60Co
Abstract: No abstract text available
Text: CHAPTER 7 SCINTILLATION COUNTING Radiation of various types is widely utilized for non-destructive inspection and testing such as in medical diagnosis, industrial inspection, material analysis and other diverse fields. In such applications, radiation detectors play an important role. There are various methods
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NS-33
60Co
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bellmouth
Abstract: crimp dimension tolerance crimp height tyco 53880
Text: Instruction Sheet Inspection of Crimped 408-3196 Power Lock Series 2 Contacts 53880-[ ] 08 SEP 08 1. INTRODUCTION be installed ONLY as shown in instruction material packaged with the connectors. ! 2. REVISION SUMMARY Inspect crimped contacts for “ACCEPT” or “REJECT”
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TCA 290
Abstract: HR05 FORM0263 HR93
Text: EMC Technology Procedure: STANDARD Document Number: High Reliability Acceptance Testing TP-8965 Rev.: C OPERATING Application: PROCEDURE HR Series Attenuators and Thermopads Written By: Original Issue Date: D. Raymond 11-28-03 Approved By: Approved By: Approved By:
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TP-8965
FORM0263
TCA 290
HR05
HR93
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transistor D1564
Abstract: D1564 d1564 transistor electrode oven calibration certificate formats MIL-STD-883H INCOMING RAW MATERIAL INSPECTION procedure rf A434 Hardness Tester SH 21 poly aluminum chloride UPS chloride linear plus
Text: MIL-STD-883H METHOD 5010.4 TEST PROCEDURES FOR COMPLEX MONOLITHIC MICROCIRCUITS 1. PURPOSE. This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the following levels of quality class level B and S and reliability
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MIL-STD-883H
MIL-PRF-38535
transistor D1564
D1564
d1564 transistor
electrode oven calibration certificate formats
MIL-STD-883H
INCOMING RAW MATERIAL INSPECTION procedure
rf A434
Hardness Tester SH 21
poly aluminum chloride
UPS chloride linear plus
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DAEWON tray tsop 48LD
Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon GRAINGER TRAY TSOP 56LD daewon TRAY DAEWON TSOP venturi meter
Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.4 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Procedures
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IPC-J-STD-001
Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
Text: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures
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INCOMING RAW MATERIAL INSPECTION procedure
Abstract: INCOMING RAW MATERIAL INSPECTION tabla PS-9406 Raychem Contacts D-602 INCOMING RAW MATERIAL INSPECTION method PS-9407 PS-D-098 T9926 cuidado del micrometro
Text: ICD Products Group Engineering Standard DCR: T992683 No: Rev: Date: Page: ES 61208 C May 19, 1999 1 of 40 Workmanship Standard For SolderTact Contacts 1. 1.1 Scope This Engineering Standard ES describes the inspection procedure for the manufacturing inspection and assembly requirements for the SolderTact® product line.
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T992683
D-602-0278
D-602-0288
D-602-0279
D-602-0289
INCOMING RAW MATERIAL INSPECTION procedure
INCOMING RAW MATERIAL INSPECTION
tabla
PS-9406
Raychem Contacts D-602
INCOMING RAW MATERIAL INSPECTION method
PS-9407
PS-D-098
T9926
cuidado del micrometro
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565435-5
Abstract: maintenance manual 565435-5
Text: Instruction Sheet 408-2648 AMP-TAPEMATIC* Crimping Dies This instruction sheet provides instructions on product application; and maintenance and inspection procedures for AMP–TAPEMATIC crimping dies. AMP–TAPEMATIC crimping dies 69930, 69931, 69932, 69954, 69955, and 69956 are used in the
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coppe307235-5
565435-5
maintenance manual 565435-5
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MDC 2301
Abstract: 74ACT04 J330 LM108 MIL-HDBK-263 National semiconductor die fr003 NSC die
Text: Name: ME MAS-2301 Department Specification Title:" GENERAL PROCEDURE FOR DIE AND WAFER SALES " Rev:"2.0" Page: 1 TABLE OF CONTENTS 1. PURPOSE 2 2. APPLICABLE DOCUMENTS 2 3. GENERAL INFORMATION 2 4. DIE AND WAFER PACKAGING SPECIFICATIONS 3 5. GENERAL INSPECTION CRITERIA
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MAS-2301
MDC 2301
74ACT04
J330
LM108
MIL-HDBK-263
National semiconductor die
fr003
NSC die
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PD9002
Abstract: comparison cd 4093 smd code marking a3a SCCB spec stanag LISTING 2N2369 military AQAP-1 IC cd 4093 CECC - Detail Specifications smd code marking a4a
Text: EXPERIENCE AND INNOVATION EXPERIENCE AND INNOVATION EXPERIENCE AND INNOVATION HIGH RELIABILITY and SCREENING OPTIONS DOC 2624 ISS 4 Contents 1. Introduction 1 2. Quality Approvals 2 3. Material Qualification 3 3.1 Header/Cap/Wire Approval Procedures 3.2 Die Approval Procedure
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168hrs
PD9002
comparison cd 4093
smd code marking a3a
SCCB spec
stanag LISTING
2N2369 military
AQAP-1
IC cd 4093
CECC - Detail Specifications
smd code marking a4a
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RCPS-100-70
Abstract: Raychem installation procedure rcps-100-70 RAY5103
Text: Tyco Electronics Corporation 300 Constitution Drive Menlo Park, CA 94025 U.S.A. Raychem Devices No: Rev: Date: Page RCPS-100-70 G August 7, 2007 1 of 10 Installation Procedure for Standard SolderSleeve Shield Terminators 1.0 Scope: This standard covers the installation procedure and inspection requirements for
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RCPS-100-70
SO175,
D-108,
B-023.
RCPS-100-70
Raychem installation procedure rcps-100-70
RAY5103
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hl2010e
Abstract: AD-1319 AT-1319-24 steinel Alpha 611 raychem ad-1319 raychem termination instructions ES-61218 Steinel hl2010e 979663 reflector
Text: Tyco Electronics Corporation 300 Constitution Drive Menlo Park, CA 94025 USA Raychem SolderTacts Specification: Rev: Date: Pages: ES-61218 C July 30, 2009 1 of 13 Termination Procedure for Size 12, Series “999” SolderTact Contacts for Twisted Pair Cable: D-602-0146, -0147
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ES-61218
D-602-0146,
D-602-0146
MIL-DTL-38999
D-602-0147
hl2010e
AD-1319
AT-1319-24
steinel
Alpha 611
raychem ad-1319
raychem termination instructions
ES-61218
Steinel hl2010e
979663 reflector
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82074
Abstract: 69710 40875 AMP catalog 82074
Text: Instruction Sheet 408–6775 Crimping Die Assembly 59993–1 Stationary Die Indenter Rev A 3. CRIMPING PROCEDURE Install dies according to the instructions packaged with the tooling. Then proceed as follows: NOTE Screw Movable Die (Anvil) Ferrule Crimping
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waffle
Abstract: No abstract text available
Text: CHIP SENTRY CARRIER OPENING PROCEDURE I C A U TIO N : ELECTROSTATIC SENSITIVE The die is an electrostatic sensitive device. Special handling methods and equipment must be used to prevent damage. 1. Ensure inspection area is ESD compliant. A clean room environment is desirable to minimize foreign material
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BS0001
Abstract: BS-0001 INCOMING RAW MATERIAL INSPECTION method centrifuge
Text: m o \ Reliability Program ELECTRONIC DESIGNS IN C . Quality Control Tests and Procedures Electronic Designs, Inc.'s continuing effort to be a leader in providing top quality products has lead us to com plete our m ission to become IS 09001 certified. The certification is the most comprehensive quality
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Hours/80
C/150
EP-00008
TP-00002
QP-00062
TP-00006
EP-00004,
EP-00005
QP-00062
BS0001
BS-0001
INCOMING RAW MATERIAL INSPECTION method
centrifuge
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Untitled
Abstract: No abstract text available
Text: c QUALITY ASSURANCE 3 Pulsar Microwave Corporation employs stringent quality assurance polices and procedures which are defined by our in house Quality Assurance Manual. Pulsar's Quality Assurance Manual encompasses the requirements of MIL-I-45208 Inspection Systems , MIL-STD-45662 (Calibration of Test Equipment) andMIL-STD-105
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MIL-I-45208
MIL-STD-45662
andMIL-STD-105
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Untitled
Abstract: No abstract text available
Text: 16 15 14 13 12 11 $ 10 a KEY PRODUCT CHARACTERISTIC SYMBOLS 0, INDICATE PRODUCT CHARACTERISTICS THAT REQUIRE SPECIAL CARE, DOCUMENTATION, AND ACCEPTANCE CRITERIA PER GM 1805 QN AND DELPHI PACKARD ELECTRIC SYSTEMS PROCEDURES. M KEY PRODUCT CHARACTERISTICS
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13510422
Abstract: No abstract text available
Text: 16 15 14 13 12 11 I 10 a KEY PRODUCT CHARACTERISTIC SYMBOLS 0, INDICATE PRODUCT CHARACTERISTICS THAT REQUIRE SPECIAL CARE, DOCUMENTATION, AND ACCEPTANCE CRITERIA PER GM 1805 QN AND DELPHI PACKARD ELECTRIC SYSTEMS PROCEDURES. M SYMBOL D E FIN ITIO N A DIMENSION WITHOUT AN INSPECTION REPORT SYMBOL
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17OC06
18-Jun-07
02SE04
13510422
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15443075
Abstract: Delphi PA66 121463
Text: 12 11 10 KEY PRODUCT CHARACTERISTIC SYMBOLS 0, INDICATE PRODUCT CHARACTERISTICS THAT REQUIRE SPECIAL CARE, DOCUMENTATION, AND ACCEPTANCE CRITERIA PER GM 1805 QN AND DELPHI PACKARD ELECTRIC SYSTEMS PROCEDURES. H I B SYMBOL D E FIN ITIO N MISSING SYMBOLS
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17OC06
07JN07
15443075
Delphi PA66
121463
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AMP crimper 69710-1
Abstract: BASE TOOL AMP crimper 69710-1 Instruction Sheet 408-2095 408-7424 AMP crimper 69710-1 408-2095 BASE TOOL AMP crimper 69710-1 manual RS-1019-5LP anvil crimp RS-1019-5L Amp 408-2095
Text: Instruction Sheet Crimping Die Assemblies 356611-1, 356611-2, and 356612-1 for POWERBAND* Contacts 408-4324 2 6 JA N 00 Rev a The contact support prevents the contact from bending during the crimping procedure. 3. CRIMPING PROCEDURE Install the die assembly in the tooling according to the
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Untitled
Abstract: No abstract text available
Text: •AMI Quality Program AMERICAN MICROSYSTEMS, INC. General Information August 1996 Introduction QA Operations checks all phases of the manufacturing process, including incoming materials, to insure adherence to specifications and procedures through the use of audits, inspections, and other monitoring
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MIL-I38535,
MIL-STD-883,
MIL-Q-9858
MIL-M-38510,
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AMP crimper 69710-1
Abstract: 69710-1 REV G BASE TOOL AMP crimper 69710-1 Dies for AMP crimper 69710-1 Amp 408-2095 AMP crimper Dies
Text: Crimping Die Assemblies Instruction Sheet 408-4324 356611-1, 356611-2, and 356612-1 for POWERB AND* Contacts 2 6 JA N 00 Rev a The contact support prevents the contact from bending during the crimping procedure. 3. CRIMPING PROCEDURE Install the die assembly in the tooling according to the
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5962-E296
Abstract: ce pe SMD switch rick jd SMD MARKING CODE A12 KL2 smd
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA Redrawn with changes. Delete vendor CAGE 27014 for PINs 01J, 01L, 013, 02J, 02L, 023, 03J, 03L, and 033. Add vendor CAGE 07933 for PINs 01J, 01X, and 01L. Change vendor CAGE 18324 similar PIN for devices 03J and 033. Remove programming procedures, waveforms and
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MIL-BUL-103.
MIL-BUL-103
5962-E296
ce pe SMD switch
rick jd
SMD MARKING CODE A12
KL2 smd
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MSC 5010
Abstract: Microwave Semiconductors MIL883 leak
Text: SIEMENS 1 HiRel Discrete and Microwave Semiconductors Preliminary Remarks This paragraph gives an overview on the HiRel Discrete and Microwave Semiconductors available from Siemens. For detailed descriptions, screening procedures and quality specifications as well as full data sheets, please refer to our “HiRel Discrete and
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