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    MQFP-256 PACKAGE Search Results

    MQFP-256 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    MQFP-256 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    7404

    Abstract: MQFP Tray 28 QFP JEDEC tray 32MM
    Text: UNIT : mm HEAT PROOF 7 PPE A' 32.8 37.02 74.04 30.93 MQFP 28 x 28 3.2mm 135.9 A 32.8 37.02 27.93 259.14 315.0 322.6 SECTION A-A' 32.8 3.82 6.35 7.62 27.3 Applied Package 208-pin Plastic QFP (Fine Pitch) (3.2mm thick) 256-pin Plastic QFP (Fine Pitch) (3.2mm thick)


    Original     		PDF 208-pin 256-pin 7404 MQFP Tray 28 QFP JEDEC tray 32MM

    LD 337

    Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
    Text: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material


    Original     		PDF

    kovar

    Abstract: AT7910 AT7911 at7912 AT7913 ATF280 AT68166 TSC21020 256 AT697 7544B
    Text: Package Thermal Characteristics in a Space Environment Space Products 1. Introduction The thermal performance of semiconductor packages is a very important parameter to be taken in consideration when designing an application board. Indeed, the reliability


    Original     		PDF 7544B kovar AT7910 AT7911 at7912 AT7913 ATF280 AT68166 TSC21020 256 AT697

    MO-112

    Abstract: MS-029 MATRIX TRAY MS-022 LD240
    Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced


    Original     		PDF

    MO-112

    Abstract: MS-022 MS-029 DS250G JEDEC standard 033
    Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,


    Original     		PDF

    7544A

    Abstract: AT17LV010 AT28C010 AT60142 TSC695 kovar thermocouple kovar MQFP256
    Text: Package Thermal Characteristics in a Space Environment Space Products 1. Introduction The thermal performance of semiconductor packages is a very important parameter to be taken in consideration when designing an application board. Indeed, the reliability


    Original     		PDF

    MS-029

    Abstract: 144 QFP body size amkor
    Text: LEADFRAME data sheet MQFP PowerQuad 4 Features MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit


    Original     		PDF out029 MS-029/022 MS-029 144 QFP body size amkor

    MQFP352

    Abstract: 81F64842B k9 diode MQFP84
    Text: 68 pins MQFPF Multilayer Quad Flat Pack MQFP Package Outlines Code: KM Date: 03/08/95 Rev B – 23-Aug-01 1 MQFP 84 pins MQFPF (0.65 inch square) Code: K6 Date: 20/07/99 2 Rev B – 23-Aug-01 84 pins MQFPF (1.15 inch square) Code: K2 Date: 22/09/98 3 MQFP


    Original     		PDF 23-Aug-01 19use MQFP352 81F64842B k9 diode MQFP84

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA

    MACH4A

    Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
    Text: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size


    Original     		PDF 208-Ball 256-Ball 100-Ball 49-Ball 144-Ball 100-Pin 128-Pin 48-Pin 44-Pin 144-Pin MACH4A JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384

    outline of the heat slug for JEDEC

    Abstract: heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor
    Text: LEADFRAME data sheet MQFP PowerQuad 4 Features: MQFP PowerQuad® 4 Packages: Systems and applications that operate at moderate levels of power need more power performance than QFPs can deliver. Amkor has developed a low cost package system, available in QFP format, to better suit


    Original     		PDF MS-029/022 outline of the heat slug for JEDEC heat slug for JEDEC JEDEC Matrix Tray outlines MS-029 QFP JEDEC tray amkor exposed pad 245C amkor

    MS-029

    Abstract: JEDEC Matrix Tray outlines MS-022 copper heatsink prime power 1230 JEDEC standard 033 MS029
    Text: LEADFRAME data sheet MQFP PowerQuad 2 Features: MQFP PowerQuad® 2 Packages: The MQFP PowerQuad® 2 PQ2 is patented, advanced IC packaging technology with excellent attributes in thermal and electrical performance. Extraordinary gains in power dissipation and speed are achieved through


    Original     		PDF

    ADUC836

    Abstract: MQFP MQFP 52 PACKAGE AD7706 AD7731 AD7853
    Text: uCONVETERS MODEL ADuC812 ADuC831 ADuC832 ADuC824 ADuC834 ADuC816 ADuC814 ADuC814 ADuC836 Core Core Processor A/D 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 Date Printed 8/20/02 AD7853 8ch AD7853 8ch AD7853 8ch AD7731+AD7706 AD7731+AD7706


    Original     		PDF ADuC812 ADuC831 ADuC832 ADuC824 ADuC834 ADuC816 ADuC814 ADuC836 AD7853 ADUC836 MQFP MQFP 52 PACKAGE AD7706 AD7731

    8052 instruction set

    Abstract: 8052 microcontroller ADuC7000 8052 Tutorial arm7 tdmi 5 ADUC845 rbs element manager 8052 microcontroller philips 8052 microcontroller philips 25 mips architecture of 8052
    Text: Precision Analog Microcontrollers Features • Microcontrollers for industrial, instrumentation, communications, and automotive applications • Leading-edge, mixed-signal integration, high performance, low cost, and small packaging • ARM7TDMI 45 MHz ,


    Original     		PDF 12-bit 24-bit BR04809-6-3/04 8052 instruction set 8052 microcontroller ADuC7000 8052 Tutorial arm7 tdmi 5 ADUC845 rbs element manager 8052 microcontroller philips 8052 microcontroller philips 25 mips architecture of 8052

    3256E

    Abstract: LATTICE 3000 family architecture
    Text: Introduction to ispLSI 3000 Family ispLSI 3000 Family Introduction Lattice Semiconductor Corporation’s ispLSI 3000 Family brings high density, high performance and JTAG testability to complex PLDs. This family is ideal for high density designs, where integration of complete logic subsystems


    Original     		PDF 160-Pin 432-Pin 208-pin 240-pin 304-pin 432-ball 272-ball 3256E LATTICE 3000 family architecture

    interface 8254 with 8086

    Abstract: microprocessors interface 8253 "Real Time Clock" HSP50415 8089 microprocessor Features video of 8086 microprocessor pin crystal oscillator 8MHz 4 pins cic compensation filters ISL5217 HSP43124 HSP43168
    Text: Digital ICs 6 2006 P RODUCT S ELECTION GUIDE Digital ICs pg. 6-1 Demodulators (pg. 6-2) Parallel EEPROM (pg. 6-3) Data Communication (pg. 6-4) Digital Filters (pg. 6-2) Memory/883 (pg. 6-3) LCD and LED Display Drivers (pg. 6-4) Down Converters (pg. 6-2)


    Original     		PDF Memory/883 1-888-Icroprocessors CDP68HC68T1 82C52 16MHz HD-6402 1-888-INTERSIL interface 8254 with 8086 microprocessors interface 8253 "Real Time Clock" HSP50415 8089 microprocessor Features video of 8086 microprocessor pin crystal oscillator 8MHz 4 pins cic compensation filters ISL5217 HSP43124 HSP43168

    64Kx8 CMOS RAM

    Abstract: oki 80C88 256X4 CMOS RAM 4702 8089 bus oki 82c54 lcd 4x20 CSP-28 display lcd 4x20 interface 8254 with 8086
    Text: Digital ICs 7 2009 P RODUCT S ELECTION GUIDE Digital ICs pg. 7-1 Micro P/C (pg. 7-4) Demodulators (pg. 7-2) Parallel EEPROM (pg. 7-3) Data Communication (pg. 7-4) Digital Filters (pg. 7-2) Memory/883 (pg. 7-3) LCD and LED Display Drivers (pg. 7-4) Down Converters


    Original     		PDF Memory/883 1-888-INTERSIL 82C52 16MHz Generator-72 HD-6402 64Kx8 CMOS RAM oki 80C88 256X4 CMOS RAM 4702 8089 bus oki 82c54 lcd 4x20 CSP-28 display lcd 4x20 interface 8254 with 8086

    LATTICE 3000 family architecture

    Abstract: 3256E LATTICE 3000 family speed performance of Lattice - PLSI Architecture
    Text: Introduction to ispLSI 3000 Family ispLSI 3000 Family Introduction Lattice Semiconductor Corporation’s ispLSI 3000 Family brings high density, high performance and JTAG testability to complex PLDs. This family is ideal for high density designs, where integration of complete logic subsystems


    Original     		PDF 160-Pin 304-Pin LATTICE 3000 family architecture 3256E LATTICE 3000 family speed performance of Lattice - PLSI Architecture

    ATF280F

    Abstract: ATF280F-DK352 ATF280F-YF-E ATF280F-2J-E 32X4 IO937 ATF280F-DK U1 V1 and W1 is delta connections ATF280F-YF-MQ 115kBits
    Text: ATF280F Features • SRAM based FPGA designed for Space use • • • • • • • • • • • • • • • – 280K equivalent ASIC gates – 14 400 Cells two 3-input LUT or one 4-input LUT, one DFF – Unlimited reprogrammability – SEE hardened (Configuration RAM, FreeRAMTM, DFF, JTAG, I/O buffers)


    Original     		PDF ATF280F 7750D ATF280F-DK352 ATF280F-YF-E ATF280F-2J-E 32X4 IO937 ATF280F-DK U1 V1 and W1 is delta connections ATF280F-YF-MQ 115kBits

    LATTICE plsi 3000

    Abstract: speed performance of Lattice - PLSI Architecture 3256E LATTICE 3000 family architecture
    Text: Introduction to ispLSI and pLSI 3000 Family ® ispLSI and pLSI 3000 Family Introduction Lattice Semiconductor Corporation’s LSC ispLSI and pLSI families are high-density and high-performance E2CMOS ® programmable logic devices. They provide design engineers with a superior system solution for


    Original     		PDF 160-Pin 304-Pin LATTICE plsi 3000 speed performance of Lattice - PLSI Architecture 3256E LATTICE 3000 family architecture

    FPQ 208 0.5 10

    Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
    Text: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch


    Original     		PDF AC700V AC500V FPQ-44-0 FPQ-44-0. FPQ 208 0.5 10 FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64

    MCGA352

    Abstract: IO383 IO385 IO393 IO639 MQFP-256 IO939 AT58KRHA IO437 IO365
    Text: ATF280FFeatures • SRAM based FPGA designed for Space use • • • • • • • • • • • • • • • – 280K equivalent ASIC gates – 14 400 Cells two 3-input LUT or one 4-input LUT, one DFF – Unlimited reprogrammability – SEE hardened (Configuration RAM, FreeRAMTM, DFF, JTAG, I/O buffers)


    Original     		PDF ATF280FFeatures 7750C MCGA352 IO383 IO385 IO393 IO639 MQFP-256 IO939 AT58KRHA IO437 IO365

    transistor npn 4-071

    Abstract: SIN16 Power MOSFET Selection Guide TRANSISTOR FOR 10GHz oscillator CA3081 CFB600 mosfet selection guide CA3146 NPN
    Text: A/D CONVERTERS PART NO. DESCRIPTION RESO­ CONVER­ LUTION SION RATE BITS (MIN) (MSPS) BAND­ WIDTH (MHz) SINAD A T f,„ (dB) DIFF. GAIN (%) DIFF. PHASE (DEG.) POWER DISSIPATION (mW) LOGIC TYPE SUPPLY VOLTAGE PACKAGE OPTIONS (V) (NOTE 1) (NOTE 2) TEMP. AnswerFAXSM EVAL


    OCR Scan     		PDF HI5710A HI5746 HI5703 HI5766 HI5800 HI5804 HIS805 HI5808 12-Bit 10MHz transistor npn 4-071 SIN16 Power MOSFET Selection Guide TRANSISTOR FOR 10GHz oscillator CA3081 CFB600 mosfet selection guide CA3146 NPN

    ispLSI 3000

    Abstract: No abstract text available
    Text: Lattice •■■■■■ Semiconductor ■■■■■■ Corporation Introduction to ispLSI* 3000 Family Introduction ispLSI 3000 Family Lattice Semiconductor Corporation’s ispLSI 3000 Family brings high density, high performance and JTAG testabil­ ity to complex PLDs. This family is ideal for high density


    OCR Scan     		PDF 160-Pin 432-Pin 32S6E 208-pin 240-pin 304-pin 432-ball ispLSI 3000