BGA676
Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18
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BGA16A1ATTERNS
BGA676
BGA665
BGA-1156
156 QFN 12X12
LGA240
BGA-783
BGA441
BGA1024
BGA1521
7286X
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SG-MLF-7017
Abstract: No abstract text available
Text: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm IC guide prevents over compression of elastomer
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225mm
475mm.
Ultem1000
MLF44C
MLF64A
MLF60A
MLF76A
MLF36B
SG-MLF-7017
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SG-MLF-7024
Abstract: MLF76A
Text: Top View GHz MLF Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Sqr.
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225mm
725mm.
475mm.
Ultem1000
SG-MLF-7024
MLF76A
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BA 758
Abstract: SG-MLF-7008 MLF24 MLF36
Text: GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm IC guide prevents over compression of elastomer
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Original
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225mm
SG-MLF-7008
BA 758
MLF24
MLF36
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