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    METHOD 101 Search Results

    METHOD 101 Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    TDC1044AR4C Rochester Electronics LLC TDC1044A - ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, PQCC20 Visit Rochester Electronics LLC Buy
    TDC1044AN9C Rochester Electronics LLC TDC1044A - ADC, Proprietary Method, 4-Bit, 1 Func, 1 Channel, Parallel, 4 Bits Access, Bipolar, PDIP16 Visit Rochester Electronics LLC Buy
    CA3306D/B Rochester Electronics LLC CA3306 - ADC, Flash Method, 6-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, CDIP18 Visit Rochester Electronics LLC Buy

    METHOD 101 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    HD-BNC

    Abstract: AMPHENOL Spanner Amphenol HD-BNC 4028 BE
    Text: 2. REV MECHANICAL: A. DURABILITY: 4. ENVIRONMENTAL: A. THERMAL SHOCK PER MIL-STD-202 METHOD 107 TEST CONDITION B EXCEPT HIGH TEMP @200 C B. VIBRATION: MIL-STD-202 METHOD 204 TEST CONDITION B C. SHOCK: MIL-STD-202 METHOD 213 TEST CONDITION B D. CORROSION: MIL-STD-202 METHOD 101


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    06-Apr-10 19-May-10 MIL-STD-202ng 20-May-10 HD-BNC AMPHENOL Spanner Amphenol HD-BNC 4028 BE PDF

    HD-BNC

    Abstract: 4028 BE 800REF
    Text: 2. REV MECHANICAL: A. DURABILITY: 4. ENVIRONMENTAL: A. THERMAL SHOCK PER MIL-STD-202 METHOD 107 TEST CONDITION B EXCEPT HIGH TEMP @200 C B. VIBRATION: MIL-STD-202 METHOD 204 TEST CONDITION B C. SHOCK: MIL-STD-202 METHOD 213 TEST CONDITION B D. CORROSION: MIL-STD-202 METHOD 101


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    06-Apr-10 19-May-10 MIL-STD-202implicatioin 20-May-10 HD-BNC 4028 BE 800REF PDF

    Option Information

    Abstract: No abstract text available
    Text: Work-In-Progress Option Information www.vishay.com Vishay Siliconix MIL-PRF-38535 Class Level B Process Flow MIL-STD-883/M5004 INTERNAL VISUAL METHOD 2010 CONDITION B TEMP CYCLE METHOD 1010 CONDITION C CONSTANT ACCELERATION METHOD 2001 CONDITION E PRE-BURNIN ELECTRICAL


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    MIL-PRF-38535 MIL-STD-883/M5004) HETD-883/M5004) 28-Apr-15 Option Information PDF

    no-go

    Abstract: No abstract text available
    Text: HVCMOS IC Process Option Flows RB PRODUCT FLOW 1 (SIMILAR TO MIL-STD-883 CLASS B) RC PRODUCT FLOW COMMERICAL PRODUCT FLOW Preseal Visual Method 2010, Condition B Preseal Visual Method 2010, Condition B Temperature Cycle (2) Method 1010, Condition C, 10 Cycles, -65°C to + 150°C


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    MIL-STD-883 MIL-STD-883. MIL-STD-883 no-go PDF

    an5241

    Abstract: ADJD-J823 new bright J82-3 AV02-1422EN new bright R288-2
    Text: ADJD-J823 Method of Fast Brightness Change Using BRIGHT Register of ADJD-J823 Application Note 5398 Introduction Description of Method This application note describes a method to speed up brightness change using BRIGHT register of the ADJD-J823 color management controller. This method is an extension


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    ADJD-J823 AN5241. ADJD-J823. AV02-1422EN an5241 ADJD-J823 new bright J82-3 new bright R288-2 PDF

    UP Board Exam Date Sheet 2012 for Intermediate

    Abstract: sem 5025 MIL-STD-883H INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION QML-38535 INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION report MARKING CODE 883H
    Text: MIL-STD-883H METHOD 5001 PARAMETER MEAN VALUE CONTROL 1. PURPOSE. The purpose of this method is to define a technique for assuring a conformance to a maximum or minimum mean of a parameter measured in any test method listed in section 3000 and 4000 of this standard. This method


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    MIL-STD-883H UP Board Exam Date Sheet 2012 for Intermediate sem 5025 MIL-STD-883H INCOMING RAW MATERIAL INSPECTION format INCOMING RAW MATERIAL INSPECTION QML-38535 INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION report MARKING CODE 883H PDF

    Untitled

    Abstract: No abstract text available
    Text: Environmental / Mechanical Specifications F5 C A L IB E R E L E C T R O N IC S IN C . MECHANICAL Shock: MIL-STD-883C, Method 2002, Condition B Solderability: MIL-STD-883C, Method 2003 Vibration MIL-STD-883C, Method 2007, Condition A Terminal Strength: MIL-STD-202F, Method 211, Conditions A and C


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    MIL-STD-883C, MIL-STD-202F, PDF

    mil-std-202

    Abstract: mil-std-202 101D 101D 106F "MIL-STD-202" "METHOD 302" "CONDITION B"
    Text: 2 WEATHERTIGHT CONNECTORS PRODUCT BULLETIN 541 Specifications continued Environmental Temperature Limits: -40°C to +65°C non-operating Moisture Resistance: Mil-Std 202 Method 106F Insulation Resistance: Mil-Std 202 Method 302 condition B Thermal Shock: Mil-Std 202 Method 107G


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    IP16/IP18 IP66/IP68 mil-std-202 mil-std-202 101D 101D 106F "MIL-STD-202" "METHOD 302" "CONDITION B" PDF

    Untitled

    Abstract: No abstract text available
    Text: 3M Electrically Conductive Connector Covers Properties Material Properties Property Test Method Typical Value Resistivity ASTM D991 <105 ohm-cm Contact Corrosivity Kovar plate FTM 101C Method 3005 Pass Crayoning 3M Not visible Elongation ASTM D638 25%


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    transistor 1015

    Abstract: No abstract text available
    Text: Digital ASIC Military Class B Product Flow SPC, QC Monitors Wafer Fabrication SPC, QC Monitors Wafer Sort Electrical Test SPC, QC Monitors Saw, Die Attach and Wire Bond SPC, QC Monitors Internal Visual Method 2010, Condition B Mechanical Tests Method 2011 and Method 2019


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    c code for convolution

    Abstract: Spectrum Signal Processing
    Text: CHAPTER FFT Convolution 18 This chapter presents two important DSP techniques, the overlap-add method, and FFT convolution. The overlap-add method is used to break long signals into smaller segments for easier processing. FFT convolution uses the overlap-add method together with the Fast Fourier


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    Untitled

    Abstract: No abstract text available
    Text: CFPV-45, -46 ISSUE 2; 18 OCTOBER 2004 Delivery Options • Please contact our sales office for current leadtimes Environmental Specification ■ Mechanical shock per MIL-STD-202, Method 213, Cond. E. ■ Thermal shock per MIL-STD-883, Method 1011, Cond. A


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    CFPV-45, MIL-STD-202, MIL-STD-883, 10LSTTL 100ppm CFPV-45 PDF

    method d 1071

    Abstract: LTPD
    Text: DMOS Process Option Flow Chart DMOS ARRAY RB FLOW 1 (SIMILAR TO MIL-STD-883 CLASS B) Preseal Visual Method 2010, Condition B Temperature Cycle Method 1010, Condition C, 10 Cycles, -65°C to +150°C 10 minutes minimum @ each temperature extreme Constant Acceleration


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    MIL-STD-883 MIL-STD-750 MIL-STD-750 method d 1071 LTPD PDF

    MSK196RH

    Abstract: No abstract text available
    Text: MIL-PRF-38534 AND 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. 196RH RAD HARD PRECISION RAIL TO RAIL CURRENT SENSE FEATURES: Manufactured using RH6105 Dice Radiation Hardened to 100 Krad Si (Method 1019.7 Condition A) Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)


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    MIL-PRF-38534 196RH RH6105 MIL-PRF-38535 MIL-PRF38534 MSK196RH PDF

    K/MSK496EDU

    Abstract: No abstract text available
    Text: MIL-PRF-38534 & 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. RAD HARD QUAD PRECISION RAIL TO RAIL CURRENT SENSE AMP 496RH FEATURES: Manufactured using RH6105 Dice Radiation Hardened to 100 Krad Si (Method 1019.7 Condition A) Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)


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    MIL-PRF-38534 496RH RH6105 5X1011 MIL-PRF-38534 MSK496EDUG. K/MSK496EDU PDF

    Untitled

    Abstract: No abstract text available
    Text: MIL-PRF-38534 & 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. RAD HARD QUAD PRECISION RAIL TO RAIL CURRENT SENSE AMP 496RH FEATURES: Manufactured using RH6105 Dice Radiation Hardened to 100 Krad Si (Method 1019.7 Condition A) Low Dose Rate Hardened to 50 Krad(Si) (Method 1019.7 Condition D)


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    MIL-PRF-38534 496RH RH6105 5X1011 MIL-PRF-38534 MSK496EDUG. PDF

    pic18f4520 pin diagram

    Abstract: PIC18F4550 indirect addressing microchip pic18f4550 pic18f4xx DS39622 pic18F4550 configuration PIC18F4585 PIC18F4580 example code PIC18F2321 PIC18F2423
    Text: PIC18F2XXX/4XXX FAMILY Flash Microcontroller Programming Specification 1.0 DEVICE OVERVIEW ICSP method is slightly different than the high-voltage method and these differences are noted where applicable. This document includes the programming specifications


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    PIC18F2XXX/4XXX PIC18F2221 PIC18F2580 PIC18F2321 PIC18F2585 PIC18F4510 PIC18F2410 PIC18F2610 PIC18F4515 PIC18F2420 pic18f4520 pin diagram PIC18F4550 indirect addressing microchip pic18f4550 pic18f4xx DS39622 pic18F4550 configuration PIC18F4585 PIC18F4580 example code PIC18F2321 PIC18F2423 PDF

    pic18f4520 pin diagram

    Abstract: PIC18F2550 icsp PIC18F4580 example code PIC18F2XXX pic18F4550 configuration PIC18F4620 analog port number pic18f2550 program load circuit free PIC18F4XXX PIC18F2450 usb PIC18F2553
    Text: PIC18F2XXX/4XXX FAMILY Flash Microcontroller Programming Specification 1.0 DEVICE OVERVIEW ICSP method is slightly different than the high-voltage method and these differences are noted where applicable. This document includes the programming specifications


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    PIC18F2XXX/4XXX PIC18F2221 PIC18F2580 PIC18F2321 PIC18F2585 PIC18F4510 PIC18F2410 PIC18F2610 PIC18F4515 PIC18F2420 pic18f4520 pin diagram PIC18F2550 icsp PIC18F4580 example code PIC18F2XXX pic18F4550 configuration PIC18F4620 analog port number pic18f2550 program load circuit free PIC18F4XXX PIC18F2450 usb PIC18F2553 PDF

    pioneer pll

    Abstract: simple F.M. transmitter understanding thermal basics for microwave power CP-01052-1
    Text: DesignCon 2009 A New Jitter Classification Method Based on Statistical, Physical, and Spectroscopic Mechanisms Mike Li, Ph.D., Altera Corporation CP-01052-1.0 February 2009 Abstract This paper introduces a new jitter classification method based on jitter physical mechanisms


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    CP-01052-1 pioneer pll simple F.M. transmitter understanding thermal basics for microwave power PDF

    LAMBDA lrs

    Abstract: lrs-55-28 LRS-57-28 LRS-55-5 Lambda LRS-54-20 lrs 50-5 lrs-52-6 LRS-53-28 LRS-55-24 LRS-57-5
    Text: PART IA-AC-TO-DC SWITCHING POWER SUPPLIES CD Passed environmental tests in accordance with MIL-STD-810C. Low Pressure — Method 500.1, Proc. I. High Temperature — Method 501.1, Proc. I & II. Low Temperature — Method 502.1, Proc. I. Temperature Shock — Method 503.1, Proc. I.


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    M1L-STD-810C. MIL-STD-461A LRS-55 LRS-56 SERV50NG, LRS-55. LRS-57 LRS-58 LAMBDA lrs lrs-55-28 LRS-57-28 LRS-55-5 Lambda LRS-54-20 lrs 50-5 lrs-52-6 LRS-53-28 LRS-55-24 LRS-57-5 PDF

    Ac 472 m

    Abstract: No abstract text available
    Text: Axial Leads/Glass Encapsulation GENERAL DESCRIPTION Lead Pull & Torsion per MIL-STD-202, Method 211, Condition A & D Resistance to Soldering Heat perMIL-STD-202,Method210, Condition B Vibration and Shock per MIL-STD-202, Method 204, Condition B and Method 213, Condition I


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    MIL-STD-202, perMIL-STD-202 Method210, MIL-C-39014 Ac 472 m PDF

    Untitled

    Abstract: No abstract text available
    Text: Noise, MIL-STD-202, Method 308 -20 dB max. Moisture resistance, MIL-STD-202, Method 106, hermetic applications ±0.2% max. R/R Stability, 1000 hr., +125°C, 65mw ±0.2% max. R/R Operating temperature range -55°C to +125°C Thermal shock, MIL-STD-202, Method 107, Test Condition F


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    MIL-STD-202, 25ppm 35ppm 50ppm MIL-STD-883 PDF

    Untitled

    Abstract: No abstract text available
    Text: Noise, MIL-STD-202, Method 308 -20 dB max. Moisture resistance, MIL-STD-202, Method 106 - Hermetic applications ±0.2% max. R/R Stability, 1000 hr., +125°C, 100mw ±0.2% max. R/R Operating tem perature range -55°C to +125°C Thermal shock, MIL-STD-202, Method 107, Test Condition F


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    MIL-STD-202, 100mw 100mw, 25ppm 35ppm 50ppm MIL-STD-883 PDF

    M/mrf 405

    Abstract: No abstract text available
    Text: MILITARY KNOBS MS91528, QPL LISTED M A T E R IA L ; KNOB: Molded of polycarbonate self extinguishing thermoplastic. Matte Finish. (Method 111 of Ml L-Std 202) M ETAL IN S E R T ; Aluminum, plated to withstand salt spray. (Method 101, test condition B, of Ml L-Std 202)


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    MS91528, FF-S-103 M/mrf 405 PDF