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    Untitled

    Abstract: No abstract text available
    Text: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed


    Original     		PDF MBK103

    Untitled

    Abstract: No abstract text available
    Text: IC26_CHAPTER_4_2000_2.copy Page 1 Tuesday, May 23, 2000 12:51 PM CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 IC26_CHAPTER_4_2000_2.copy Page 2 Tuesday, May 23, 2000 12:51 PM Philips Semiconductors


    Original     		PDF MBK103

    heraeus pd944

    Abstract: heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint
    Text: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed


    Original     		PDF MLC742 heraeus pd944 heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint