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    METALLIZATION Search Results

    METALLIZATION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPHR7404PU Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 0.00074 Ω@10V, SOP Advance, U-MOS-H Visit Toshiba Electronic Devices & Storage Corporation
    MG800FXF1JMS3 Toshiba Electronic Devices & Storage Corporation N-ch SiC MOSFET Module, 3300 V, 800 A, iXPLV, High-side: SiC SBD、Low-side: SiC MOSFET Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation
    TK7R0E08QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB Visit Toshiba Electronic Devices & Storage Corporation
    XPJ1R004PB Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 160 A, 0.001 Ω@10V, S-TOGL Visit Toshiba Electronic Devices & Storage Corporation
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    METALLIZATION Price and Stock

    TE Connectivity SDF-METAL

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com SDF-METAL 50
    • 1 $0
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    • 100 $0
    • 1000 $0
    • 10000 $0
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    Phoenix Contact HSH-METALL

    Shield connection - material: Metal - Suitable for PH 2,5/... cable housings - color: silver/black
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com HSH-METALL
    • 1 -
    • 10 $13.06
    • 100 $10.23
    • 1000 $9.69
    • 10000 $9.69
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    IDEC Corporation ABN3B-G-METAL

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com ABN3B-G-METAL
    • 1 -
    • 10 $3.31
    • 100 $2.77
    • 1000 $2.36
    • 10000 $2.2
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    Belden Inc SR050-GRY/METALLIC-4801

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com SR050-GRY/METALLIC-4801
    • 1 -
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    • 100 $0.991
    • 1000 $0.736
    • 10000 $0.666
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    IDEC Corporation ABN3B-B-METAL

    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com ABN3B-B-METAL
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    • 10 $3.46
    • 100 $2.9
    • 1000 $2.47
    • 10000 $2.3
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    METALLIZATION Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    LT3973-3.3

    Abstract: CDR01-CDR06 C1206 KEMET packaging PEF55801VV1.3 CDR05BX823BKW CDR31-CDR35 MIL-PRF-55681 kemet 31G-4 CDR02 LT1432-3.3
    Text: CERAMIC CHIP/MIL-PRF-55681 KEMET CAPACITOR OUTLINE DRAWINGS CHIP DIMENSIONS “SOLDERGUARD I” * SOLDER L W “SOLDERGUARD II” T TINNED BW NICKEL ELECTRODES SILVER METALLIZATION NICKEL ELECTRODES Military Designation - “S” or “U” KEMET Designation - “H”


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    CHIP/MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 LT3973-3.3 CDR01-CDR06 C1206 KEMET packaging PEF55801VV1.3 CDR05BX823BKW CDR31-CDR35 MIL-PRF-55681 kemet 31G-4 CDR02 LT1432-3.3 PDF

    55CU

    Abstract: No abstract text available
    Text: 0105 - 12 12 Watts, 28 Volts, Class AB Defcom 100 - 500 MHz GENERAL DESCRIPTION CASE OUTLINE The 0105-12 is a double input matched COMMON EMITTER broadband transistor specifically intended for use in the 100-500 MHz frequency band. It may be operated in Class AB or C. Gold metallization and silicon diffused


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    PDF

    MIL-PRF-55681

    Abstract: C180 cdr01 capacitors kemet capacitor c1206 CDR02 CDR03 CDR31 CDR32 CDR33 CDR01-CDR06
    Text: CERAMIC CHIP/MIL-PRF-55681 CAPACITOR OUTLINE DRAWINGS CHIP DIMENSIONS “SOLDERGUARD I” * SOLDER L W “SOLDERGUARD II” T TINNED BW NICKEL ELECTRODES SILVER METALLIZATION NICKEL ELECTRODES Military Designation - “S” or “U” KEMET Designation - “H”


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    CHIP/MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 MIL-PRF-55681 C180 cdr01 capacitors kemet capacitor c1206 CDR02 CDR03 CDR31 CDR32 CDR33 CDR01-CDR06 PDF

    rt6010

    Abstract: 2200uf, 63v electrolytic capacitor j453 transistor x 313 63v 2200uF 200B MDS140L 25-mils J345 1030 PULSED 32uS MODE-S
    Text: MDS140L 140 Watts, 50 Volts Pulsed Avionics 1030 to 1090 MHz GENERAL DESCRIPTION The MDS140L is a high power COMMON BASE bipolar transistor. It is designed for MODE-S ELM systems in the frequency band 1030-1090 MHz. The device has gold thin-film metallization and diffused ballasting for proven highest MTTF. The


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    MDS140L MDS140L rt6010 2200uf, 63v electrolytic capacitor j453 transistor x 313 63v 2200uF 200B 25-mils J345 1030 PULSED 32uS MODE-S PDF

    MS2205

    Abstract: No abstract text available
    Text: MS2205 RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS Features • • • • • • 1025-1150 MHz GOLD METALLIZATION INFINITE VSWR CAPABILITY @ RATED CONDITIONS Pout = 4 W MINIMUM GP= 10 dB COMMON BASE CONFIGURATION .280 2LFL M220 Epoxy Sealed DESCRIPTION:


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    MS2205 MS2205 400mW PDF

    88-108 mhz w power

    Abstract: 88-108 an power 88-108 mhz 55ht fm emitter 88-108 mhz Power w 88-108mhz fm transistor
    Text: FM 150 150 Watts, 28 Volts Broadcast 88 - 108 MHz GENERAL DESCRIPTION The FM 150 is a high power COMMON EMITTER bipolar transistor. It is designed for FM systems in the frequency band 88-108 MHz. The device has gold thin-film metallization and diffused ballasting for proven highest MTTF.


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    100Ma 88-108 mhz w power 88-108 an power 88-108 mhz 55ht fm emitter 88-108 mhz Power w 88-108mhz fm transistor PDF

    TAN15

    Abstract: No abstract text available
    Text: TAN15 15 Watts, 40 Volts, Pulsed Avionics 960 - 1215 MHz GENERAL DESCRIPTION The TAN15 is a COMMON BASE bipolar transistor. It is designed for pulsed systems in the frequency band 960-1215 MHz. The device has gold thin-film metallization and diffused ballasting for proven highest MTTF. The transistor


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    TAN15 TAN15 25oC2 PDF

    SD2941-10

    Abstract: EE-19 transformer SD2931-10 VK200
    Text: SD2941-10 RF power transistors HF/VHF/UHF N-channel MOSFETs General features • Gold metallization ■ Excellent thermal stability ■ Common source configuration ■ POUT = 175W min. with 15dB gain @ 175MHz ■ Low RDS on ■ Thermally enhanced packaging for lower


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    SD2941-10 175MHz SD2941-10 SD2931-10. EE-19 transformer SD2931-10 VK200 PDF

    1035 transistor

    Abstract: M.P transistor
    Text: 1035 MP 35 Watt, 50 Volts, Class C Avionics 1025 - 1150 MHz GENERAL DESCRIPTION The 1035 MP is a COMMON BASE bipolar transistor. It is designed for pulsed systems in the frequency band 1025-1150 MHz. The device has gold thin-film metallization for proven highest MTTF. The transistor includes


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    25oC2 1035 transistor M.P transistor PDF

    G200

    Abstract: f 0952
    Text: PTF 102028 18 Watts, 860–960 MHz GOLDMOS Field Effect Transistor Description The PTF 102028 is an 18–watt GOLDMOS FET intended for large signal amplifier applications 860 to 960 MHz. It operates with 55% efficiency and 15 dB gain. Nitride surface passivation and full gold metallization ensure excellent device lifetime and reliability.


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    P4525-ND P5182-ND 1-877-GOLDMOS 1522-PTF G200 f 0952 PDF

    55ay

    Abstract: DME150
    Text: DME 150 150 Watts, 50 Volts, Pulsed Avionics 1025 - 1150 MHz GENERAL DESCRIPTION The DME 150 is a high power COMMON BASE bipolar transistor. It is designed for pulsed systems in the frequency band 1025-1150 MHz. The device has gold thin-film metallization and diffused ballasting for proven


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    25oC2 DME150 55ay DME150 PDF

    Di 762 transistor

    Abstract: transistor a015 transistor npn a 1930 wacom connector wacom 33w NPN 13MM PH1920-33
    Text: an AMP company Wireless Bipolar Power Transistor, 33W 1930 - 1990 MHz PHI 920-33 v2.01 Features NPN Silicon Microwave Power Transistor Common Emitter Class AB Operation Internal Input and Output Impedance Matching Diffused Emitter Ballasting Gold Metallization System


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    PH1920-33 lN4245 73050258-S Di 762 transistor transistor a015 transistor npn a 1930 wacom connector wacom 33w NPN 13MM PH1920-33 PDF

    TGF1350

    Abstract: No abstract text available
    Text: Texas Instruments TGF1350 Low-Noise Microwave GaAs FET Features • 1.5-dB noise figure with 11 -dB associated gain at 10 GHz ■ 2.2-dB noise figure with 7-dB associated gain at 18 GHz ■ All-gold metallization ■ Recessed 1/2-^m gate structure ■ Si3N4 channel passivation


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    TGF1350 TGF1350 PDF

    1N3891 equivalent

    Abstract: 12v diode 10A
    Text: -Jolìtrm i Devices. Inc. [^ @QJJ©T ©ATTM, ' MEDIUM TO HIGH VOLTAGE CHIP N UM BER PINI EPITAXIAL PLANAR POWER DIODE CONTACT METALLIZATION Anode: > 50,000 A Aluminum Cathode: Gold Polished silicon or "Chrome Nickel Silver" also available Also available on:


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    457mm) 1N3889, 1N3890, 1N3891, 1N3892 C-122 1N3891 equivalent 12v diode 10A PDF

    Untitled

    Abstract: No abstract text available
    Text: -Ætttrun Ä \Y Ä [L VERY HIGH VOLTAGE, FAST SWITCHING Devices. Inc. NPN TRIPLE DIFFUSED PLANAR POWER TRANSISTOR CHIP NUM BER (FORMERLY 42 CONTACT METALLIZATION B ase a n d emitter: > 30,000 A Aluminum Collector: Gold (Polished silicon or "C hrom e Nickel S ilver" also available)


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    83mra) 203mm) JAN2N3902, JAN2N5157, SDT401, SDT430, 2N5466, 2N5468 PDF

    2N4307

    Abstract: No abstract text available
    Text: C o n t ra n Devices. Inc LOW TO MEDIUM VOLTAGE, FAST SWITCHING CHIP NUMBER NPN EPITAXIAL PLANAR POWER TRANSISTOR* * CONTACT METALLIZATION Base and emitter: > 30,000 A Aluminum Collector: Gold Polished silicon or "Chrome Nickel Silver" also available Also available on:


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    203mm) 2N4307 PDF

    Untitled

    Abstract: No abstract text available
    Text: -Æ tttran MEDIUM VOLTAGE, FAST RECOVERY Devices. Inc. CHIP NUMBER PIM EPITAXIAL FAST RECOVERY PLANAR POWER DIODE dfì CONTACT METALLIZATION Anode: > 50,000 A Aluminum Cathode: Gold Polished silicon or "Chrom e Nickel Silver" also available Mso available on:


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    305mm) C-125 PDF

    NPN Transistor 50A 400V

    Abstract: 1200PF
    Text: C o n tr a n Devices. Inc. MEDIUM TO HIGH VOLTAGE, HIGH CURRENT CHIP NUMBER NPN EPITAXIAL PLANAR POWER TRANSISTOR CONTACT METALLIZATION Base and emitter: > 50,000 A Aluminum Collector: Gold Polished silicon or "Chrome Nickel Silver” also available Also available on:


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    470mm 938mm 938mm) 508mm) 700mm) 524mm) 203mm) 10MHz NPN Transistor 50A 400V 1200PF PDF

    SDT13301-SDT13305

    Abstract: No abstract text available
    Text: C ^ isnuxmr ©ättail o n tra n Devices. Inc VERY HIGH VOLTAGE, FAST SWITCHING CHIP NUMBER _ IMPIM TRIPLE DIFFUSED PLANAR POWER TRANSISTOR CONTACT METALLIZATION B a se and emitter: > 50,000 A Aluminum Collector: Gold Polished silicon or "Chrom e Nickel Silver” also availab le


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    305mm) SDT13301-SDT13305 PDF

    1N3902

    Abstract: No abstract text available
    Text: ^ ©mKSTT ©ÄTTÄtL© =Æutnm MEDIUM TO HIGH VOLTAGE Devices. Inc. CHIP NUMBER PIM EPITAXIAL PLANAR POW ER DIODE CONTACT METALLIZATION Anode: > 50,000 A Aluminum Cathode: Gold Polished silicon or "Chrom e Nickel Silver" also available Also availab le on:


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    457mm) 1N3899. 1N3900, 1N3901, 1N3902 C-123 1N3902 PDF

    Transistors high frequency Bipolar NPN

    Abstract: No abstract text available
    Text: Temic S e m i <; <> n ! u c t o r s Features Benefits • Full range of matrices up to 1000 com ponents The Series A arrays are excellently suitable for the • Single-level metallization, second level possible production o f c u s to m e r specific integrated circuits


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    144pF Transistors high frequency Bipolar NPN PDF

    Untitled

    Abstract: No abstract text available
    Text: Contran Ä ¥Ä 1L© M E D IU M VOLTAGE, FAST SW ITCHING, HIGH GAIN Devices. Inc MONOLITHIC N P N EPITAXIAL PLANAR POWER DARLINGTON TR A N S IS TO R * (FORMERLY 0 3 ] CHIP NUMBER c -n CONTACT METALLIZATION B a se and emitter: > 30,000 A Aluminum Collector: Gold


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    203mm) PDF

    2N6261

    Abstract: No abstract text available
    Text: -Jiolitron [ ^ » © T ©ATTM.©' Devices. Inc MEDIUM VOLTAGE CH IP N UM BER NPN SINGLE DIFFUSED MESA TRANSISTOR FORMERLY 06 CONTACT METALLIZATION B ase, Emitter a n d Collector Solder C o ated 95/5% le ad /tin . ASSEMBLY RECOMMENDATIONS It is ad v isa b le that:


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    2N3054, 2N3441, 2N6260, 2N6261. 2N6263 C-110 2N6261 PDF

    Untitled

    Abstract: No abstract text available
    Text: K J iä \ß t U l i Semiconductors Intermittent- and Wipe/Wash Control for Wiper Systems Description With the U264xB, TEMIC Semiconductors developed a generate ”x” versions using different metallization family of intermittent- and wipe/wash control circuits for masks. Thus, it is easy to verify a broad range of time sewindshield or backlite wiper systems with identical basic quences which can be set independently of each other,


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    U264xB, D-74025 02-Dec-97 PDF