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    MICRODOT APPLICATION NOTE Search Results

    MICRODOT APPLICATION NOTE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TSL1401CCS-RL2 Rochester Electronics TSL1401 - 128 x 1 Linear Sensor Array with hold. Please note, an MOQ and OM of 250 pcs applies. Visit Rochester Electronics Buy
    C8231A Rochester Electronics LLC Math Coprocessor, 8-Bit, NMOS, CDIP24, DIP-24 Visit Rochester Electronics LLC Buy
    AM79865JC Rochester Electronics LLC Telecom Circuit, Visit Rochester Electronics LLC Buy
    AM79866AJC-G Rochester Electronics LLC SPECIALTY TELECOM CIRCUIT, PQCC20, ROHS COMPLIANT, PLASTIC, LCC-20 Visit Rochester Electronics LLC Buy
    MD8087/R Rochester Electronics LLC Math Coprocessor, CMOS Visit Rochester Electronics LLC Buy

    MICRODOT APPLICATION NOTE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOD−123FL CASE 498−01 ISSUE B DATE 28 JUN 2010 SCALE 4:1 E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. 4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT


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    OD-123FL PDF

    CASE 403A

    Abstract: marking code AYWW 403A-03 SMB CASE
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMB CASE 403A−03 ISSUE G SCALE 1:1 DATE 07 JUL 2008 SCALE 1:1 Polarity Band Non−Polarity Band HE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.


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    03A-03 CASE 403A marking code AYWW 403A-03 SMB CASE PDF

    QFN24

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN24, 4x4, 0.5P CASE 485L−01 ISSUE A DATE 29 JUL 2008 SCALE 2:1 D A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL


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    QFN24, 485L-01 QFN24 PDF

    517AN

    Abstract: UDFN10
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN10 2.6x2.6, 0.5P CASE 517AN-01 ISSUE O SCALE 2:1 DATE 14 SEP 2007 D PIN ONE REFERENCE 0.10 C 2X B ÍÍÍ ÍÍÍ ÍÍÍ 0.10 C 2X A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


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    UDFN10 517AN-01 517AN 517AN PDF

    CA20X

    Abstract: QFN20 "MARKING DIAGRAM"
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 1 QFN20, 2.5x4.5 MM CASE 485AA−01 ISSUE B DATE 30 APR 2010 20 SCALE 2:1 PIN ONE REFERENCE D A ÏÏÏ ÏÏÏ ÏÏÏ ÏÏÏ B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


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    QFN20, 485AA-01 485AA CA20X QFN20 "MARKING DIAGRAM" PDF

    transistor marking 12x

    Abstract: SOLDERRM 513AD LLGA12 BDD2
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LLGA12 CASE 513AD−01 ISSUE A DATE 22 FEB 2007 1 SCALE 4:1 A D PIN ONE REFERENCE 2X 0.15 C 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED


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    LLGA12 513AD-01 513AD transistor marking 12x SOLDERRM 513AD LLGA12 BDD2 PDF

    506AT

    Abstract: UDFN10
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN10 3x3, 0.5P CASE 506AT-01 ISSUE A SCALE 2:1 DATE 29 JUN 2007 D PIN ONE REFERENCE 0.15 C 2X ÍÍÍ ÍÍÍ ÍÍÍ ÍÍÍ 0.15 C 2X B A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


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    UDFN10 506AT-01 506AT 506AT PDF

    98AS

    Abstract: SOD-123 marking code A1 ON SEMICONDUCTOR MARKING DIAGRAM SOD-123
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOD−123 CASE 425−04 ISSUE G DATE 07 OCT 2009 SCALE 5:1 D A ÂÂÂÂ ÂÂÂÂ ÂÂÂÂ NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A1 1 HE DIM A A1 b c D E HE L


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    OD-123 98AS SOD-123 marking code A1 ON SEMICONDUCTOR MARKING DIAGRAM SOD-123 PDF

    SMC 403-03

    Abstract: CASE 403-03 98ASB42668B SMC case 403
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SMC CASE 403−03 ISSUE E DATE 03 AUG 2005 SCALE 1:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. 4. 403−01 THRU −02 OBSOLETE, NEW STANDARD 403−03.


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    PDF

    LLGA12

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LLGA12 3x3, 0.5P CASE 513AK-01 ISSUE O DATE 28 JUN 2007 1 SCALE 4:1 PIN ONE REFERENCE 2X 0.15 C 2X ÎÎÎ ÎÎÎ ÎÎÎ 0.15 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


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    LLGA12 513AK-01 513AK PDF

    WDFN-10

    Abstract: WDFN10 SOLDERRM 33048
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN10, 3x3, 0.5P CASE 522AA-01 ISSUE A DATE 02 JUL 2007 SCALE 2:1 D PIN ONE REFERENCE 0.15 C 2X ÍÍÍ ÍÍÍ ÍÍÍ 0.15 C 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


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    WDFN10, 522AA-01 522AA WDFN-10 WDFN10 SOLDERRM 33048 PDF

    microdot Application Note

    Abstract: transistor marking 12x SOLDERRM UDFN12
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN12, 2.5x1.35, 0.4P CASE 517BD−01 ISSUE O 12 1 DATE 18 NOV 2009 SCALE 4:1 A B D 2X 0.10 C PIN ONE REFERENCE 2X DETAIL A E OPTIONAL CONSTRUCTIONS TOP VIEW DETAIL B A3 A1 0.05 C NOTE 4 12X A1 SIDE VIEW 6 1 C


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    UDFN12, 517BD-01 517BD microdot Application Note transistor marking 12x SOLDERRM UDFN12 PDF

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN6 2x2, 0.65P CASE 517BG−01 ISSUE A DATE 04 FEB 2010 SCALE 4:1 D PIN ONE REFERENCE 0.10 C 0.10 C B A ÍÍ ÍÍ ÍÍ NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


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    517BG-01 517BG PDF

    20x20

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 CASE 506AQ−01 ISSUE A DATE 15 AUG 2005 1 D A B SCALE 4:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 . 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN


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    506AQ-01 506AQ 20x20 PDF

    UDFN12

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN12 3x3, 0.5P CASE 517AM-01 ISSUE O DATE 13 JUL 2007 1 SCALE 4:1 A D ÎÎÎ ÎÎÎ ÎÎÎ PIN ONE REFERENCE 2X 0.10 C 2X 0.10 C E DIM A A1 A3 b D D2 E E2 e K L TOP VIEW A 0.10 C 12X NOTES: 1. DIMENSIONING AND TOLERANCING PER


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    UDFN12 517AM-01 517AM PDF

    microdot Application Note

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN8 1.6x1.0, 0.4P CASE 511AF−01 ISSUE O 8 DATE 19 AUG 2008 1 SCALE 4:1 A B D PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL


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    511AF-01 511AF microdot Application Note PDF

    microdot

    Abstract: WDFN12 506AY
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN12, 3x4, 0.5P CASE 506AY−01 ISSUE B 12 DATE 31 OCT 2006 1 D A PIN 1 INDEX AREA 2X 0.10 C 2X ÈÈÈÈ ÈÈÈÈ ÈÈÈÈ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER.


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    WDFN12, 506AY-01 05uch 506AY microdot WDFN12 506AY PDF

    microdot Application Note

    Abstract: marking 2x marking L2 diode marquis microdot 511bj marking L2 15x15
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN6 1.5x1.5, 0.5P CASE 511BJ−01 ISSUE B DATE 06 JUL 2010 SCALE 4:1 D L A B NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED


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    511BJ-01 511BJ microdot Application Note marking 2x marking L2 diode marquis microdot 511bj marking L2 15x15 PDF

    qfn20 footprint

    Abstract: QFN20-4X4 QFN20
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS QFN20, 4x4, 0.5P CASE 485E−01 ISSUE B DATE 19 OCT 2010 SCALE 2:1 A B D ÏÏ ÏÏ PIN ONE REFERENCE 2X 0.15 C ÎÎ ÏÏ ÎÎ EXPOSED Cu E NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


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    QFN20, 485E-01 qfn20 footprint QFN20-4X4 QFN20 PDF

    microdot Application Note

    Abstract: DFN8 3X3 506BJ
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 3x3, 0.5P CASE 506BJ-01 ISSUE O 1 SCALE 2:1 DATE 08 NOV 2007 PIN 1 REFERENCE 2X 0.10 C 2X ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ 0.10 C EDGE OF PACKAGE A B D NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.


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    506BJ-01 506BJ microdot Application Note DFN8 3X3 506BJ PDF

    517AC-01

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS UDFN8, 1.6x1.6, 0.4P CASE 517AC−01 ISSUE A 8 1 DATE 29 MAR 2006 SCALE 4:1 2X 0.10 C PIN ONE REFERENCE 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL


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    517AC-01 517AC 517AC-01 PDF

    b8pl

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS Micro8t CASE 846A-02 ISSUE H DATE 12 NOV 2007 SCALE 2:1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE


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    46A-02 46A-01 46A-02. b8pl PDF

    DFN16

    Abstract: No abstract text available
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN16, 4x1.6, 0.5P CASE 506AC−01 ISSUE C 16 1 SCALE 4:1 DATE 14 JAN 2010 A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION b APPLIES TO TERMINAL AND


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    DFN16, 506AC-01 506AC DFN16 PDF

    505AB

    Abstract: DFN20
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN20, 6x5, 0.5P CASE 505AB−01 ISSUE B 20 DATE 05 DEC 2008 1 SCALE 2:1 A D NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. DIMENSIONS IN MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINALS AND IS MEASURED BETWEEN


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    DFN20, 505AB-01 505AB 505AB DFN20 PDF