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    MIL-STD-883 WIRE BOND SHEAR METHOD 2011 Search Results

    MIL-STD-883 WIRE BOND SHEAR METHOD 2011 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    MIL-STD-883 WIRE BOND SHEAR METHOD 2011 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: G E N E R A L S P E C I F I C AT I O N S Mechanical Characteristics Resistance to Solvents: ATC’s dielectrics are virtually unaffected by moisture and commonly used cleaning solvents. Bond Strength: All terminations meet or exceed MIL-STD-883 Method 2019 for Die Shear Strength. Wire bondability meets or


    Original     		PDF MIL-STD-883 ML-C-49464 MIL-STD-883 MIL-C-49464. MIL-C-49464)

    ABLEBONd 84-1

    Abstract: JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 JESD22-B116 Ablebond 84-1 LMISR4 JESD22-A101 LMISR4 A101 G600 JESD22 9110l

    ABLEBONd 84-1

    Abstract: Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S
    Text: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.


    Original     		PDF JESD22 J-STD-020 JESD22-A113 TISP61089HDMR-S TISP8200MDR-S TISP8201MDR-S TISP9110LDMR-S ABLEBONd 84-1 Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S

    copper bond wire

    Abstract: crm-1076NS CRM1076NS Sumitomo CRM1076NS J-STD-22 0834 CRM1076 r3589 SUMITOMO g600 G600
    Text: THYRISTOR SURGE PROTECTORS May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 46 — Change from Gold to Copper Wire


    Original     		PDF 150mil) MS012, TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S copper bond wire crm-1076NS CRM1076NS Sumitomo CRM1076NS J-STD-22 0834 CRM1076 r3589 SUMITOMO g600 G600

    CRM1076NS

    Abstract: J-STD-22 r3589 Sumitomo CRM1076NS CS thyristor G600 CRM1076N
    Text: THYRISTOR SURGE PROTECTORS May, 2008 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 46 — Change from Gold to Copper Wire


    Original     		PDF 150mil) MS012, TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S CRM1076NS J-STD-22 r3589 Sumitomo CRM1076NS CS thyristor G600 CRM1076N

    "Sumitomo eme 6600"

    Abstract: R7W120DR TISPA79R241DR R3604-3DR CRM1033D JEDEC 95 R3763 tisp2180f3ds sumitomo 6600 TISP2180F3DR
    Text: CIRCUIT PROTECTION PRODUCTS April, 2006 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 42 - New Assembly/Test Site


    Original     		PDF 150mil) MS012, MS-012, RISP61521DR-S TISP6L7591DR TISP70151D TISP7015DR TISP7015L1D TISP7015L1DR "Sumitomo eme 6600" R7W120DR TISPA79R241DR R3604-3DR CRM1033D JEDEC 95 R3763 tisp2180f3ds sumitomo 6600 TISP2180F3DR

    Sumitomo CRM1076NS

    Abstract: SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S
    Text: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in


    Original     		PDF MS012, TISP3082F3DR-S TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S Sumitomo CRM1076NS SUMITOMO g600 CRM1076NS Compound R3589DR-S TISPA79R241DR-S J-STD-22 R3680DR-S crm1076 bourns R3679DR-S

    Sumitomo CRM1076NS

    Abstract: SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041
    Text: THYRISTOR SURGE PROTECTORS August 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team PCN Tracking Number 45 New Assembly/Test Site & Green Mold Compound Bourns is qualifying an additional assembly/test site for manufacture of overvoltage protectors in


    Original     		PDF MS012, TISP3082F3DR-S TISP3125F3DR-S TISP3150F3DR-S TISP3180F3DR-S TISP3290F3DR-S TISP3380F3DR-S TISP4072F3DR-S TISP4125F3DR-S TISP4150F3DR-S Sumitomo CRM1076NS SUMITOMO g600 G600 mold compound r3589 J-STD-22 G600 JEDEC 95 CRM1076NS TISP4072F3DR-S r36041

    CRM-1033

    Abstract: JEDEC 95 CRM1033D CRM1033 Product Change Notification PCN "Sumitomo eme 6600" R3602D r3589 TISP2180F3 TISPL758LF3DR
    Text: CIRCUIT PROTECTION PRODUCTS April, 2006 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector Product Change Notification PCN Tracking Number 42 - New Assembly/Test Site


    Original     		PDF 150mil) MS012, MS-012, RISP61521DR-S TISP6L7591DR TISP70151D TISP7015DR TISP7015L1D TISP7015L1DR CRM-1033 JEDEC 95 CRM1033D CRM1033 Product Change Notification PCN "Sumitomo eme 6600" R3602D r3589 TISP2180F3 TISPL758LF3DR

    tsmc design rule

    Abstract: 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model
    Text: Cypress Semiconductor Product Qualification Report QTP# 002105 VERSION 1.0 October, 2000 High Accuracy EPROM Programmable Single-PLL Clock Generator L28 Technology, CTI fab 2 and TSMC fab 2A, Taiwan CY2077 390 kHz - 133MHz at 5V 390 kHz -100 MHz at 3.3V CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:


    Original     		PDF CY2077 133MHz CY2077SC/CY2077ZC CY2280-OC 85C/85 tsmc design rule 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model

    plx 9030

    Abstract: EIA/JEDEC JESD22-A108 pci9030-aa60pi PCI 9030 uBGA 180 Failure rate plx 9052 PCI9054-AB50PI PCI9030-AA60BI PCI9054-AA50BI PCI9080-3 PCI 9030 FIT rate
    Text: Revision: Original October 2000 Website: Email: Phone: Fax: http://www.plxtech.com Rel@plxtech.com 408-774-9060 800-759-3735 408-774-2169 2000 PLX Technology, Inc. All rights reserved. PLX Technology, Inc. retains the right to make changes to this product at any time, without notice.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SCD#QM5295 Source Control Drawing Upscreening/Manufacturing Specification P/N FT5C1008-20L3MB-IS Title Page . List of Effective Pages .


    Original     		PDF QM5295 FT5C1008-20L3MB-IS

    40F-701-1-15

    Abstract: nikon STEPPER 71007 MIL-STD-883 method 5003 INCOMING MATERIAL INSPECTION procedure harris top marking product change notification
    Text: Status of Document is:RELEASED Effective from: 19-SEP-1997 14:23:42 to Date Printed: 09/24/97 7:46 AM SECTION 2.0 Controlled Document QML GENERAL NON-TECHNOLOGY SPECIFIC GENERAL Section 2.0 of this manual is written to describe the general (non-technology specific)


    Original     		PDF 19-SEP-1997 210XXX 710-010-XX 40F-400-0-0 40F-701-1-15 nikon STEPPER 71007 MIL-STD-883 method 5003 INCOMING MATERIAL INSPECTION procedure harris top marking product change notification

    tsmc 0.35um 2p4m cmos

    Abstract: K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC
    Text: Quality And Reliability Report 2004 Period Covered: 2003


    Original     		PDF DC04-0001 tsmc 0.35um 2p4m cmos K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC

    TM2004

    Abstract: MIL-STD-883 method 5003 TM1011 ACT-R01 54XXXX 40F-701-1-15 marking 25b harris top marking product change notification Harris top marking
    Text: Status of Document is:RELEASED Effective from: 02-JUN-1997 08:18:36 to Date Printed: 06/09/97 6:39 AM SECTION 2.0 Controlled Document QML GENERAL NON-TECHNOLOGY SPECIFIC GENERAL Section 2.0 of this manual is written to describe the general (non-technology specific)


    Original     		PDF 02-JUN-1997 210XXX 710-010-XX 40F-400-0-0 TM2004 MIL-STD-883 method 5003 TM1011 ACT-R01 54XXXX 40F-701-1-15 marking 25b harris top marking product change notification Harris top marking

    DC04 display

    Abstract: how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt
    Text: Quality And Reliability Report 2005 DC04-0001 Page 1 of 79


    Original     		PDF DC04-0001 DC04 display how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt

    HMXR-5001

    Abstract: 13001 YF 09 TRANSISTOR HP 5082 7000 5082-0825 33150A 2N6838 Hxtr 3101 Hxtr 3101 transistor 5082-2815 hsch-1001
    Text: For Complete . Application &Sales . '. Information ' ,.' • Call ' Joseph Masarich Sales Representative HEWLETT PACKARD . NEELY "Sales Region 3003 scon BLVD. SANTA CLARA, CA 95050 408 988-7234 Microwave Semiconductor Diode and Transistor Designers Catalog


    Original     		PDF

    tm-1017

    Abstract: JESD31 marking code ny SMD Transistor npn JEDEC JESD31 Automated Guided Vehicles project A434 RF MODULE MIL-I-46058 ASTM E104 M38510 cross index semiconductors cross index
    Text: The documentation and process conversion measures necessary to comply with this revision shall be completed by 13 September 2007. INCH-POUND MIL-PRF-38535H 16 March 2007 SUPERSEDING MIL-PRF-38535G 7July 2006 PERFORMANCE SPECIFICATION INTEGRATED CIRCUITS MICROCIRCUITS MANUFACTURING,


    Original     		PDF MIL-PRF-38535H MIL-PRF-38535G MIL-PRF-3853591 RD-650) tm-1017 JESD31 marking code ny SMD Transistor npn JEDEC JESD31 Automated Guided Vehicles project A434 RF MODULE MIL-I-46058 ASTM E104 M38510 cross index semiconductors cross index

    A434 RF MODULE

    Abstract: JESD31 TRANSISTOR SMD MARKING CODE A45 NCSL Z540.3 MIL-I-46058 part marking b36 smd diode tm-1017 B568 solar water pumping machine control schematic JEDEC JESD31
    Text: DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS POST OFFICE BOX 3990 COLUMBUS, OH 43218-3990 IN REPLY REFER TO DSCC-VAC 20 April, 2010 MEMORANDUM FOR MILITARY/INDUSTRY DISTRIBUTION SUBJECT: Initial Draft of MIL-PRF-38535 Revision J: Project Number 5962-2010-006


    Original     		PDF MIL-PRF-38535 MIL-PRF-38535J RD-650) A434 RF MODULE JESD31 TRANSISTOR SMD MARKING CODE A45 NCSL Z540.3 MIL-I-46058 part marking b36 smd diode tm-1017 B568 solar water pumping machine control schematic JEDEC JESD31

    RK618

    Abstract: LOCTITE 3623 S-CH00-0157-002 DBAS 970 25 35 PN 059 ANSI-MC-96 LOCTITE 3542 M27500A22 NES 1004 naval specification SP 107156 souriau 8611
    Text: Wire and Cable, Harnessing and Protection Products Table of Contents Tyco Electronics Embraces the Most Valued Brand Names Worldwide ……………………………ii About Raychem Wire and Cable, Harnessing and Heat-Shrinkable Products ………………………iii


    Original     		PDF

    fci APEX connector

    Abstract: Federal Screw #1409 push-in expandable rubber grommet 517-SDR-BN 561-EZ750 NAS 1352 SCREW nas 9921 LC-136B hdmi to rca wiring pin out MIL-T-43435 Type II flammability
    Text: WIRE AND CABLE Wire & Cable Mgmt. Cable Ties, Duct, Identification, Mounting 3M. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1047


    Original     		PDF

    method 2010 checklist

    Abstract: 88C681 68C681 L-567 88C681 equivalent L567
    Text: MILITARY PRODUCTS DOCUMENTATION SYSTEMS Documentation System s also reviews customer specifications and purchase orders and generates customized internal travelers to assure compliance to customer requirements. Documentation Systems maintains a program to


    OCR Scan     		PDF 68C681, 88C681, 82C684 method 2010 checklist 88C681 68C681 L-567 88C681 equivalent L567

    MP 1009 es

    Abstract: BS-00001
    Text: ^EDI B c e tro n lc D e s ig n i Inc. Reliability Program Quality Assurance Policy The Quality Standard at Electronic Designs Incorpo­ rated EDI is defect free work. No other standard is acceptable. This policy is reflected in the attention given to the


    OCR Scan     		PDF MIL-STD-883. MIL-STD-883 MP 1009 es BS-00001

    SVI 3104 c

    Abstract: UPC1678G ne333 stb 1277 TRANSISTOR equivalent transistor bf 175 NE85635 packaging schematic NE72000 VC svi 3104 NE9000 NE720
    Text: Introduction Small Signal GaAs FETs Power GaAs FETs Small Signal Silicon Bipolar Transistors Power Silicon Bipolar Transistors Silicon Monolithic Circuits GaAs Monolithic Circuits Reliability Assurance Appendix This C atalog is printed on R ecycled Paper California Eastern Laboratories, Inc. reserves the right to make changes to the products or


    OCR Scan     		PDF AN83301-1 NE24615 AN83302 AN83303-1 NE71083 NE70083 AN83901 AN85301 11/86-LN AN86104 SVI 3104 c UPC1678G ne333 stb 1277 TRANSISTOR equivalent transistor bf 175 NE85635 packaging schematic NE72000 VC svi 3104 NE9000 NE720