IPC-7527
Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
|
Original
|
8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
|
Original
|
8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
|
PDF
|
AK08D300-CLCC
Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
|
Original
|
8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
AK08D300-CLCC
AK08D300-LFCSP2X3 .5mm
AK08D300-LFCSP3x3 .5mm
AK08D300-MLP.65mm
AK10D300-8SON .65mm
MLP 3X3
MLP 4X4
AK22D300-DFN
AK24D300-LLP
MLP 5X5
|
PDF
|
QFN leadframe
Abstract: No abstract text available
Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface
|
Original
|
8MM-56
AK64D900-LGA
9MM-64
CSP08)
AK64D900-QFN/MLP
AK72D900-QFN/MLP
10X10
10MM-72
CSP09)
QFN leadframe
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
|
Original
|
AK64D750-70-QFP14x20-1
64PIN
AK68D1200-PLCC
AK68DS1200-PLCC
AK72D900-QFN/MLP
10X10
10MM-72
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
|
Original
|
AK64D750-70-QFP14x20-1
64PIN
AK68D1200-PLCC
AK68DS1200-PLCC
AK72D900-QFN/MLP
10X10
10MM-72
|
PDF
|
NH82801HBM
Abstract: AD-6019R venice 6.2 LE88CLPM T4008 L4 BA41-00725a LTN133AT08-001 NB8M-SE T0300 370400
Text: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 5. Exploded View & Partlist SYSTEM T4009 I0006 T4008 T0302 T2200 T3002 T0300 T0101 T0102 M0001
|
Original
|
T4009
I0006
T4008
T0302
T2200
T0101
T0102
T3002
T0300
M0001
NH82801HBM
AD-6019R
venice 6.2
LE88CLPM
T4008 L4
BA41-00725a
LTN133AT08-001
NB8M-SE
T0300
370400
|
PDF
|
SCB-1000S
Abstract: NH82801HBM AD-9019S le88clpm BA92-04575A LTN154P4-L02-G venice 6.5 NH82801HB LTN154P4-L02 samsung ltn154
Text: - This Document can not be used without Samsung's authorization - 5. Exploded view and Part List SYSTEM ASSY LCD T0010 I0006 T0001 M0001 T0005 G0003 I0001 G0008 M3001 I0002 D0001 I0009 M3004 B0013 M4001 W3007 B0205 B0008 B2000 B0001 G0011 B0150 I0005 B0003
|
Original
|
I0006
T0010
T0001
M0001
T0005
G0003
G0008
I0001
I0002
D0001
SCB-1000S
NH82801HBM
AD-9019S
le88clpm
BA92-04575A
LTN154P4-L02-G
venice 6.5
NH82801HB
LTN154P4-L02
samsung ltn154
|
PDF
|
SCB-1000S
Abstract: NH82801HBM LE88CLPM BA41-00725A DAC-09N016 BA59-02088A NH82801HB scb1000s BA75-01884A SSM-8515S
Text: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 5. Exploded View & Partlist I0013 SYSTEM K1007 K0007 K1001 K4003 K0001 I0003 K3001 K4001 K1002
|
Original
|
I0013
K1007
K1001
K4003
I0003
K0001
K3001
K0007
K4001
K1002
SCB-1000S
NH82801HBM
LE88CLPM
BA41-00725A
DAC-09N016
BA59-02088A
NH82801HB
scb1000s
BA75-01884A
SSM-8515S
|
PDF
|
spartan3 fpga development boards
Abstract: M25PXX XCF08S ddr spi flash XCF16S PLCC-48 footprint spi flash m25pxx W25PXX XC3S1000 XC3S1500
Text: LOW-COST FPGA CONFIGURATION VIA INDUSTRY-STANDARD SPI SERIAL FLASH & LatticeECP/EC FPGAs A Lattice Semiconductor White Paper June 2004 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com
|
Original
|
|
PDF
|
XCF02S pcb
Abstract: AT45DBXX M25PXX XC3S50 XCF16S XC3S1000 XC3S1500 TsoP 20 Package XILINX XC3S2000 XC3S400
Text: 業界基準 SPI シリアル・フラッシュによる低価格 FPGA のコンフィグレーションと LatticeECP/EC FPGA ラティスセミコンダクター ホワイト・ペーパー 2004 年６月 ラティスセミコンダクター株式会社
|
Original
|
20MHz
40MHz
XCF02S pcb
AT45DBXX
M25PXX
XC3S50
XCF16S
XC3S1000
XC3S1500
TsoP 20 Package XILINX
XC3S2000
XC3S400
|
PDF
|
smd diode U12 c526
Abstract: CAP SMD X7R 100NF 50V 10 smd diode c644 smd diode c549 smd DIODE c728 smd diode c731 SCB-1000S smd diode c548 C536 smd diode smd diode U12 C647
Text: Option SEC CODE BA96-03242A BA59-01900A BA81-03428A BA75-01863B BA96-03241A BA59-01970A BA81-03428A BA75-01863B BA96-03239A BA59-01985B BA81-03428A BA75-01863A BA96-03223A BA59-02020A BA81-03428A BA75-01863B BA96-03222A BA59-01953A BA81-03428A BA75-01863A
|
Original
|
BA96-03242A
BA59-01900A
BA81-03428A
BA75-01863B
BA96-03241A
BA59-01970A
BA96-03239A
BA59-01985B
smd diode U12 c526
CAP SMD X7R 100NF 50V 10
smd diode c644
smd diode c549
smd DIODE c728
smd diode c731
SCB-1000S
smd diode c548
C536 smd diode
smd diode U12 C647
|
PDF
|
SG-BGA-6046
Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.
|
Original
|
025mm
FR4/G10
Sn63Pb37
SG-BGA-6046
SG-MLF-7004
156 QFN 12X12
diode sg 87
1mm pitch BGA socket
SG-BGA-6094
BGA Solder Ball compressive force
17X17* BGA 289
SG-MLF-7003
SG-BGA-6033
|
PDF
|
|
|
KS 2152
Abstract: 100-001 PGA23 schematic diagram acs 150
Text: SX8722 High gain acquisition for sensor interface DATASHEET ADVANCED COMMUNICATIONS & SENSING GENERAL DESCRIPTION KEY PRODUCT FEATURES The main function of the SX8722 is to acquire signal from Wheatstone bridges or single ended sensors. The input can be a pressure sensor, a GMR or AMR
|
Original
|
SX8722
SX8722
ISO9001
KS 2152
100-001
PGA23
schematic diagram acs 150
|
PDF
|
KS 2152
Abstract: control acs pressure sensor for IOP
Text: SX8722 High gain acquisition for sensor interface DATASHEET ADVANCED COMMUNICATIONS & SENSING GENERAL DESCRIPTION KEY PRODUCT FEATURES The main function of the SX8722 is to acquire signal from Wheatstone bridges or single ended sensors. The input can be a pressure sensor, a GMR or AMR
|
Original
|
SX8722
SX8722
ISO9001
KS 2152
control acs
pressure sensor for IOP
|
PDF
|
smd w70 diode
Abstract: delta inverter hed55xxu12 A302 w9 BA41-00727A NB8M LTN121W1-L03-G BA41-00728A NH82801HBM UJ-850
Text: Main System Location Level SEC Code Name Description Qt'y SA/SNA T7100 1.8GHz .1 0902-002196 IC-MICROPROCESSOR 1 SA T7300(2.0GHz) .1 0902-002197 IC-MICROPROCESSOR
|
Original
|
T7100
T7300
T7500
T7700
512X2)
AU10U
JACK-IEEE1394
AU30U
IEEE1394
smd w70 diode
delta inverter
hed55xxu12
A302 w9
BA41-00727A
NB8M
LTN121W1-L03-G
BA41-00728A
NH82801HBM
UJ-850
|
PDF
|
Untitled
Abstract: No abstract text available
Text: CP2108 S INGLE - C HIP USB- T O - Q U A D - U A R T B R ID G E Single-Chip USB-to-QUAD UART Data Transfer UART Interface Features Four independent UART interfaces Integrated USB transceiver; no external resistor required Integrated clock; no external crystal required
|
Original
|
CP2108
|
PDF
|
QFN-64 thermal resistance
Abstract: SP0503BAHT equivalent rs232 to UART AN721SW CP2108 QFN-64 package QFN-64 9x9 mm package 10C4h
Text: CP2108 S INGLE - C HIP USB- T O - Q U A D - U A R T B R ID G E Single-Chip USB-to-QUAD UART Data Transfer UART Interface Features Four independent UART interfaces Integrated USB transceiver; no external resistor required Integrated clock; no external crystal required
|
Original
|
CP2108
QFN-64 thermal resistance
SP0503BAHT equivalent
rs232 to UART
AN721SW
CP2108
QFN-64 package
QFN-64 9x9 mm package
10C4h
|
PDF
|
w76l
Abstract: 9m50
Text: Mai nSyst em Opt i on SECCode Loc at i on Name Descr i pt i on Uni t I C0902002197 T7300 2. 0GHz CPU MI CROPROCESSOR; LF80537GG0414M, 2. 0GHz, uFCPGA, 479P, TR, PLASTI C, 1. 05V, 34W, 0t o+10 PC 0C, 4MB, Mer om T7300, FSB800, 4M I CDRAM MODULE; M470T6554,
|
Original
|
|
PDF
|
KS 2152
Abstract: No abstract text available
Text: SX8722 High gain acquisition for sensor interface DATASHEET ADVANCED COMMUNICATIONS & SENSING GENERAL DESCRIPTION KEY PRODUCT FEATURES The input can be a pressure sensor, a GMR or AMR magnetic sensor, a chemical sensor, a thermistor or a mix of several of these sensors.
|
Original
|
SX8722
SX8722
ISO9001
KS 2152
|
PDF
|
SCB-1700N
Abstract: SWRCH18A UL3302 AWG28 Ht1 SMD CODE BA81-07077A M470T2864EH3-CF7 smd ht1 C3604BD-F hdd 1.8 BA96-04113C
Text: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 6. Material List Level Code 1 BA44-00264A 1 Assembled ADAPTOR 1 BA43-00212A 1 BATTERY 1 BA43-00220A
|
Original
|
BA44-00264A
BA43-00212A
BA43-00220A
BA43-00221A
BA43-00222A
BA46-08356A
BA46-09951A
BA46-10898A
BA99-14031A
BA68-03029A
SCB-1700N
SWRCH18A
UL3302 AWG28
Ht1 SMD CODE
BA81-07077A
M470T2864EH3-CF7
smd ht1
C3604BD-F
hdd 1.8
BA96-04113C
|
PDF
|
sot23 w32
Abstract: SOT23 DMB BA39-00628A TESA4982 HED55XXU12 BA41-00725A SMD Code 12W SOT-23 A3212ELH/HED55XXU12 LF80537NE0301MN w342 9g
Text: Main System Design location Level Parts Code Parts Description Spec.
|
Original
|
WLL3141
BA44-00238A
BA44-00243A
BA44-00162A
BA42-00133A
BA59-02154A
BA92-04714A
BA99-07566A
BA70-00388A
BA39-00431A
sot23 w32
SOT23 DMB
BA39-00628A
TESA4982
HED55XXU12
BA41-00725A
SMD Code 12W SOT-23
A3212ELH/HED55XXU12
LF80537NE0301MN
w342 9g
|
PDF
|
SCL 1058 equivalent
Abstract: No abstract text available
Text: SX8725 ZoomingADC for Pressure and Temperature Sensing ADVANCED COMMUNICATIONS & SENSING Description Features • • • The SX8725 is a data acquisition system based on Semtech’s low power ZoomingADC™ technology. It directly connects most types of miniature sensors
|
Original
|
SX8725
SX8725
16-bit
SCL 1058 equivalent
|
PDF
|