taiyo PSR4000
Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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fBGA package tray 12 x 19
Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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r707
Abstract: transistor c114 ATMega8l R708 u106 R709 R710 AT24C02 SFP CML sm r707
Text: 1 2 3 4 5 6 7 8 9 VCCR RXPM 1K R101 B103 10 11 12 VCC FB C112 1u H 13 14 15 16 H AMP JAM LOS RSSIavg 1 RSSIpp U103 12 RxAvgIn R102 VCC R702 130 2 VCC 11 GND U104 MO2049QFN16 CML R703 130 VCC3 4 C116 0.01u FB B701* 10 DIN RateSEL CML R704* 100 STset R701 100
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MO2049QFN16
MO2040QFN16
r707
transistor c114
ATMega8l
R708
u106
R709
R710
AT24C02
SFP CML
sm r707
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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r707
Abstract: R1019 transistor c114 5K13 sm r707 ATmega8L R708 u106 c114 datasheet R702
Text: 1 2 3 4 5 6 7 8 RXPM 1K R101 9 VCCR 10 11 12 VCC B101 FB C101 1u H 13 14 15 16 H AMP JAM LOS RSSIavg 1 RSSIpp U103 12 RxAvgIn R103 VCC R702 180 2 VCC 11 GND U104 MO2049QFN16 3 C116 0.01u 4 CML R703 180 RateSEL R704* 100 VCCR FB B701* 10 DIN VCC3 R701 100 CML
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MO2049QFN16
MO2040QFN16
r707
R1019
transistor c114
5K13
sm r707
ATmega8L
R708
u106
c114 datasheet
R702
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TERMOPAR tipo k
Abstract: TERMOPAR tipo j TERMOPAR k TERMOPAR TERMOPAR tipo E
Text: PRODUTOS EM DESTAQUE 2010 3 anos de Garantia para toda linha Extech Multímetro CAT IV 600V com termômetro infravermelho O modelo EX570 possui um termômetro infravermelho incorporado com mira laser. CAT IV-600V com precisão básica de 0,06%. Invólucro duplo
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EX570
IV-600V
EX540
EM100.
TERMOPAR tipo k
TERMOPAR tipo j
TERMOPAR k
TERMOPAR
TERMOPAR tipo E
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