90Pb 10Sn solder paste
Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA
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25x25x1
90Pb 10Sn solder paste
97Pb
BGA OUTLINE DRAWING
ceramic rework
BGA PROFILING
BGA Solder Ball collapse
fine BGA thermal profile
pcb warpage in ipc standard
bga rework
CBGA motorola
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MC71000
Abstract: MC9328MX1 MMM7400 MC9328 MOTOROLA RF MODULE motorola ltcc
Text: Freescale Semiconductor, Inc. Fact Sheet ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 MMM7400 WIRELESS RF DATA TRANSCEIVER ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 Freescale Semiconductor, Inc. OVERVIEW DESIGN CHALLENGES The primary advantage of using LTCC is the ability to
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MMM7400
MMM7400
MC71000)
MMM7400)
MC71000
MMM7400FACT/D
MC71000
MC9328MX1
MC9328
MOTOROLA RF MODULE
motorola ltcc
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circuit diagram of Zigbee Based Wireless
Abstract: circuit diagram wireless camera transmitter gsm door lock circuit diagram circuit diagram of wireless door lock system GSM home automation block diagram GSM home automation circuit diagram voice usage to charge mobile phones block diagram schematic diagram of bluetooth headphone i-300 gsm modem datasheet dvr 16 channel dvs
Text: WIRELESS & MOBILE PORTFOLIO Your Key to Next-Generation Communications Wireless & Mobile Portfolio Your Key to Next-Generation Communications Table of Contents Wireless & Mobile Portfolio Your Key to Next-Generation Communications Cellular Platforms Page 3
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BR1904/D
circuit diagram of Zigbee Based Wireless
circuit diagram wireless camera transmitter
gsm door lock circuit diagram
circuit diagram of wireless door lock system
GSM home automation block diagram
GSM home automation circuit diagram
voice usage to charge mobile phones block diagram
schematic diagram of bluetooth headphone
i-300 gsm modem datasheet
dvr 16 channel dvs
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ceramic rework
Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability
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25x25x1
ceramic rework
CCGA
BGA Solder Ball collapse
90Pb 10Sn solder paste
304-pin ltcc
MPC105
MPC106
MPC107
BGA PROFILING
spray nozzles
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dupont 951
Abstract: heraeus Ericsson antennas ltcc nokia 6080 MIL-QUALIFIED Motorola IPC-M103 dupont 943 IPC-M-103
Text: FREQUENTLY ASKED QUESTIONS FOR LTCC VENDORS Answers for National Semiconductor’s Process December 11, 1998. General Notes: • The frequently asked question set that follows is very comprehensive and is intended to help a customer adequately assess National Semiconductor as an LTCC vendor.
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EGR Valve Position Sensor
Abstract: Throttle PEDAL Position Sensor RESISTOR 552-1997 miniature mass air flow sensor CTS Series 280 Rotary Potentiometer hudson industries award 586 CTS RESISTOR NETWORK 761 CTS RESISTOR NETWORK circular connector
Text: 1 9 9 8 A N N U A L R E P O R T C O R P O R A T I O N Corporate Profile CTS Corporation designs, manufactures and sells a broad line of electronic components and electronic assemblies, primarily serving the electronic needs of original equipment manufacturers OEMs .
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DECT RF Transceiver 1.9 ghz
Abstract: Nokia 1600 mobile phone NOKIA VCO Motorola cell phone transceiver chip 100 MHz to 4 baby monitor 900mhz DECT 900MHz transceiver GFSK philips baby monitor Mobile Camera Module NOKIA philips dect
Text: Wireless Communications THE 1998 INTERNATIONAL DECT CONGRESS Examining The Latest Technological Advances in The DECT Standard Comparing The Current Status of The Different Cordless Standards Benny Madsen, National Semiconductor Corp. N THE 1998 INTERNATIONAL DECT CONGRESS
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900MHz,
DECT RF Transceiver 1.9 ghz
Nokia 1600 mobile phone
NOKIA VCO
Motorola cell phone transceiver chip 100 MHz to 4
baby monitor 900mhz
DECT
900MHz transceiver GFSK
philips baby monitor
Mobile Camera Module NOKIA
philips dect
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SIGNAL PATH designer
Abstract: MMM6025 ltcc chip advantages and disadvantage of modem freescale LTCC motorola ltcc
Text: Ne xt Gener ation Wireless Architecture A Special Series Sponsored By Freescale Semiconductor, Inc. By Nicholas Cravotta Miniaturization: Squeezing Power Amplification Out of Radio Design iniaturization has always been one of the core enablers of the cellular market; unless you drive
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motorola application notes
Abstract: AN1051 motorola motorola ltcc AVX RESISTOR NETWORK R/Motorola+801
Text: TECHNICAL INFORMATION AC TERMINATION FOR SIGNAL BUSSES by Ben Smith AVX Corporation 801 17th Avenue South Myrtle Beach, SC 29578 Office: 843 946-0504 Fax: (843) 946-0504 email: tbsmith@sccoast.net Abstract: The predominant direction of modern electronic system
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tr390
5M499-R
motorola application notes
AN1051 motorola
motorola ltcc
AVX RESISTOR NETWORK
R/Motorola+801
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Untitled
Abstract: No abstract text available
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 Multiplexer or as Stand-Alone T3 or E3 Framer Flexible Multiplexer can be Programmed for Multiple Configurations Including:
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DS3112
M13/E13/G
56-G6002-001C
V256-1*
DS3112
DS3112D1
DS3112+
DS3112N
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HT 648 decoder Rx
Abstract: g6002 t2/e2 DS3112 DS3112N GR-499-CORE BGA OUTLINE DRAWING
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 Multiplexer or as Stand-Alone T3 or E3 Framer Flexible Multiplexer can be Programmed for Multiple Configurations Including:
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DS3112
M13/E13/G
256-Ball
56-G6002-001)
HT 648 decoder Rx
g6002
t2/e2
DS3112
DS3112N
GR-499-CORE
BGA OUTLINE DRAWING
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Untitled
Abstract: No abstract text available
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 Multiplexer or as Stand-Alone T3 or E3 Framer Flexible Multiplexer can be Programmed for Multiple Configurations Including:
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DS3112
M13/E13/G
256-Ball
56-G6002-001)
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T2204
Abstract: No abstract text available
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 Multiplexer or as Stand-Alone T3 or E3 Framer Flexible Multiplexer can be Programmed for Multiple Configurations Including:
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DS3112
M13/E13/G
DS3112
DS3112D1
DS3112+
DS3112N
V256-1*
DS3112N+
56-G6002-001C
T2204
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G6002
Abstract: E3 framer with LIC DS3112 DS3112N GR-499-CORE E13-Multiplex GR-820-CORE e2 framer PE-76 Frame structure for Multiplexing of four E1 streams into E2 stream
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 Multiplexer or as Stand-Alone T3 or E3 Framer Flexible Multiplexer can be Programmed for Multiple Configurations Including:
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DS3112
M13/E13/G
256-Ball
56-G6002-001)
G6002
E3 framer with LIC
DS3112
DS3112N
GR-499-CORE
E13-Multiplex
GR-820-CORE
e2 framer
PE-76
Frame structure for Multiplexing of four E1 streams into E2 stream
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DS3112
Abstract: G747 GR-499-CORE LTCLK10 143b
Text: DALLAS SEMICONDUCTOR DS3112 TEMPE Preliminary Data Sheet V3 September 1, 1999 DALLAS SEMICONDUCTOR DS3112 TEMPE T3 E3 MultiPlexEr 3.3V T3 / E3 Framer & T1 to T3 (M13) / E1 to E3 (E13) / E1 to T3 (G.747) Multiplexer Preliminary Data Sheet Version 3 September 1, 1999
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DS3112
G747
GR-499-CORE
LTCLK10
143b
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HT 12E APPLICATION
Abstract: t2/e2 DS3112 DS3112N G747 GR-499-CORE GR-820-CORE e2 framer E19 LB2
Text: PRELIMINARY DS3112 www.dalsemi.com TEMPE T3 E3 Multiplexer 3.3V T3 / E3 Framer and M13/E13/G.747 MUX FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 multiplexer or as stand alone T3 or E3 framer Flexible multiplexer can be programmed for multiple configurations including:
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DS3112
M13/E13/G
HT 12E APPLICATION
t2/e2
DS3112
DS3112N
G747
GR-499-CORE
GR-820-CORE
e2 framer
E19 LB2
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LB1101
Abstract: LB8015 rbps2
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 multiplexer or as standalone T3 or E3 framer Flexible multiplexer can be programmed for multiple configurations including:
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M13/E13/G
LB1101
LB8015
rbps2
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LB1202
Abstract: No abstract text available
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES § § § § § § § § § § § § § § § FUNCTIONAL DIAGRAM Operates as M13 or E13 multiplexer or as standalone T3 or E3 framer Flexible multiplexer can be programmed for
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DS3112
M13/E13/G
LB1202
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CD15I
Abstract: No abstract text available
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 multiplexer or as standalone T3 or E3 framer Flexible multiplexer can be programmed for multiple configurations including:
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M13/E13/G
DS3112
DS3112,
CD15I
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Untitled
Abstract: No abstract text available
Text: DS3112 TEMPE T3 E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 MUX www.maxim-ic.com FEATURES § § § § § § § § § § § § § § § FUNCTIONAL DIAGRAM Operates as M13 or E13 multiplexer or as standalone T3 or E3 framer Flexible multiplexer can be programmed for
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M13/E13/G
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DS3112
Abstract: DS3112N GR-499-CORE
Text: DS3112 TEMPE T3/E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 Mux www.maxim-ic.com FEATURES § § § § § § § § § § § § § § § FUNCTIONAL DIAGRAM Operates as M13 or E13 multiplexer or as standalone T3 or E3 framer Flexible multiplexer can be programmed for
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DS3112
M13/E13/G
DS3112
DS3112N
GR-499-CORE
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Untitled
Abstract: No abstract text available
Text: DS3112 TEMPE T3 E3 Multiplexer 3.3V T3/E3 Framer and M13/E13/G.747 MUX www.maxim-ic.com FEATURES § § § § § § § § § § § § § § § FUNCTIONAL DIAGRAM Operates as M13 or E13 multiplexer or as standalone T3 or E3 framer Flexible multiplexer can be programmed for
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M13/E13/G
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DS3112
Abstract: DS3112N G747 GR-499-CORE LB1901 rbps2
Text: PRELIMINARY DS3112 TEMPE T3 E3 Multiplexer 3.3V T3 / E3 Framer and M13/E13/G.747 MUX www.dalsemi.com FEATURES FUNCTIONAL DIAGRAM Operates as M13 or E13 multiplexer or as stand alone T3 or E3 framer Flexible multiplexer can be programmed for multiple configurations including:
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DS3112
M13/E13/G
DS3112
DS3112N
G747
GR-499-CORE
LB1901
rbps2
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information applikation
Abstract: U880D information applikation mikroelektronik Halbleiterbauelemente DDR "Mikroelektronik" Heft u880 mikroelektronik applikation VEB mikroelektronik mikroelektronik information applikation mikroelektronik DDR
Text: i« ¡ 2 Information Applikation t m f f i ^ o e l e k t s n o •/ Information Applikation n • Heft 30: HALBLEITERSPEICHER Teil 2 SRAM und DRAM v e b halbleiterw erk frankfurfc/odor KBD im veb Kombinat mikroelektronik KAMMER DER TECHNIK Bezirksverbond
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