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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC24; SOT564-1 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 4.40 (2x) 2.05 (2×) 1.275 (2×) solder lands solder resist 0.075 0.50 (16×) clearance 0.150 0.40 (9×) solder paste	Original	PDF	HBCC24; OT564-1 MGX376

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC24; SOT564-1 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 4.40 (2x) 2.05 (2×) 1.275 (2×) solder lands solder resist 0.075 0.50 (16×) clearance 0.150 0.40 (9×) solder paste

Original

PDF

HBCC24; OT564-1 MGX376