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    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


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    Untitled

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09)

    Untitled

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09)

    AK08D300-CLCC

    Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09) AK08D300-CLCC AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5

    QFN leadframe

    Abstract: No abstract text available
    Text: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface


    Original     		PDF 8MM-56 AK64D900-LGA 9MM-64 CSP08) AK64D900-QFN/MLP AK72D900-QFN/MLP 10X10 10MM-72 CSP09) QFN leadframe

    Untitled

    Abstract: No abstract text available
    Text: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:


    Original     		PDF AK64D750-70-QFP14x20-1 64PIN AK68D1200-PLCC AK68DS1200-PLCC AK72D900-QFN/MLP 10X10 10MM-72

    Untitled

    Abstract: No abstract text available
    Text: 64 Pin to 72 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:


    Original     		PDF AK64D750-70-QFP14x20-1 64PIN AK68D1200-PLCC AK68DS1200-PLCC AK72D900-QFN/MLP 10X10 10MM-72

    NH82801HBM

    Abstract: AD-6019R venice 6.2 LE88CLPM T4008 L4 BA41-00725a LTN133AT08-001 NB8M-SE T0300 370400
    Text: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 5. Exploded View & Partlist SYSTEM T4009 I0006 T4008 T0302 T2200 T3002 T0300 T0101 T0102 M0001


    Original     		PDF T4009 I0006 T4008 T0302 T2200 T0101 T0102 T3002 T0300 M0001 NH82801HBM AD-6019R venice 6.2 LE88CLPM T4008 L4 BA41-00725a LTN133AT08-001 NB8M-SE T0300 370400

    SCB-1000S

    Abstract: NH82801HBM AD-9019S le88clpm BA92-04575A LTN154P4-L02-G venice 6.5 NH82801HB LTN154P4-L02 samsung ltn154
    Text: - This Document can not be used without Samsung's authorization - 5. Exploded view and Part List SYSTEM ASSY LCD T0010 I0006 T0001 M0001 T0005 G0003 I0001 G0008 M3001 I0002 D0001 I0009 M3004 B0013 M4001 W3007 B0205 B0008 B2000 B0001 G0011 B0150 I0005 B0003


    Original     		PDF I0006 T0010 T0001 M0001 T0005 G0003 G0008 I0001 I0002 D0001 SCB-1000S NH82801HBM AD-9019S le88clpm BA92-04575A LTN154P4-L02-G venice 6.5 NH82801HB LTN154P4-L02 samsung ltn154

    SCB-1000S

    Abstract: NH82801HBM LE88CLPM BA41-00725A DAC-09N016 BA59-02088A NH82801HB scb1000s BA75-01884A SSM-8515S
    Text: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 5. Exploded View & Partlist I0013 SYSTEM K1007 K0007 K1001 K4003 K0001 I0003 K3001 K4001 K1002


    Original     		PDF I0013 K1007 K1001 K4003 I0003 K0001 K3001 K0007 K4001 K1002 SCB-1000S NH82801HBM LE88CLPM BA41-00725A DAC-09N016 BA59-02088A NH82801HB scb1000s BA75-01884A SSM-8515S

    spartan3 fpga development boards

    Abstract: M25PXX XCF08S ddr spi flash XCF16S PLCC-48 footprint spi flash m25pxx W25PXX XC3S1000 XC3S1500
    Text: LOW-COST FPGA CONFIGURATION VIA INDUSTRY-STANDARD SPI SERIAL FLASH & LatticeECP/EC FPGAs A Lattice Semiconductor White Paper June 2004 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com


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    XCF02S pcb

    Abstract: AT45DBXX M25PXX XC3S50 XCF16S XC3S1000 XC3S1500 TsoP 20 Package XILINX XC3S2000 XC3S400
    Text: 業界基準 SPI シリアル・フラッシュによる低価格 FPGA のコンフィグレーションと LatticeECP/EC FPGA ラティスセミコンダクター ホワイト・ペーパー 2004 年６月 ラティスセミコンダクター株式会社


    Original     		PDF 20MHz 40MHz XCF02S pcb AT45DBXX M25PXX XC3S50 XCF16S XC3S1000 XC3S1500 TsoP 20 Package XILINX XC3S2000 XC3S400

    smd diode U12 c526

    Abstract: CAP SMD X7R 100NF 50V 10 smd diode c644 smd diode c549 smd DIODE c728 smd diode c731 SCB-1000S smd diode c548 C536 smd diode smd diode U12 C647
    Text: Option SEC CODE BA96-03242A BA59-01900A BA81-03428A BA75-01863B BA96-03241A BA59-01970A BA81-03428A BA75-01863B BA96-03239A BA59-01985B BA81-03428A BA75-01863A BA96-03223A BA59-02020A BA81-03428A BA75-01863B BA96-03222A BA59-01953A BA81-03428A BA75-01863A


    Original     		PDF BA96-03242A BA59-01900A BA81-03428A BA75-01863B BA96-03241A BA59-01970A BA96-03239A BA59-01985B smd diode U12 c526 CAP SMD X7R 100NF 50V 10 smd diode c644 smd diode c549 smd DIODE c728 smd diode c731 SCB-1000S smd diode c548 C536 smd diode smd diode U12 C647

    SG-BGA-6046

    Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
    Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.


    Original     		PDF 025mm FR4/G10 Sn63Pb37 SG-BGA-6046 SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033

    KS 2152

    Abstract: 100-001 PGA23 schematic diagram acs 150
    Text: SX8722 High gain acquisition for sensor interface DATASHEET ADVANCED COMMUNICATIONS & SENSING GENERAL DESCRIPTION KEY PRODUCT FEATURES The main function of the SX8722 is to acquire signal from Wheatstone bridges or single ended sensors. The input can be a pressure sensor, a GMR or AMR


    Original     		PDF SX8722 SX8722 ISO9001 KS 2152 100-001 PGA23 schematic diagram acs 150

    KS 2152

    Abstract: control acs pressure sensor for IOP
    Text: SX8722 High gain acquisition for sensor interface DATASHEET ADVANCED COMMUNICATIONS & SENSING GENERAL DESCRIPTION KEY PRODUCT FEATURES The main function of the SX8722 is to acquire signal from Wheatstone bridges or single ended sensors. The input can be a pressure sensor, a GMR or AMR


    Original     		PDF SX8722 SX8722 ISO9001 KS 2152 control acs pressure sensor for IOP

    smd w70 diode

    Abstract: delta inverter hed55xxu12 A302 w9 BA41-00727A NB8M LTN121W1-L03-G BA41-00728A NH82801HBM UJ-850
    Text: Main System Location Level SEC Code Name Description Qt'y SA/SNA T7100 1.8GHz .1 0902-002196 IC-MICROPROCESSOR 1 SA T7300(2.0GHz) .1 0902-002197 IC-MICROPROCESSOR


    Original     		PDF T7100 T7300 T7500 T7700 512X2) AU10U JACK-IEEE1394 AU30U IEEE1394 smd w70 diode delta inverter hed55xxu12 A302 w9 BA41-00727A NB8M LTN121W1-L03-G BA41-00728A NH82801HBM UJ-850

    Untitled

    Abstract: No abstract text available
    Text: CP2108 S INGLE - C HIP USB- T O - Q U A D - U A R T B R ID G E Single-Chip USB-to-QUAD UART Data Transfer UART Interface Features Four independent UART interfaces Integrated USB transceiver; no external resistor required Integrated clock; no external crystal required


    Original     		PDF CP2108

    QFN-64 thermal resistance

    Abstract: SP0503BAHT equivalent rs232 to UART AN721SW CP2108 QFN-64 package QFN-64 9x9 mm package 10C4h
    Text: CP2108 S INGLE - C HIP USB- T O - Q U A D - U A R T B R ID G E Single-Chip USB-to-QUAD UART Data Transfer UART Interface Features Four independent UART interfaces Integrated USB transceiver; no external resistor required Integrated clock; no external crystal required


    Original     		PDF CP2108 QFN-64 thermal resistance SP0503BAHT equivalent rs232 to UART AN721SW CP2108 QFN-64 package QFN-64 9x9 mm package 10C4h

    w76l

    Abstract: 9m50
    Text: Mai nSyst em Opt i on SECCode Loc at i on Name Descr i pt i on Uni t I C0902002197 T7300 2. 0GHz CPU MI CROPROCESSOR; LF80537GG0414M, 2. 0GHz, uFCPGA, 479P, TR, PLASTI C, 1. 05V, 34W, 0t o+10 PC 0C, 4MB, Mer om T7300, FSB800, 4M I CDRAM MODULE; M470T6554,


    Original     		PDF

    KS 2152

    Abstract: No abstract text available
    Text: SX8722 High gain acquisition for sensor interface DATASHEET ADVANCED COMMUNICATIONS & SENSING GENERAL DESCRIPTION KEY PRODUCT FEATURES The input can be a pressure sensor, a GMR or AMR magnetic sensor, a chemical sensor, a thermistor or a mix of several of these sensors.


    Original     		PDF SX8722 SX8722 ISO9001 KS 2152

    SCB-1700N

    Abstract: SWRCH18A UL3302 AWG28 Ht1 SMD CODE BA81-07077A M470T2864EH3-CF7 smd ht1 C3604BD-F hdd 1.8 BA96-04113C
    Text: - 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 - This Document can not be used without Samsung's authorization - 6. Material List Level Code 1 BA44-00264A 1 Assembled ADAPTOR 1 BA43-00212A 1 BATTERY 1 BA43-00220A


    Original     		PDF BA44-00264A BA43-00212A BA43-00220A BA43-00221A BA43-00222A BA46-08356A BA46-09951A BA46-10898A BA99-14031A BA68-03029A SCB-1700N SWRCH18A UL3302 AWG28 Ht1 SMD CODE BA81-07077A M470T2864EH3-CF7 smd ht1 C3604BD-F hdd 1.8 BA96-04113C

    sot23 w32

    Abstract: SOT23 DMB BA39-00628A TESA4982 HED55XXU12 BA41-00725A SMD Code 12W SOT-23 A3212ELH/HED55XXU12 LF80537NE0301MN w342 9g
    Text: Main System Design location Level Parts Code Parts Description Spec.


    Original     		PDF WLL3141 BA44-00238A BA44-00243A BA44-00162A BA42-00133A BA59-02154A BA92-04714A BA99-07566A BA70-00388A BA39-00431A sot23 w32 SOT23 DMB BA39-00628A TESA4982 HED55XXU12 BA41-00725A SMD Code 12W SOT-23 A3212ELH/HED55XXU12 LF80537NE0301MN w342 9g

    SCL 1058 equivalent

    Abstract: No abstract text available
    Text: SX8725 ZoomingADC for Pressure and Temperature Sensing ADVANCED COMMUNICATIONS & SENSING Description Features • • • The SX8725 is a data acquisition system based on Semtech’s low power ZoomingADC™ technology. It directly connects most types of miniature sensors


    Original     		PDF SX8725 SX8725 16-bit SCL 1058 equivalent