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    MOISTURE SENSITIVE HANDLING AND PACKAGING TEXAS Search Results

    MOISTURE SENSITIVE HANDLING AND PACKAGING TEXAS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    XPH13016MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH8R316MC Toshiba Electronic Devices & Storage Corporation P-ch MOSFET, -60 V, -90 A, 0.0064 Ω@-10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH3R10AQM Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 100 V, 120 A, 0.0031 Ω@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    MOISTURE SENSITIVE HANDLING AND PACKAGING TEXAS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    texas instruments packing label

    Abstract: SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64
    Text: TEXAS INSTRUMENTS Notification for the Qualification of the S-Pad Leadframe Conversion for Certain TQFP Packages October 17, 1995 Abstract Texas Instruments Advanced System Logic ASL is converting conventionally designed leadframes to the newly designed Small Pad (S-Pad) leadframe. This breakthrough in device packaging will make


    Original     		PDF 7150M CDC582 CDC586 CDC2582 CDC2586 SN250056 SN74ACT2235-XX SN74ACT7807-XX SN74ACT7808-XX SN10067 texas instruments packing label SPAD Eftec 64t PZT144 CDC582 TEXAS INSTRUMENTS, Mold Compound EN-4085S2K3 eftec 45 EN-4085S2 eftec+64

    EIA-726

    Abstract: EIA-747 Infineon moisture sensitive package MIPI design guideline spansion solder profile INFINEON trace code label EIA 783 samsung bluetooth ARM926EJ-S J-STD-033
    Text: Recommendations for Printed Circuit Board Assembly Using Infineon PG-SON Packages Applic atio n Note DS1 October 2009 Wireless Solutions Edition 2009-10-06 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved.


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    SPRU811

    Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
    Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		PDF SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate

    4000 series CMOS Logic ICs

    Abstract: SCLA007A 74HC04 fan out sn74 series TTL logic gates list HC4040 application note schematic thyristor based inverter 74hc family Difference between LS, HC, HCT devices HC165 cmos 4000
    Text: HCMOS Design Considerations SCLA007A September 2002 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services


    Original     		PDF SCLA007A SN54/74HC 4000 series CMOS Logic ICs SCLA007A 74HC04 fan out sn74 series TTL logic gates list HC4040 application note schematic thyristor based inverter 74hc family Difference between LS, HC, HCT devices HC165 cmos 4000

    4000 series CMOS Logic ICs

    Abstract: sn74 series TTL logic gates list 74SC00 HC4000 cmos logic 4000 series Difference between LS, HC, HCT devices cmos 74C00 NAND DATA BOOK CD 4000 FAMILY 74hc family 40H00
    Text: HCMOS Design Considerations SCLA007 April 1996 1 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest


    Original     		PDF SCLA007 SN54/74HC 4000 series CMOS Logic ICs sn74 series TTL logic gates list 74SC00 HC4000 cmos logic 4000 series Difference between LS, HC, HCT devices cmos 74C00 NAND DATA BOOK CD 4000 FAMILY 74hc family 40H00

    HIOKI 3119

    Abstract: CSL-Z7302 EIA-383 JESD625-a ESD test plan JESD625 so20w CZE1000R jedec JESD625-a K6911
    Text: Application Report SZZA027A - April 2002 Electrostatic Discharge ESD Protective Semiconductor Packing Materials and Configurations Cles Troxtell and James Huckabee Standard Linear & Logic ABSTRACT The Texas Instruments Standard Linear & Logic (SLL) Business Group uses an


    Original     		PDF SZZA027A HIOKI 3119 CSL-Z7302 EIA-383 JESD625-a ESD test plan JESD625 so20w CZE1000R jedec JESD625-a K6911

    D882 mosfet

    Abstract: AMWS121M 3M EM air ionizer tester 3M ASTM-D-991 2179 CM 3M CTK2A6-C MS90376 dust cap MIL-STD-3010 esd 20.20
    Text: 3M Electronic Solutions Division Static Control Products and Services Catalog See our products at: www.3M.com/static *“RoHS Compliant 2005/95/EC” means that the product or part “Product” does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC,


    Original     		PDF 2005/95/EC" 2002/95/EC, 2005/618/EC, D882 mosfet AMWS121M 3M EM air ionizer tester 3M ASTM-D-991 2179 CM 3M CTK2A6-C MS90376 dust cap MIL-STD-3010 esd 20.20

    AUTOMATIC ROOM LIGHT CONTROLLER with visitor counter

    Abstract: MIL-STD-3010 MS-90376 ASTM D2103 Ushio 1604LC semiconductors cross index JEDEC J-STD-033b D882 to 92 electronic weighing scale display
    Text: 3M Electronic Solutions Division Static Control Products and Services Catalog See our products at: www.3Mstatic.com Innovations in Static Protection 3M and Dual Lock are trademarks of 3M Company. All All other other trademarks trademarks are are owned owned by


    Original     		PDF 2002/95/EC" 2002/95/EC, 2005/618/EC, AUTOMATIC ROOM LIGHT CONTROLLER with visitor counter MIL-STD-3010 MS-90376 ASTM D2103 Ushio 1604LC semiconductors cross index JEDEC J-STD-033b D882 to 92 electronic weighing scale display

    JEDEC J-STD-020C

    Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
    Text: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public


    Original     		PDF J-STD-020C J-STD-020B 1-580987-46-X JEDEC J-STD-020C JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


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    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


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    PAL 007 pioneer

    Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    pioneer PAL 007 A

    Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
    Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions


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    90Pb 10Sn solder paste

    Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA


    Original     		PDF 25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola

    UCC27512-EP

    Abstract: UCC27512
    Text: REVISIONS LTR DESCRIPTION DATE Prepared in accordance with ASME Y14.24 APPROVED Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 PMIC N/A PREPARED BY Phu H. Nguyen Original date of drawing YY MM DD CHECKED BY 13-06-06 4 Phu H. Nguyen


    Original     		PDF V62/13608 5962-V065-13 V62/13608-01XE UCC27512MDRSTEP UCC27512-EP UCC27512

    3025

    Abstract: No abstract text available
    Text: White PLCC2 Surface Mount LED OVS9WBCR4 • • • • High luminous intensity High efficiency Emission color: x = 0.315, y = 0.335 Pb-free Product Photo Here The OVS9WBCR4 provides high intensity light from a surface mount package. Light output is optimized by an


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    3025

    Abstract: No abstract text available
    Text: White PLCC4 Surface Mount LED 120° Viewing Angle OVSAWBCR4 • • • • High luminous intensity High efficiency Emission color: White Wide variety of application possibilities Product Photo Here The OVSAWBCR4 provides high intensity light from a surface mount package. Light output is optimized by an


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    Aluminum Base LED PCB

    Abstract: 3025
    Text: White PLCC4 Surface Mount LED 120° Viewing Angle OVSAWBCR4 • • • • High luminous intensity High efficiency Emission color: White Wide variety of application possibilities Product Photo Here The OVSAWBCR4 provides high intensity light from a surface mount package. Light output is optimized by an


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: White PLCC4 Surface Mount LED 120° Viewing Angle OVSAWBCR9 x x x x High luminous intensity High efficiency, 3-chip device Emission color: x = 0.29, y = 0.30 Pb-free Product Photo Here The OVSAWBCR9 combines three die in a single package to provide high intensity light from a surface mount


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    Untitled

    Abstract: No abstract text available
    Text: REVISIONS LTR DESCRIPTION DATE APPROVED A Table I, input offset voltage test; with TA = 25°C delete 9 mV and substitute 6 mV, with -40°C ≤ TA ≤ 125°C, delete 15 mV and substitute 8 mV. Table I, input offset current test, with -40°C ≤ TA ≤ 125°C delete 20 nA and substitute


    Original     		PDF V62/11621-01XE TL074QDR TL074QDREP V62/11621

    CD4504B-EP

    Abstract: No abstract text available
    Text: REVISIONS LTR DESCRIPTION A Correct terminal connections in figure 2. - PHN DATE APPROVED 13-01-16 Thomas M. Hess CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24


    Original     		PDF V62/09606-01XE CD4504BMPWREP 4504BEP V62/09606 CD4504B-EP

    OPA170-EP

    Abstract: No abstract text available
    Text: REVISIONS LTR DESCRIPTION DATE Prepared in accordance with ASME Y14.24 APPROVED Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 PMIC N/A PREPARED BY RICK OFFICER Original date of drawing YY-MM-DD CHECKED BY RAJESH PITHADIA 13-01-23 4


    Original     		PDF V62/12627 5962-V092-12 OPA170-EP

    Untitled

    Abstract: No abstract text available
    Text: White High-Intensity LED Lamp 3 mm, 45° Viewing Angle OVLAW4CB7 x x x x High luminous intensity Through-hole type Water clear lens Available on tape and reel Product Photo Here The OVLAW4CB7 is a round 3mm white high-intensity through-hole lamp with a 45° viewing angle. It is designed


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