thin Film Current Sensing Chip Resistor－TCS Series •Construction L D1 W 3 4 5 6 T 98 7 1 2 D2 1 Alumina Substrate 4 Bottom Electrode Ag 2 5 3 Top Electrode (Ag-Pd) 6 Edge Electrode (NiCr) Barrier Layer (Ni) External Electrode (Sn) 7 8 9 Resistor Layer (NiCr)
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Original
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TCS02
TCS10
TCS12
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PDF
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RN73 marking
Abstract: E192 RN73
Text: FLAT CHIP METAL THIN FILM PRECISION RN73 STRUCTURE IDENTIFICATION COATING COLOR RN73 1E Black RN73 1J Green RN73 2A . 2E * Red marking for T.C.R ± 5 and ±10 ppm/K TYPE 1 2 3 4 5 6 7 8 Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu)
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Original
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D-25578
RN73 marking
E192
RN73
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PDF
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RN73S
Abstract: RN73 KOA RN73 E192
Text: FLAT CHIP METAL THIN FILM PRECISION RN73 STRUCTURE IDENTIFICATION COATING COLOR RN73 1E Black RN73 1J Green RN73 2A . 2E * Red marking for T.C.R ± 5 and ±10 ppm/K TYPE 1 2 3 4 5 6 7 8 Ceramic substrate NiCr Thin film Top termination Cr Ni Cu Bottom termination (Cr Ni Cu)
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Original
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RN73S
RN73S-series
D-25578
RN73S
RN73
KOA RN73
E192
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PDF
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Untitled
Abstract: No abstract text available
Text: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au planted terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC
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Original
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25ppm/
RNCW0201
RNCW0402
100KR
100ppm
50ppm
25ppm
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PDF
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Untitled
Abstract: No abstract text available
Text: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au planted terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC
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Original
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25ppm/
RNCW0201
RNCW0402
100KR
100ppm
50ppm
25ppm
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PDF
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Untitled
Abstract: No abstract text available
Text: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au planted terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC
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Original
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25ppm/
RNCW0201
RNCW0402
100KR
100ppm
50ppm
25ppm
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PDF
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Untitled
Abstract: No abstract text available
Text: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au plated terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC
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Original
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25ppm/Â
RNCW0201
RNCW0402
RNCW0603
100ppm
50ppm
25ppm
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PDF
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Untitled
Abstract: No abstract text available
Text: RNCW Series Stackpole Electronics, Inc. Thin Film Wirebondable Chip Resistor Features: • • • • • • Resistive Product Solutions Thin film passivated NiCr resistive element with Ni/Au planted terminations Tolerance as low as 0.1% Extremely low TCR down to ±25ppm/ºC
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Original
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25ppm/Â
RNCW0201
RNCW0402
RNCW0603
100ppm
50ppm
25ppm
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PDF
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475 50K 536
Abstract: E-96 Multiplier Code TR0603 226 25K 226 20K 340
Text: Thin Film Chip Resistor—TR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (NiCr) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Epoxy) 4 Barrier Layer (Ni) 8 Marking ■ Application — Medical equipments, Military equipments
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Original
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10ppm,
25ppm,
50ppm
475 50K 536
E-96 Multiplier Code
TR0603
226 25K
226 20K 340
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PDF
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106 25K 810 resistor
Abstract: TR2512 25PPM marking CODE 001 475 50K 249
Text: Thin Film Chip Resistor—TR Series • Construction 1 Alumina Substrate 5 External Electrode Sn 2 Bottom Electrode (Ag) 6 Resistor Layer (NiCr) 3 Top Electrode (Ag/Pd) 7 Primary Overcoat (Epoxy) 4 Barrier Layer (Ni) 8 Marking ■ Application — Medical equipments, Military equipments
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Original
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10ppm,
25ppm,
50ppm
106 25K 810 resistor
TR2512
25PPM
marking CODE 001
475 50K 249
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PDF
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