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Catalog Datasheet	MFG & Type	PDF	Document Tags
prtr5v0u6s Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY Text: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years	Original	PDF	2002/95/EC. PMBTA42 PMEG3005EL PMEG6010EP PMR780SN PTVS12VS1UR PZU13y PMBTA42DS PMEG3005ET PMEG6010ER prtr5v0u6s csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
SOD87 Abstract: SOD87 footprint Diode zener smd d8 Zener diode smd marking 18 diode snubber sod-87 Diode zener smd SOD87 zener smd marking 2x flyback snubber marking D9 zener diode Text: Philips Semiconductors Philips Semiconductors continues to lead the way in cutting-edge package options which meet demands for ever greater performance from continually smaller housings.With the SOD87 SMD diode power package, designers now have the ultimate combination of	Original	PDF	OD87e MSD894) SOD87 SOD87 footprint Diode zener smd d8 Zener diode smd marking 18 diode snubber sod-87 Diode zener smd SOD87 zener smd marking 2x flyback snubber marking D9 zener diode
land pattern for sot109-1 Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products	Original	PDF	DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint
SOD80 footprint Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint Text: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD	Original	PDF	MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
SOD80 footprint Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus Text: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components	Original	PDF	MSB461 OT163-1) MLC745 SOD80 footprint SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
TRANSISTOR SMD CODE PACKAGE SOT89 52 10A Abstract: smd transistor g1-L philips ic06 cmos databook Soldering guidelines and SMD footprint design MSB430 Philips Components, Soft Ferrites Data Handbook M display dc05 humidity sensor philips H1 soft ferrites philips handbook Philips Components, Soft Ferrites Data Handbook Text: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii	Original	PDF
SOD87 footprint Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint Text: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999	Original	PDF	MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
TRANSISTOR S1A 64 smd Abstract: SSOP14 land pattern ip4065cx11 KYS 30-40 4440 IC 5.1 audio amplifier board nx1117 PHD78NQ 1n4148 sod323 t4 NX1117I33Z PMEG3030 Text: Discrete Semiconductors Selection Guide 2010 Diodes, transistors, ESD and signal conditioning devices Excellence in portfolio and performance Diodes Introducing new package technology Page 7 Portable and increasingly smaller end products fuel the race towards more sophisticated functionality in smaller form	Original	PDF	OT1061 OT1118 PSSI2021SAY PTVS10VP1UP TRANSISTOR S1A 64 smd SSOP14 land pattern ip4065cx11 KYS 30-40 4440 IC 5.1 audio amplifier board nx1117 PHD78NQ 1n4148 sod323 t4 NX1117I33Z PMEG3030
w2 mark 5 pin mosfet smd Abstract: Philips SC07 Small-signal Transistors transistor bf 175 Text: For an update of this information, please go to the package website. SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii	Original	PDF