Untitled
Abstract: No abstract text available
Text: Microwave & RF Components & Subsystems Table of Contents. MCE / W einschel Corporation . . . . . . . . . . . . . . . . . . . . .2 MCE Technologies Inc. . . . . . . . . . . . . . . . . . . . . . . . . . .4 Express & Sickles Distribution Sales . . . . . . . . . . . . . . . .6
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Variable Attenuators to 2 GHZ
Abstract: No abstract text available
Text: MCE Technologies, Inc. Products and Services In 1952, MCE / Weinschel then Weinschel Engineering Co. , was the first to design and manufacture commercially available coaxial attenuators. Today, our product line includes a wide variety of standard and custom-designed fixed,
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relay srd
Abstract: No abstract text available
Text: MCE TECHNOLOGIES Products that make a world of difference MCE Technologies, Inc. is a world leader in the design, manufacture and marketing of microwave and RF devices, components and subsystems for wireless applications including cellular/ mobile GSM, WCDMA and CDMA2000 base stations, satellite, wireless
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CDMA2000
relay srd
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H.264 VGA encoder
Abstract: h264 encoder HC210 VGA h264 encoder EP2C35-6 H264-MCE
Text: Fully compatible with the ITU-T H.264 baseline specification H264-MCE Multi-channel HDTV H.264/AVC Baseline Video Encoder Megafunction Implements an independent hardware encoder for the H.264 Advanced Video Coding AVC Baseline profile video compression algorithm level 4.1). It can process up to 32
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H264-MCE
264/AVC
176x120
1920x1080
H.264 VGA encoder
h264 encoder
HC210
VGA h264 encoder
EP2C35-6
H264-MCE
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st 9431
Abstract: No abstract text available
Text: US Sales Representatives. 9 9 MCE / Weinschel Corporation 3 2 3 1 3 10 4 2 1 2 15 5 2 1 2 5 15 13 12 5 14 13 McNamara Associates, 5936 Busch Drive, Malibu, CA 90265, Tel: 310-457-4478 Express #: 800-542-4457 Fax: 775-261-5235 email: gjmc@aol.com 5 1 11
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414-545z
st 9431
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pt 7313
Abstract: "mm-wave" dk52
Text: US Sales Representatives. 9 9 MCE / Weinschel Corporation 3 2 3 1 3 10 4 2 1 2 15 5 2 1 2 5 15 13 12 5 14 13 McNamara Associates, 5936 Busch Drive, Malibu, CA 90265, Tel: 310-457-4478 Express #: 800-542-4457 Fax: 775-261-5235 email: gjmc@aol.com 5 1 11
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p-state amd processor
Abstract: AMD Mobile Sempron amd turion AMD xp datasheet turion sempron amd Athlon xp mobile AMD athlon 2005
Text: Processor Utilization with ® Microsoft Windows Media Center Edition on Systems Enabled with Cool'n'Quiet and AMD PowerNow!™ Technologies Application Note Publication # 33609 Revision: 3.00 Issue Date: May 2005 Advanced Micro Devices 2005 Advanced Micro Devices, Inc. All
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"Cool White Led"
Abstract: MacAdam A108-C cree led MacAdam LED JESD22 method a108-c MCE Semiconductor
Text: Cree XLamp® MC-E LED Reliability September 2008 This application note describes the types of failures common to high-power LEDs, details Cree’s pre-release qualification testing for XLamp MC-E, and includes the results of white-point-stability testing.
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CLD-AP23
"Cool White Led"
MacAdam
A108-C
cree led
MacAdam LED
JESD22
method a108-c
MCE Semiconductor
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A108-C
Abstract: "Cool White Led" macadam JESD22 method a108-c MCE Semiconductor
Text: Cree XLamp® MC-E LED Reliability September 2008 This application note describes the types of failures common to high-power LEDs, details Cree’s pre-release qualification testing for XLamp MC-E, and includes the results of white-point-stability testing.
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CLD-AP23
A108-C
"Cool White Led"
macadam
JESD22
method a108-c
MCE Semiconductor
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Untitled
Abstract: No abstract text available
Text: The company was founded in the 1940’s and offered the world’s first commercially available coaxial attenuators. In 1952, the company founders formed Weinschel Engineering Co., and continued to pursue the advancement of microwave technologies. In 1994, Weinschel’s
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BS5750:
Q9001-1994.
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dk52
Abstract: weinschel 210 SEKI ST 22
Text: A dapters, Planar & Blind-mate Connector Systems & dc Blocks 197 General Information In this section of the catalog, each product is outlined utilizing individual data sheets containing product features, specifications, and outline drawings. These data sheets are preceded by a quick reference guide to help you select the
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dc-26
F1513
M1513
dk52
weinschel 210
SEKI ST 22
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transistor marking A21
Abstract: No abstract text available
Text: Renesas LSIs M6MGB/T64BM17AWG-P 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 16,777,216-BIT (1,048,576-WORD BY 16-BIT) CMOS mobileRAM & Stacked-CSP ( Chip Scale Package) Description The M6MGB/T64BM17AWG-P is suitable for a high performance cellular phone and a mobile PC that are required to be small
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M6MGB/T64BM17AWG-P
864-BIT
304-WORD
16-BIT)
216-BIT
576-WORD
M6MGB/T64BM17AWG-P
64M-bit
transistor marking A21
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mobile phone circuit diagram
Abstract: mobile circuit diagram making a10
Text: Renesas LSIs M6MGB/T647M17AKT 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 16,777,216-BIT (1,048,576-WORD BY 16-BIT) CMOS MOBILE RAM & Stacked-uMCP (micro Multi Chip Package) Description The M6MGB/T647M17AKT is a Stacked micro Multi Chip Package (S-uMCP) that contents 64M-bit Flash memory and
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M6MGB/T647M17AKT
864-BIT
304-WORD
16-BIT)
216-BIT
576-WORD
M6MGB/T647M17AKT
64M-bit
16M-bit
mobile phone circuit diagram
mobile circuit diagram
making a10
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mobile circuit diagram
Abstract: No abstract text available
Text: Renesas LSIs M6MGB/T647M33KT 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM & Stacked-µMCP (micro Multi Chip Package) Description The M6MGB/T647M33KT is a Stacked micro Multi Chip Package (S-µMCP) that contents 64M-bit Flash memory and
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M6MGB/T647M33KT
864-BIT
304-WORD
16-BIT)
432-BIT
152-WORD
M6MGB/T647M33KT
64M-bit
32M-bit
mobile circuit diagram
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mobile phone circuit diagram
Abstract: mobile circuit diagram free mobile phone circuit diagram
Text: Renesas LSIs M6MGB/T647M17AKT 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 16,777,216-BIT (1,048,576-WORD BY 16-BIT) CMOS MOBILE RAM & Stacked-uMCP (micro Multi Chip Package) Description The M6MGB/T647M17AKT is a Stacked micro Multi Chip Package (S-uMCP) that contents 64M-bit Flash memory and
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M6MGB/T647M17AKT
864-BIT
304-WORD
16-BIT)
216-BIT
576-WORD
M6MGB/T647M17AKT
64M-bit
16M-bit
mobile phone circuit diagram
mobile circuit diagram
free mobile phone circuit diagram
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M6MGD137W34DWG-P
Abstract: mobile circuit diagram MCE Semiconductor
Text: Renesas LSIs M6MGD137W34DWG-P 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD137W34DWG-P is a Stacked Chip Scale Package The M6MGD137W34DWG-P is suitable for a high
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M6MGD137W34DWG-P
728-BIT
608-WORD
16-BIT)
432-BIT
152-WORD
M6MGD137W34DWG-P
128M-bit
mobile circuit diagram
MCE Semiconductor
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transistor marking A21
Abstract: mobile phone circuit diagram A20 marking mobile circuit diagram M6MGD13TW34DWG-P
Text: Renesas LSIs M6MGD13TW34DWG-P 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD13TW34DWG-P is a Stacked Chip Scale Package (S-CSP) that contents 128M-bit Flash memory and
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M6MGD13TW34DWG-P
728-BIT
608-WORD
16-BIT)
432-BIT
152-WORD
M6MGD13TW34DWG-P
128M-bit
32M-bit
transistor marking A21
mobile phone circuit diagram
A20 marking
mobile circuit diagram
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mobile circuit diagram
Abstract: mobile phone circuit diagram free mobile phone circuit diagram transistor marking A21 A20 marking
Text: Renesas LSIs M6MGB/T64BM34CWG 67,108,864-BIT 4,194,304-WORD BY 16-BIT CMOS FLASH MEMORY 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM & Stacked-CSP ( Chip Scale Package) Description The M6MGB/T64BM34CWG is a Stacked Chip Scale The M6MGB/T64BM34CWG is suitable for a high
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M6MGB/T64BM34CWG
864-BIT
304-WORD
16-BIT)
432-BIT
152-WORD
M6MGB/T64BM34CWG
64M-bit
mobile circuit diagram
mobile phone circuit diagram
free mobile phone circuit diagram
transistor marking A21
A20 marking
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a22 package marking
Abstract: transistor marking A21 making a10 mobile circuit diagram mobile phone circuit diagram M6MGE13VW34DWG-P
Text: RENESAS LSIs Preliminary Notice: This is not a final specification. Some parametric limits are subject to change. M6MGE13VW34DWG-P 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package)
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M6MGE13VW34DWG-P
728-BIT
608-WORD
16-BIT)
432-BIT
152-WORD
M6MGE13VW34DWG-P
128M-bit
32M-bit
a22 package marking
transistor marking A21
making a10
mobile circuit diagram
mobile phone circuit diagram
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transistor marking A21
Abstract: mobile circuit diagram M6MGE13VW66CWG-P a7 moe
Text: RENESAS LSIs Preliminary Notice: This is not a final specification. Some parametric limits are subject to change. M6MGE13VW66CWG-P 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package)
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M6MGE13VW66CWG-P
728-BIT
608-WORD
16-BIT)
864-BIT
304-WORD
M6MGE13VW66CWG-P
128M-bit
64M-bit
transistor marking A21
mobile circuit diagram
a7 moe
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R11M3200ARAABG
Abstract: free mobile phone circuit diagram
Text: RENESAS LSIs Preliminary Notice: This is not a final specification. Some parametric limits are subject to change. R11M3200ARAABG 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS mobileRAM Stacked-CSP ( Chip Scale Package)
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R11M3200ARAABG
728-BIT
608-WORD
16-BIT)
432-BIT
152-WORD
R11M3200ARAABG
128M-bit
free mobile phone circuit diagram
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mobile circuit diagram
Abstract: mobile phone circuit diagram M6MGD15BM66CDG
Text: Preliminary RENESAS LSIs RENESAS CONFIDENTIAL Notice: This is not a final specification. Some parametric limits are subject to change. M6MGD15BM66CDG 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 67,108,864-BIT (4,194,304-WORD BY 16-BIT) CMOS MOBILE RAM
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M6MGD15BM66CDG
728-BIT
608-WORD
16-BIT)
864-BIT
304-WORD
M6MGD15BM66CDG
128M-bit
mobile circuit diagram
mobile phone circuit diagram
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mobile phone circuits diagrams
Abstract: mobile circuit diagram mobile phone circuit diagram M6MGD15BM34CDG free mobile phone circuit diagram
Text: RENESAS LSIs M6MGD15BM34CDG 134,217,728-BIT 8,388,608-WORD BY 16-BIT CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM Stacked-CSP ( Chip Scale Package) Description The M6MGD15BM34CDG is suitable for a high performance cellular phone and a mobile PC that are required to be small
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M6MGD15BM34CDG
728-BIT
608-WORD
16-BIT)
432-BIT
152-WORD
M6MGD15BM34CDG
128M-bit
mobile phone circuits diagrams
mobile circuit diagram
mobile phone circuit diagram
free mobile phone circuit diagram
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guidance radar
Abstract: No abstract text available
Text: mam The company was founded in the 1940’s and offered the world’s first commercially available coaxial attenuators. In 1952, the company founders formed Weinschel Engineering Co., and continued to pursue the advancement of microwave technologies. In 1994, Weinschel’s
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OCR Scan
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BS5750:
Q9001-1994.
guidance radar
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