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    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    SG-MLF-7007

    Abstract: No abstract text available
    Text: GHz MLF Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm IC guide prevents over compression of elastomer


    Original     		PDF 225mm MLF48B MLF64C MLF32C MLF68B MLF40B SG-MLF-7007