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    MOS 4016 R ON Search Results

    MOS 4016 R ON Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPHR7404PU Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H Visit Toshiba Electronic Devices & Storage Corporation
    MG800FXF1JMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC SBD、Low-side: SiC MOSFET Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation
    TK7R0E08QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB Visit Toshiba Electronic Devices & Storage Corporation
    XPJ1R004PB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 160 A, 0.001 Ω@10V, S-TOGL Visit Toshiba Electronic Devices & Storage Corporation

    MOS 4016 R ON Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    icl7660 harris

    Abstract: HI7188 ICL7660 ICL7660S ICL7660 equivalent
    Text: Harris Semiconductor No. AN9620 Harris Data Acquisition May 1996 Using the HI7188 with a Single Supply Author: John D. Norris Introduction ICL7660S Voltage Converter The HI7188 is an easy-to-use, 16-bit, 8-channel, sigma-delta A/D subsystem ideal for low frequency physical and electrical


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    AN9620 HI7188 ICL7660S 16-bit, 1-800-4-HARRIS icl7660 harris ICL7660 ICL7660 equivalent PDF

    TH58NVG2S3BTG00

    Abstract: th58nvg th58nvg2s3btg TH58NVG2S3 PSL 26 DIN2111 PA15 PA16 th58nvg*t TH58NVG2S3B
    Text: TH58NVG2S3BTG00 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 4 GBIT 512M x 8 BIT CMOS NAND E PROM Lead-Free DESCRIPTION The TH58NVG2S3B is a single 3.3 V 4Gbit (4,429,185,024 bits) NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as (2048 + 64) bytes × 64 pages × 4096 blocks.


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    TH58NVG2S3BTG00 TH58NVG2S3B 2112-byte 004-08-20A TH58NVG2S3BTG00 th58nvg th58nvg2s3btg TH58NVG2S3 PSL 26 DIN2111 PA15 PA16 th58nvg*t PDF

    CI 4066 vol

    Abstract: 74HCT logic family specifications HCT CMOS family characteristics 74HCMOS MGK563 hcmos family CI 4016 74HCT Logic Family Specification CMOS Logic Family Specifications F TTL family characteristics
    Text: INTEGRATED CIRCUITS DATA SHEET FAMILY SPECIFICATIONS HCMOS family characteristics March 1988 File under Integrated Circuits, IC06 Philips Semiconductors FAMILY SPECIFICATIONS HCMOS family characteristics A subset of the family, designated as XX74HCTXXXXX,


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    XX74HCTXXXXX, 74HC/HCT/HCU 74HCU 74HCT CI 4066 vol 74HCT logic family specifications HCT CMOS family characteristics 74HCMOS MGK563 hcmos family CI 4016 74HCT Logic Family Specification CMOS Logic Family Specifications F TTL family characteristics PDF

    transistor KSD1 105

    Abstract: No abstract text available
    Text: SPLC701B 11x12 and 6x12 Text and Graphics Liquid Crystal Display Controller/Driver JAN. 05, 2005 Version 1.3 Sunplus Technology reserves the right to change this documentation without prior notice. Information provided by Sunplus Technology is believed to be


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    SPLC701B 11x12 transistor KSD1 105 PDF

    KSD1 180

    Abstract: KSD1 65
    Text: SPLC701B 11x12 and 6x12 Text and Graphics Liquid Crystal Display Controller/Driver MAY. 17, 2005 Version 1.5 Sunplus Technology reserves the right to change this documentation without prior notice. Information provided by Sunplus Technology is believed to be


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    SPLC701B 11x12 KSD1 180 KSD1 65 PDF

    TC58DVM92A3TA00

    Abstract: TC58DVM92A3
    Text: TC58DVM92A3TA00 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 512-MBIT 64 M x 8 BITS CMOS NAND E PROM DESCRIPTION The device is a single 3.3 V 512-Mbit (553,648,128 bits) NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes × 32 pages × 4096 blocks. The device has a 528-byte


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    TC58DVM92A3TA00 512-MBIT 528-byte 528-byte TC58DVM92A3TA00 TC58DVM92A3 PDF

    TC58DVM92A5BAJ3

    Abstract: TC58DVM92A5 TC58DVM92A
    Text: TC58DVM92A5BAJ3 TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 512-MBIT 64M x 8 BITS CMOS NAND E PROM DESCRIPTION The device is a single 3.3 V 512Mbit (553,648,128 bit) NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes × 32 pages × 4096 blocks. The device has a 528-byte static


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    TC58DVM92A5BAJ3 512-MBIT 512Mbit 528-byte TC58DVM92A5BAJ3 TC58DVM92A5 TC58DVM92A PDF

    TC58DYM92A5TAI0

    Abstract: No abstract text available
    Text: TC58DYM92A5TAI0 TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 512-MBIT 64M x 8 BITS CMOS NAND E PROM DESCRIPTION The device is a single 1.8 V 512Mbit (553,648,128 bit) NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes × 32 pages × 4096 blocks. The device has a 528-byte static


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    TC58DYM92A5TAI0 512-MBIT 512Mbit 528-byte TC58DYM92A5TAI0 PDF

    TC58DVM92A5TAI0

    Abstract: TC58DVM92A5TA TC58DVM92A5 TC58DVM92A
    Text: TC58DVM92A5TAI0 TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 512-MBIT 64M x 8 BITS CMOS NAND E PROM DESCRIPTION The device is a single 3.3 V 512Mbit (553,648,128 bit) NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes × 32 pages × 4096 blocks. The device has a 528-byte static


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    TC58DVM92A5TAI0 512-MBIT 512Mbit 528-byte TC58DVM92A5TAI0 TC58DVM92A5TA TC58DVM92A5 TC58DVM92A PDF

    NAND read disturb

    Abstract: TC58DYM92A5BAJ3
    Text: TC58DYM92A5BAJ3 TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 512-MBIT 64M x 8 BITS CMOS NAND E PROM DESCRIPTION The device is a single 1.8 V 512Mbit (553,648,128 bit) NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes × 32 pages × 4096 blocks. The device has a 528-byte static


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    TC58DYM92A5BAJ3 512-MBIT 512Mbit 528-byte NAND read disturb TC58DYM92A5BAJ3 PDF

    TC58DYM92A5TA00

    Abstract: No abstract text available
    Text: TC58DYM92A5TA00 TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 512-MBIT 64M x 8 BITS CMOS NAND E PROM DESCRIPTION The device is a single 1.8 V 512Mbit (553,648,128 bit) NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes × 32 pages × 4096 blocks. The device has a 528-byte static


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    TC58DYM92A5TA00 512-MBIT 512Mbit 528-byte TC58DYM92A5TA00 PDF

    TH58NVG2S3

    Abstract: TH58NVG2S3BFT00 TH58NVG toshiba TH58NVG th58 th58nv toshiba nand plane size TH58NVG2S MOS 4016 PSL 26
    Text: TH58NVG2S3BFT00/TH58NVG2S8BFT00 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON GATE CMOS 2 4 GBIT 512M x 8 BIT/256M × 16 BIT CMOS NAND E PROM DESCRIPTION The TH58NVG2SxB is a single 3.3 V 4 Gbit (4,429,185,024 bits) NAND Electrically Erasable and Programmable


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    TH58NVG2S3BFT00/TH58NVG2S8BFT00 BIT/256M TH58NVG2SxB 2112-byte/1056-word 2112-byte 003-10-30A TH58NVG2S3 TH58NVG2S3BFT00 TH58NVG toshiba TH58NVG th58 th58nv toshiba nand plane size TH58NVG2S MOS 4016 PSL 26 PDF

    7805CT

    Abstract: MOC5010 ip1717 UA741CN op amp TL081P LM3524N LM13080N 7824ct LM7915CK LM7905CK
    Text: Master Designer Version 8.5 Component Library Reference Volume 2 October 1995 All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means-electronic, mechanical, photocopying, recording, or otherwise-without the prior


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    PDF

    4016 ic

    Abstract: No abstract text available
    Text: COS/MOS INTEGRATED CIRCUIT QUAD • • • • • • • • • • • • • • • A o \ t , * > h c c îh c f « m b B IL A T E R A L S W IT C H 20V D IG IT A L OR ± 10V P E A K -T O -P E A K SW ITCHING 2 8 0 « T Y P IC A L ON RESISTANCE FOR 15V O PE R ATIO N


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    10kHz, 4016B CF4016B 4016 ic PDF

    vlf 12.5 kHz schematic

    Abstract: 4416B 4000B 4016B MAXIMUM ANALOG SWITCH DPDT
    Text: 4416B INTERNATIONAL, INC. CMOS QUAD ANALOG SWITCH FEA TU R ES ♦ DPDT Switch Operation Without External Logic ♦ Wide Range of Digital and Analog Signal Levels — Digital or Analog Signal to 18 Volts peak ♦ Low ON Resistance — 200 f í typ. over 15Vp.p Signal Input Range,


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    4416B 10kf2 vlf 12.5 kHz schematic 4416B 4000B 4016B MAXIMUM ANALOG SWITCH DPDT PDF

    ferranti array

    Abstract: No abstract text available
    Text: MH SERIES FERRANTI INTERDESIGN, INC. HIGH VOLTAGE SILICON GATE CMOS ARRAYS FEATURES • Oxide Isolated Polysilicon Gate CM OS Technology. • 3V to 15V Specified Operating Voltage. • Operation up to 40MHz at 15V, 15MHz at 5V. • 8 Arrays Ranging from 70 to 1600 Two Input


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    40MHz 15MHz ferranti array PDF

    TH58512FT

    Abstract: No abstract text available
    Text: TOSHIBA TH58512FT TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT TENTATIVE 512-MBIT 64M X SILICON GATE CMOS 8 BITS CMOS NAND E2PROM DESCRIPTION The TH58512 is a single 3.3-V 512-Mbit (553,648,128) bit NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes X 32 pages X 4096 blocks.


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    TH58512FT 512-MBIT TH58512 528-byte TH58512FT PDF

    TSOP 48 Package nand memory toshiba

    Abstract: 1076H CD 4016 PIN DIAGRAM TH58512FTI TH58512FT
    Text: TH58512FTI TOSHIBA TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT 512-MBIT 64M SILICON GATE CMOS X 8 BITS CMOS NAND E2PROM DESCRIPTION The TH58512 is a single 3.3-V 512-Mbit (553,648,128) bit NAND Electrically E rasable and Programmable Read-Only Memory (NAND E 2PROM) organized as 528 bytes X 32 pages X 4096 blocks.


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    TH58512FTI 512-MBIT TH58512 528-byte TSOP 48 Package nand memory toshiba 1076H CD 4016 PIN DIAGRAM TH58512FTI TH58512FT PDF

    TH58512FT

    Abstract: No abstract text available
    Text: TOSHIBA TH58512FT TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT TENTATIVE SILICON GATE CMOS 512-MBIT 64M X 8 BITS CMOS NAND E2PROM DESCRIPTION The TH58512 is a single 3.3-V 512-Mbit (553,648,128) bit NAND Electrically Erasable and Programmable Read-Only Memory (NAND E2PROM) organized as 528 bytes X 32 pages X 4096 blocks.


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    TH58512FT 512-MBIT TH58512 528-byte 48-P-1220-0 TH58512FT PDF

    internal structure of ic 4017

    Abstract: 4518 CI
    Text: C2MOS Logic TC74HC/HCT Series 7. Common Electrical Characteristics 7-1 Power Dissipation The power dissipation of CMOS device is composed of two components: one static, the other dynamic.The total power dissipation is the sum of static and dynamic power dissipation.


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    TC74HC/HCT internal structure of ic 4017 4518 CI PDF

    internal structure of ic 4017

    Abstract: 4518 CI increase the output of Ic 4017 4511 e 4518 CI
    Text: 7. COMMON ELECT RICAL CHARACTERISTICS 7 -1 Pow er Dissipation The power dissipation of CMOS device is com posed of two com ponents: one static, the other dynam ic. The total power dissipation is the sum of static and dynam ic power dissipation. Static power dissipation is obtained by m ultiplying quiescent supply current by the supply voltage


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    PDF

    HC-88

    Abstract: hc81
    Text: 7. COMMON E L E C T R IC A L C H A R A C T E R IS T IC S 7-1 Powtr Dissipation T h e pow er d issip a tio n of CMOS device is com posed of tw o com ponents: one s ta tic , the o th e r d y n am ic. T h e to ta l pow er d issip a tio n is the B u m of sta tic a n d d y n a m ic pow er d issip atio n .


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    HC-90 HC-88 hc81 PDF

    ic 6116 from texas instruments

    Abstract: ma 6116 f6 transistor tic 2250 4016 static ram tms4016
    Text: MILITARY CM O S SMJ5517 2048 WORD BY 8-BIT STATIC RAM LSI DECEMBER 1 9 8 3 SMJ5517 . . . JD PACKAGE 1 TOP VIEW 2K X 8 Organization. Common I/O Single + 5 -V Supply • Fully Static Operation (No Clocks, No Refresh) A7 C 1 ^ 2 4 H vcc 23 ] A 8 22 U A 9 21 D W


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    SMJ5517 24-Pin 600-M B8416. TC5517 54S/74S, 54LS/74LS 54ALS/74ALS SMJ5517 ic 6116 from texas instruments ma 6116 f6 transistor tic 2250 4016 static ram tms4016 PDF

    4500B AA

    Abstract: No abstract text available
    Text: 7. COMMON ELECTRICAL CHARACTERISTICS 7 -1 P o w e r D is s ip a tio n The power dissipation of CMOS device is com posed of two components: one static, the other dynam ic. The total power dissipation is the sum of static and d yn am ic power dissipation. Static power dissipation is obtained by m ultiplyin g quiescent supply current by the supply voltage


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    CHARACTERISTICS-16 4500B AA PDF