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    METHOD 208 Search Results

    METHOD 208 Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    CA3306D/B Rochester Electronics LLC CA3306 - ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, CDIP18 Visit Rochester Electronics LLC Buy
    TDC1044AR4C Rochester Electronics LLC ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, PQCC20, PLASTIC, LCC-20 Visit Rochester Electronics LLC Buy
    TDC1044AN9C Rochester Electronics LLC ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, PDIP16, PLASTIC, DIP-16 Visit Rochester Electronics LLC Buy

    METHOD 208 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    an5241

    Abstract: ADJD-J823 new bright J82-3 AV02-1422EN new bright R288-2
    Text: ADJD-J823 Method of Fast Brightness Change Using BRIGHT Register of ADJD-J823 Application Note 5398 Introduction Description of Method This application note describes a method to speed up brightness change using BRIGHT register of the ADJD-J823 color management controller. This method is an extension


    Original     		PDF ADJD-J823 AN5241. ADJD-J823. AV02-1422EN an5241 ADJD-J823 new bright J82-3 new bright R288-2

    mil-std-202 IEC 68-2-17

    Abstract: CFPX-5000 CECC 00802 PM CFPX-5 cecc00802
    Text: CFPX-5000 CRYSTALS ISSUE 2: 11 JUNE 1999 n Solderability: IEC 68-2-20 Test Ta Method 1 solder bath , (MIL-STD-202 Method 208), Temperature 235°C. n Sealing: IEC 68-2-17 Test Qk (Fine Leak), (MIL-STD-202 Method 112 Test Condition C) IEC 68-2-17 Test Qc (Gross Leak), (MIL-STD-202


    Original     		PDF CFPX-5000 MIL-STD-202 MIL-STD-202 mil-std-202 IEC 68-2-17 CECC 00802 PM CFPX-5 cecc00802

    Untitled

    Abstract: No abstract text available
    Text: Performance "F" Series .100"CL Wire Size: #22 AWG Stranded Contact Rating: 5 ampere maximum per contact Solderability: Pretinning meets the requirements of MIL-STD-202, Method 208. Operating Temp: -65° to +125°C -85° to +257°F Test Requirements Test Method per


    Original     		PDF MIL-STD-202, MIL-STD-1344 MIL-C-55302 MS3197-22-Y1 MS3197-22-X1

    pic18f4520 pin diagram

    Abstract: PIC18F4550 indirect addressing microchip pic18f4550 pic18f4xx DS39622 pic18F4550 configuration PIC18F4585 PIC18F4580 example code PIC18F2321 PIC18F2423
    Text: PIC18F2XXX/4XXX FAMILY Flash Microcontroller Programming Specification 1.0 DEVICE OVERVIEW ICSP method is slightly different than the high-voltage method and these differences are noted where applicable. This document includes the programming specifications


    Original     		PDF PIC18F2XXX/4XXX PIC18F2221 PIC18F2580 PIC18F2321 PIC18F2585 PIC18F4510 PIC18F2410 PIC18F2610 PIC18F4515 PIC18F2420 pic18f4520 pin diagram PIC18F4550 indirect addressing microchip pic18f4550 pic18f4xx DS39622 pic18F4550 configuration PIC18F4585 PIC18F4580 example code PIC18F2321 PIC18F2423

    pic18f4520 pin diagram

    Abstract: PIC18F2550 icsp PIC18F4580 example code PIC18F2XXX pic18F4550 configuration PIC18F4620 analog port number pic18f2550 program load circuit free PIC18F4XXX PIC18F2450 usb PIC18F2553
    Text: PIC18F2XXX/4XXX FAMILY Flash Microcontroller Programming Specification 1.0 DEVICE OVERVIEW ICSP method is slightly different than the high-voltage method and these differences are noted where applicable. This document includes the programming specifications


    Original     		PDF PIC18F2XXX/4XXX PIC18F2221 PIC18F2580 PIC18F2321 PIC18F2585 PIC18F4510 PIC18F2410 PIC18F2610 PIC18F4515 PIC18F2420 pic18f4520 pin diagram PIC18F2550 icsp PIC18F4580 example code PIC18F2XXX pic18F4550 configuration PIC18F4620 analog port number pic18f2550 program load circuit free PIC18F4XXX PIC18F2450 usb PIC18F2553

    100k potentiometer

    Abstract: CFPT-5106 cfpt CFPT-5103 CFPT-5104
    Text: CFPT-5103, -5104, -5105, -5106, -5133, -5144 ISSUE 2; 8 SEPTEMBER 1999 • Solderability: IEC 60068-2-20 Test Ta Method 1 Solder Bath (MIL-STD-202 Method 208), Temperature 235°C ■ Vibration: 10 to 60Hz 0.75mm displacement, 60 to 500Hz 98.1m/s2 acceleration, 30 minutes in each of three


    Original     		PDF CFPT-5103, MIL-STD-202 500Hz CFPT-5105 100k potentiometer CFPT-5106 cfpt CFPT-5103 CFPT-5104

    iec 60068-2-17

    Abstract: cfpt
    Text: CFPT-5103, -5104, -5105, -5106, -5133, -5144 ISSUE 2; 8 SEPTEMBER 1999 • Solderability: IEC 60068-2-20 Test Ta Method 1 Solder Bath (MIL-STD-202 Method 208), Temperature 235°C ■ Vibration: 10 to 60Hz 0.75mm displacement, 60 to 500Hz 98.1m/s2 acceleration, 30 minutes in each of three


    Original     		PDF CFPT-5103, MIL-STD-202 500Hz CFPT-5105 iec 60068-2-17 cfpt

    multiplexing e1 frame to e3 frame

    Abstract: multiplexing demultiplexing in microcontroller multiplexing e2 frame e3 control bits in e2 frame multiplexing demultiplexing e2 SXT6234 intel 87C51 demultiplexing E3 multiplex demultiplex multiplexing demultiplexing e2 e3
    Text: APPLICATION NOTE 9601 DECEMBER 1996 REVISION 1.0 SXT6234 E-Rate Multiplexer For Multiplexing/Demultiplexing any 4 data channels Introduction Multiplexing Method The multiplexing method uses cyclic bit interleaving in the tributary numbering order. This conforms with the positive


    Original     		PDF SXT6234 MHMUXCE12 MHMUXCE23= multiplexing e1 frame to e3 frame multiplexing demultiplexing in microcontroller multiplexing e2 frame e3 control bits in e2 frame multiplexing demultiplexing e2 intel 87C51 demultiplexing E3 multiplex demultiplex multiplexing demultiplexing e2 e3

    PIC18F4480 application example code

    Abstract: pic18f4580 pin diagram pic18f4xx PIC18f4520 block diagram PIC18F4620 analog port number
    Text: PIC18F2XX0/2X21/2XX2/2XX5/ 4XX0/4X21/4XX2/4XX5 Flash Microcontroller Programming Specification 1.0 DEVICE OVERVIEW low-voltage ICSP method is slightly different than the high-voltage method and these differences are noted where applicable. This document includes the programming specifications


    Original     		PDF PIC18F2XX0/2X21/2XX2/2XX5/ 4XX0/4X21/4XX2/4XX5 PIC18F2221 PIC18F2321 PIC18F2410 PIC18F2420 PIC18F2450 PIC18F2455 PIC18F2480 PIC18F2510 PIC18F4480 application example code pic18f4580 pin diagram pic18f4xx PIC18f4520 block diagram PIC18F4620 analog port number

    MIL-STD-202f

    Abstract: TEPRO JIS 0402 208H 210E JIS-C-5202-6
    Text: TEPRO TYPE “TR” ELECTRO TECHNIK ENVIRONMENTAL CHARACTERISTICS: ITEM SPECIFICATIONS TEST METHOD JIS-C-5205-5.5 SHORT TIME OVERLOAD ± 0.5% + 0.05Ω RCWV*2.5 or max overload voltage, 5 seconds INSULATION RESISTANCE >1000mΩ MIL-STD-202F method 302 Apply 100VDC for 1 minute


    Original     		PDF JIS-C-5205-5 1000m MIL-STD-202F 100VDC JIS-C-5202-7 TEPRO JIS 0402 208H 210E JIS-C-5202-6

    103A

    Abstract: MIL-STD-202f 208H 210E JIS-C-5202-6 soderability
    Text: TEPRO TYPE “TU” ELECTRO TECHNIK ENVIRONMENTAL CHARACTERISTICS: ITEM SPECIFICATIONS TEST METHOD JIS-C-5205-5.5 SHORT TIME OVERLOAD ± 0.5% + 0.05Ω RCWV*2.5 or max overload voltage, 5 seconds INSULATION RESISTANCE >1000mΩ MIL-STD-202F method 302 Apply 100VDC for 1 minute


    Original     		PDF JIS-C-5205-5 1000m MIL-STD-202F 100VDC JIS-C-5202-7 wiSTD-202F 103A 208H 210E JIS-C-5202-6 soderability

    MIL-STD-202f

    Abstract: MIL-STD-202f 107G 103A 208H 210E JIS-C-5202-6
    Text: TEPRO TYPE “TT” ELECTRO TECHNIK ENVIRONMENTAL CHARACTERISTICS: ITEM SPECIFICATIONS TEST METHOD JIS-C-5205-5.5 SHORT TIME OVERLOAD ± 0.5% + 0.05Ω RCWV*2.5 or max overload voltage, 5 seconds INSULATION RESISTANCE >1000mΩ MIL-STD-202F method 302 Apply 100VDC for 1 minute


    Original     		PDF JIS-C-5205-5 1000m MIL-STD-202F 100VDC JIS-C-5202-7 with020 MIL-STD-202f 107G 103A 208H 210E JIS-C-5202-6

    TRANSISTOR C 6090

    Abstract: TRANSISTOR C 6090 EQUIVALENT k 4110 C 6090 M 2 N 50 60 fft algorithm 1024-Point block diagram OF pentium 2 me 6100 butterfly "bit reverse"
    Text: CHAPTER 12 The Fast Fourier Transform There are several ways to calculate the Discrete Fourier Transform DFT , such as solving simultaneous linear equations or the correlation method described in Chapter 8. The Fast Fourier Transform (FFT) is another method for calculating the DFT. While it produces the same


    Original     		PDF

    C-USC0805

    Abstract: bcx71smd nxp lpc2138 LPC2138 ARM7 LPC2138 lcd 16*2 with lpc2138 vpbdiv register LPC2138 ARM7 lpc 2138 ARM7 LPC 217 rtc info in LPC2138
    Text: AN10535 LPC2138 extreme power down application note Rev. 01 — 6 December 2006 Application note Document information Info Content Keywords LPC2138, extreme power down Abstract This document describes a method to power down the LPC2138 so the power down current is less than 1 µA. This method requires a few simple


    Original     		PDF AN10535 LPC2138 LPC2138, AN10535 C-USC0805 bcx71smd nxp lpc2138 ARM7 LPC2138 lcd 16*2 with lpc2138 vpbdiv register LPC2138 ARM7 lpc 2138 ARM7 LPC 217 rtc info in LPC2138

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount Fuses Subminiature Surface Mount PICO SMF 459 and 460 Series Fuses ENVIRONMENTAL SPECIFICATIONS: Operating Temperature: –55°C to 125°C. Shock: MIL-STD-202, Method 213, Test Condition I 100 G’s peak for 6 milliseconds . Vibration: MIL-STD-202, Method 201 (10–55 Hz, .06 in. total excursion).


    Original     		PDF MIL-STD-202,

    Untitled

    Abstract: No abstract text available
    Text: Surface Mount Fuses Subminiature Surface Mount PICO SMF 459 and 460 Series Fuses ENVIRONMENTAL SPECIFICATIONS: Operating Temperature: –55°C to 125°C. Shock: MIL-STD-202, Method 213, Test Condition I 100 G’s peak for 6 milliseconds . Vibration: MIL-STD-202, Method 201 (10–55 Hz, .06 in. total excursion).


    Original     		PDF MIL-STD-202, 10x1000 10x160 10x560

    Untitled

    Abstract: No abstract text available
    Text: Distance area image sensor S11963-01CR Measures the distance to an object by TOF Time-Of-Flight method The distance image sensors are designed to measure the distance to an object by TOF method. When used in combination with a pulse modulated light source, this sensor outputs phase difference information on the timing that the light is emitted


    Original     		PDF S11963-01CR B1201, KMPD1142E06

    MIL-STD-202

    Abstract: MIL-STD-202 METHOD 211 mil-std-202 method 213 method c MIL-STD202 mil-std-202 METHOD 106 MILSTD-202 MIL-STD-202 METHOD 208 MIL-STD-202 METHOD 204 mil-std-202, method 102 florida 50 ohms termination resistance
    Text: DRAWING NO. REV. 32- 1157 REQUIREMENTS RATING NOMINAL IMPEDANCE Ohms REQUIREMENTS RATING VIBRATION MIL—STD—202 METHOD 204 COND. D (20 G’S) SHOCK MIL—STD—202 METHOD 213 COND. 1 (100 G’S) TEMPERATURE CYCLING MIL—STD—202 METHOD 102 COND. C (- 6 5 TO + 1 2 5 °C)


    OCR Scan     		PDF MIL--STD--202 MIL-STD-202 MIL-STD-202 METHOD 211 mil-std-202 method 213 method c MIL-STD202 mil-std-202 METHOD 106 MILSTD-202 MIL-STD-202 METHOD 208 MIL-STD-202 METHOD 204 mil-std-202, method 102 florida 50 ohms termination resistance

    mil-std-202

    Abstract: mil-std-202 method 213 method c MIL-STD202 mil-std-202 method 213 method I mil-std-202 METHOD 106
    Text: DRAWING NO. REV. 42-0054 REQUIREMENTS RATING NOMINAL IMPEDANCE Ohms REQUIREMENTS RATING VIBRATION MIL—STD—202 METHOD 204 COND. D (20 G’s) SHOCK MIL—STD—202 METHOD 213 COND. I (100 G’s) THERMAL SHOCK MIL—STD—202 METHOD 107 COND. B (- 6 5 TO + 1 2 5 ° C)


    OCR Scan     		PDF MIL--STD--202 DC-26 RAMIL--STD--202 mil-std-202 mil-std-202 method 213 method c MIL-STD202 mil-std-202 method 213 method I mil-std-202 METHOD 106

    MIL-STD-202

    Abstract: MIL-STD-202 METHOD 208 MIL-STD-202 METHOD 204 mil-std-202 DC mil-std-202 204 B mil-std-202 METHOD 106
    Text: EDD DRAWING NO. REV. 42-1056 REQUIREMENTS RATING NOMINAL IMPEDANCE OHMS RATING VIBRATION MIL—STD—202 METHOD 204 COND. D (20 G’s) SHOCK MIL—STD—202 METHOD 213 COND. 1 (100 G’s) THERMAL SHOCK MIL—STD—202 METHOD 107 COND. B (- 65 TO + 1 2 5 ° C)


    OCR Scan     		PDF MIL--STD--202 DE202 MIL-STD-202 MIL-STD-202 METHOD 208 MIL-STD-202 METHOD 204 mil-std-202 DC mil-std-202 204 B mil-std-202 METHOD 106

    MIL-STD-750

    Abstract: MIL-STD-750C
    Text: HIGH RELIABILITY TEST CONDITIONS NO. TEST CONDITION DURATION REFERNCE DOCUMENT 1 SOLDERABILITY 230 ± 5 DC 5 SEC MIL-STD-202 METHOD 208 2 LEAD PULL 2KG IN AXIAL LEAD DIRECTION 10 SEC MIL-STD-750 METHOD 2036.3 3 LEAD FATIGUE 90-DEGREE BEND WITH 0.5KG WEIGHT


    OCR Scan     		PDF MIL-STD-202 MIL-STD-750 90-DEGREE 168/1000HRS MIL-STD-750C

    Untitled

    Abstract: No abstract text available
    Text: ENVIRONMENTAL & QUALITY ASSURANCE FOR SURFACE MOUNT COMPONENTS TEST MIL-STD-202 DESCRIPTION Operating Temperature - - -25°C TO +85°C Storage Temperature - - -55°C TO +150°C Altitude Method 105, Condition E 150,000 feet Humidty Method 106 90% Relative Humidity, 65°C


    OCR Scan     		PDF MIL-STD-202

    1501 CENTROID

    Abstract: No abstract text available
    Text: by DINU MADAU Influence Value Defuzzification Method Defuzzification is compute inten­ sive and may seriously bog down your system. Here is a computationally efficient method that reduces the resources required and eliminates the need for a faster microcontroller or custom logic.


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Littelfuse Surface Mount Fuses Subminiature Surface Mount PICO SMF 459 and 460 Series Fuses ENVIRONMENTAL SPECIFICATIONS: Operating Temperature: -55°C to 125°C. Shock: MIL-STD-202, Method 213, Test Condition I 100 G’s peak for 6 milliseconds . Vibration: MIL-STD-202, Method 201 (10-55 Hz, .06 in. total excursion).


    OCR Scan     		PDF MIL-STD-202,