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    MILITARY STANDARD, TEST METHODS AND PROCEDURES FO Search Results

    MILITARY STANDARD, TEST METHODS AND PROCEDURES FO Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TB67H481FTG Toshiba Electronic Devices & Storage Corporation Stepping and Brushed Motor Driver /Bipolar Type / Vout(V)=50 / Iout(A)=3.0 / IN input type / VQFN32 Visit Toshiba Electronic Devices & Storage Corporation
    DF2B5M4ASL Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) Visit Toshiba Electronic Devices & Storage Corporation
    CUZ24V Toshiba Electronic Devices & Storage Corporation Zener Diode, 24 V, USC Visit Toshiba Electronic Devices & Storage Corporation
    TB67H451AFNG Toshiba Electronic Devices & Storage Corporation Brushed Motor Driver/1ch/Vout(V)=50/Iout(A)=3.5 Visit Toshiba Electronic Devices & Storage Corporation
    TLP3406SRH4 Toshiba Electronic Devices & Storage Corporation Photorelay (MOSFET output, 1-form-a), 30 V/0.9 A, 300 Vrms, S-VSON16T Visit Toshiba Electronic Devices & Storage Corporation

    MILITARY STANDARD, TEST METHODS AND PROCEDURES FO Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DNA-H-93-140

    Abstract: DNA-H-95-61 e1309 JEP133 transistor 2N2222 F1262 FOTP-64 MOSFET DOSIMETER sensor 3414 cobalt-60
    Text: N RADIATION OWNER’S MANUAL – RHA-Related Documents Military Performance Specifications 19500 – General Specification for Semiconductor Devices 38534 – Performance Specifications for Hybrid Microcircuits 38535 – General Specification for Intregrated Circuits Microcircuits Manufacturing


    Original     		PDF P1156 PSS-01-609 heisen9929 DNA-H-93-140 DNA-H-95-61 e1309 JEP133 transistor 2N2222 F1262 FOTP-64 MOSFET DOSIMETER sensor 3414 cobalt-60

    GEC Marconi Materials Technology

    Abstract: ford ppap INCOMING RAW MATERIAL specification in-process quality control ford motor company Ford in-process quality INCOMING RAW MATERIAL INSPECTION procedure ford m Nokia 9000 INCOMING RAW MATERIAL INSPECTION procedure work instruction raw material stores delco semiconductors
    Text: BRIEF HISTORY of HARRIS SEMICONDUCTOR The modern-day Harris Corporation has its roots in Radiation, Inc., an electronics company formed in Melbourne, Florida, in 1950. Radiation was founded shortly after the first rocket was launched from Cape Canaveral. The company's original staff of 12 employees pioneered the


    Original     		PDF

    IEC 68-2-63

    Abstract: transistors Si 6822 MIL-STD-781 transistors 6822 si MIL-STD-785 MIL-STD-721 The Japanese Transistor Manual 1981 IEC 68-2-28 AND 7411 NATIONAL SEMICONDUCTOR MARKING BM
    Text: STANDARDS AND QUALITY CERTIFICATION FOR QUALITY SYSTEMS, SAFETY, ANDRELIABILITY OF SEMICONDUCTOR DEVICES VIII. STANDARDS AND QUALITY CERTIFICATION FOR QUALITY SYSTEMS, SAFETY, ANDRELIABILITY OF SEMICONDUCTOR DEVICES 1. QUALITY SYSTEM STANDARDS 1.1 INTRODUCTION TO THE ISO 9000 SERIES


    Original     		PDF

    ASTM-B487-79

    Abstract: MIL-STD-109 ASTM-B567 mil-m-24519 molding plastics ASTM-A754-79 E111594 MIL-S-83505 mil-std 1130b MIL-I-45607B MIL-P-45209
    Text: FACTSHEET F-198 SPECIFICATIONS & TESTING Specifications and Standard Test Procedures Samtec products are subject to the following general specifications and standard test procedures. PLATING QUALITY ASSURANCE Quality program requirements ISO 9000 Specifications


    Original     		PDF F-198 E111594 MIL-STD-105 MIL-STD-109 MIL-STD-45662 MIL-I-45208 MIL-I-45607B QQ-N-290 MIL-C-14550 MIL-P-45209 ASTM-B487-79 ASTM-B567 mil-m-24519 molding plastics ASTM-A754-79 MIL-S-83505 mil-std 1130b MIL-I-45607B

    MIL-STD-109

    Abstract: ASTM-B487-79 1 clm 324 MIL-P-45209 ASTM-A754-79 ASTM-B567
    Text: FACTSHEET F-199 SPECIFICATIONS & TESTING Specifications and Standard Test Procedures Samtec products are subject to the following general specifications and standard test procedures. QUALITY ASSURANCE PLATING Quality program requirements ISO 9000 Specifications


    Original     		PDF F-199 E111594 MIL-STD-105 MIL-STD-109 MIL-STD-45662 MIL-I-45208 MIL-I-45607B QQ-N-290 MIL-C-14550 MIL-P-45209 ASTM-B487-79 1 clm 324 ASTM-A754-79 ASTM-B567

    AM2764A-25/BXA

    Abstract: eprom AM2764A 2764-200 seeq 2764 datasheet 8200505ZX MD2764A25B MD2764 am 2764-200 AM2764 MD2764A-25/B
    Text: REVISIONS LTR DESCRIPTION DATE D Change to Military drawing format. Add new vendor CAGE 61394. Add 2 new device types. Editorial changes throughout. Change drawing CAGE to 67268. 31 Aug 1987 APPROVED M. A. Hauck CURRENT CAGE CODE 67268 REV D PAGE 24 REV REV STATUS


    Original     		PDF

    5962-87650033A

    Abstract: CY7C291-50 WS57C291C-55TMB QP7C291A-35TMB qml-38535 5962-8765003LA QP7C291A-35WMB QP7C291A-25WMB 5962-8765001LA
    Text: REVISIONS LTR DESCRIPTION DATE YR MO DAY APPROVED A Add one vendor, CAGE 65786. Add device types 03 and 04. Add margin test, programming procedure, waveform, and flowchart for method B. Add case outline letter K. 88-10-25 M. A. Frye B Add "Changes in accordance with NOR 5962-R103-92."


    Original     		PDF 5962-R103-92. 5962-87650033A CY7C291-50 WS57C291C-55TMB QP7C291A-35TMB qml-38535 5962-8765003LA QP7C291A-35WMB QP7C291A-25WMB 5962-8765001LA

    MIL-STD-750E

    Abstract: 1N21B diode cc 3053 MIL-PRF-680 D65019 rectifier 2037-1 TT 2076 SAE-ARP-743 1N21B diode 1N21* Diode Detector Holder
    Text: The documentation and process conversion measures necessary to comply with this revision shall be completed by 20 June 2007 INCH - POUND MIL-STD-750E 20 November 2006 SUPERSEDING MIL-STD-750D 28 FEBRUARY 1995 DEPARTMENT OF DEFENSE TEST METHOD STANDARD TEST METHODS FOR SEMICONDUCTOR DEVICES


    Original     		PDF MIL-STD-750E MIL-STD-750D MIL-STD-750E 1N21B diode cc 3053 MIL-PRF-680 D65019 rectifier 2037-1 TT 2076 SAE-ARP-743 1N21B diode 1N21* Diode Detector Holder

    IC 7432

    Abstract: IC 7422 SOP EIAJ TYPE II ED-7402-1 7421 IC 7432 ic IC 7424 IC 9715 ED-7305 IC 7421 IC 7402
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE RELATED STANDARDS 2. IC PACKAGE RELATED STANDARDS The following standards are related to IC package 1 EIAJ (Standards of the Electronic Industries Association of Japan) These standards, published by the Electronic Industries Association of Japan, define the dimensions, characteristics, ratings and test


    Original     		PDF ED-7301 ED-7302 ED-7303 ED-7305 ED-7311 ED-7400 ED-7400-1 ED-7400-2 ED-7401-2 ED-7401A IC 7432 IC 7422 SOP EIAJ TYPE II ED-7402-1 7421 IC 7432 ic IC 7424 IC 9715 ED-7305 IC 7421 IC 7402

    x-5175474-x

    Abstract: No abstract text available
    Text: Product Specification 108-60038 CHAMP .050 I Board-to-Board Connector Lead Free Version 1. Scope: 1.1 Contents: This specification covers the requirements for product performance, test methods and quality assurance provisions of CHAMP .050 (I) Board-to-Board Connector.


    Original     		PDF X-5175472-X X-5175611-X X-5175473-X X-5175612-X X-5175474-X X-5175613-X X-5175475-X ASHL-0005- x-5175474-x

    harris varistors

    Abstract: harris varistor harris mov GE Transient Voltage Suppression Manual GE MOV varistor GE Transient Voltage Suppression Manual sem 3040 271 varistor V24ZA4 varistor 220 ge VARISTOR DATA SHEET
    Text: Harris MOV Quality and Reliability Quality Statement Harris Total Quality Management Principles “Harris is committed to being a company Customer Focus of the highest quality in every aspect of its business activity” John T. Hartley Chairman, Harris Corporation


    Original     		PDF UL-1449 E75961) UL-497B E135010) UL-1414 E56529) harris varistors harris varistor harris mov GE Transient Voltage Suppression Manual GE MOV varistor GE Transient Voltage Suppression Manual sem 3040 271 varistor V24ZA4 varistor 220 ge VARISTOR DATA SHEET

    Untitled

    Abstract: No abstract text available
    Text: M F-198-1 m SISSb I 1 SPECIFICATIONS & TESTING Specifications and Standard Test Procedures Samtec products are subject to the following general specifications and standard test procedures. QUALITY ASSURANCE PLATING Quality program requirements ISO 9000 Specifications


    OCR Scan     		PDF F-198-1 E111594 MIL-G-45204 MIL-STD-105 MIL-STD-T09 MIL-STD-45662 MIL-l-45208 QQ-N-290 MIL-I-45607B L-C-14550

    Untitled

    Abstract: No abstract text available
    Text: * * SPECIFICATIONS & TESTING i.k Specif ications and Standard Test Procedures Samtec products are subject to the following general specifications and standard test procedures. PLATING QUALITY ASSURANCE Quality program requirements ISO 9000 Specifications UL File Number


    OCR Scan     		PDF E111594 MIL-G-45204 MIL-STD-105 MIL-STD-109 MIL-STD-45662 MIL-l-45208 QQ-N-290 MIL-I-45607B MIL-C-14550 MIL-P-45209

    W-S-6536

    Abstract: WS6536 Adams-Russell Adams-Russell cable MIL-STD-1520 MIL-STD-45662 milstar FED-STD-209 MIL-S-45743
    Text: TOTAL QUALITY MANAGEMENT 492 At Adams-Russell, we know th at the quality of a product depends upon more than just its design. It takes dedicated people working together in a qual­ ity environment to design, manufacture, test, and inspect it. With this in mind, we begin our quest for


    OCR Scan     		PDF MIL-M-38510, MIL-STD-883, MIL-H-38534. W-S-6536 WS6536 Adams-Russell Adams-Russell cable MIL-STD-1520 MIL-STD-45662 milstar FED-STD-209 MIL-S-45743

    cdfp1

    Abstract: 29C040 qml-38535 GDIP1-T32 CDFP1-F32
    Text: REVISIONS LTR DATE DESCRIPTION APPROVED YR-MO-DA REV SHEET REV SHEET 15 16 17 REV STATUS OF SHEETS PMIC N.'ft. STAND ARD IZED M IL IT A R Y DRAWING THIS M A U I MB IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A


    OCR Scan     		PDF PROGRAMMINBUL-103 MIL-BUL-103 MIL-BUL-103 QML-38535. QML-38535 MIL-BUL-103. cdfp1 29C040 GDIP1-T32 CDFP1-F32

    Untitled

    Abstract: No abstract text available
    Text: ADAM TECH ADAM TECHNOLOGIES INC. MANUFACTURING MATERIALS AND PROCESSES All Adam Tech manufacturing is governed by the following military and federal specifications from the onset of design through tooling, production materials, plating, assembly and testing.


    OCR Scan     		PDF MIL-STD-1344 MIL-STD-202F MIL-STD-1130B MIL-STD-810 MIL-S-83505 MIL-S-83734 MIL-STD-105 MIL-STD-109 MIL-STD-45662 MIL-Q-9858

    Untitled

    Abstract: No abstract text available
    Text: ADAM TECH ADAM TECHNOLOGIES INC. MANUFACTURING MATERIALS AND PROCESSES All Adam Tech manufacturing is governed by the following military and federal specifications from the onset of design through tooling, production materials, plating, assembly and testing.


    OCR Scan     		PDF MIL-STD-1344 MIL-STD-202F MIL-STD-1130B MIL-STD-810 MIL-S-83505 MIL-S-83734 MIL-STD-105 MIL-STD-109 MIL-STD-45662 MIL-Q-9858

    qml-38535

    Abstract: GDFP2-F28 GDIP4-T28
    Text: REVISIONS LTR DESCRIPTION APPROVED D A T E YR-HO-DA REV SHEET REV SHEET 15 16 17 REV STATUS OF SHEETS REV 10 SHEET PMIC N/A STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE PREPARED BY


    OCR Scan     		PDF 5962-E044-94 ScIL-BUL-103 MIL-BUL-103 MIL-BUL-103 QML-38535. QML-38535 MIL-BUL-103. GDFP2-F28 GDIP4-T28

    B1685

    Abstract: ASTM-A754-79 TSM125
    Text: silm T ec F-199-1 m l i * •1 EC IFICATI ONS & TESTING Specifications and Standard Test Procedures Samtec products are subject to the following general specifications and standard test procedures. QUALITY ASSURANCE PLATING Quality p ogram requirements ISO 9000


    OCR Scan     		PDF F-199-1 E111594 MIL-STD-105 MIL-STD-109 MIL-STD-45662 MIL-l-45208 MIL-I-45607B QQ-N-290 MIL-C-14550 MIL-P-45209 B1685 ASTM-A754-79 TSM125

    2N7119

    Abstract: 2N7122 2N7121 2N6967 2N7243 2N724 2N6966 2N7123 JANTX LTPD FOR LOT AND SCREENING DEVICES 2N7242
    Text: HARRIS SEMICOND SECTOR SbE T> • 430EE71 QÜ42235 ‘ìbb H H A S Military Power Products MOSFETs M ilitary Pow er Products Military and aerospace requirements for high—reliability solid-state devices are extremely large and diverse, not only in terms of performance, operating conditions, and


    OCR Scan     		PDF 430EE71 QG42235 TC5-204AA 2N7120 T0-204AA 2N7121 2N7122 2N7123 2N7119 2N6967 2N7243 2N724 2N6966 JANTX LTPD FOR LOT AND SCREENING DEVICES 2N7242

    5962-8961405XX

    Abstract: GDIP1-T32 JE 1692 qml-38535 TD0470 5962-8961403XX
    Text: REVISIONS LTR DATE DESCRIPTION APPROVED YR-MO-DA 91-03-04 M. Frye Add 4.3.2 and 4.3.3. Change to 4.4. Delete e. and f. from 4.4.1. Change table I parameter and Irr3 - Add footnote 5 to table I. Added case outline letter Z. Editorial changes throughout. 92-03-24


    OCR Scan     		PDF 5962-8961401MXX 5962-8961401MYX 5962-8961402MXX 5962-8961402MYX 5962-8961403MXX 5962-8961403MYX 5962-8961404MXX 5962-8961404MYX 5962-8961405MXX 5962-8961405MYX 5962-8961405XX GDIP1-T32 JE 1692 qml-38535 TD0470 5962-8961403XX

    LT1003

    Abstract: No abstract text available
    Text: DESC FORM 193 Use previous edition until exhausted. JUL 91 DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited. 5962-E243 1. SCOPE 1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of


    OCR Scan     		PDF MIL-BUL-103. MIL-BUL-103 LT1003

    ispLSI 1015

    Abstract: qml-38535 1048C isplsi1048c pwl 4700
    Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED REV SHEET REV SHEET 15 REV STATUS OF SHEETS REV SHEET PMIC N/A STANDARD M ICRO CIRCUIT DRAW ING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE 10 PREPARED BY


    OCR Scan     		PDF MIL-PRF-38535 MIL-HDBK-1331. QML-38535. QML-38535 MIL-HDBIC-103. MIL-HDBK-103 ispLSI 1015 1048C isplsi1048c pwl 4700

    AMP-QA-182

    Abstract: ES-1020 ES1020
    Text: ^ Tyco Electronics Product Specification 108-5390 p re : s e e y u n ja a n app: LEONG SEE FAN 10 o ct 07 d c rn o . Rev E D20071010002518_738349 Free Height 0.8 mm Pitch Board-to-Board Connector 1. SCOPE 1.1. Contents This specification covers the requirements for product performance, test methods and quality


    OCR Scan     		PDF d20071010002518 AMP-QA-182 ES-1020 ES1020