material composition
Abstract: No abstract text available
Text: Material Composition Specification SOD-923 Case Pb lead -free plating Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material
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OD-923
material composition
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E 70 5059
Abstract: material composition 223-18 74 AG 393 6363
Text: Material Composition Specification SMDIP Case Pb lead -free plating* Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mg Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10% Material Component
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Untitled
Abstract: No abstract text available
Text: HM79S-63470LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire SOLDER Lead Free Solder 3 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition
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HM79S-63470LF
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Untitled
Abstract: No abstract text available
Text: HM78-10150LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder 4 ADHESIVE Epoxy Resin Element Composition CAS No Material Mass Composition g
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HM78-10150LF
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Untitled
Abstract: No abstract text available
Text: HM79-103R3LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Ferrite Core 2 COIL Polyurethane Enamelled Copper Wire 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Iron Oxide Copper Oxide
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HM79-103R3LF
HM79-20220LF
HM79-60331LF
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Untitled
Abstract: No abstract text available
Text: HM12-10001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-10001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM41-11510LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc
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HM41-11510LF
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Untitled
Abstract: No abstract text available
Text: HM31-20050LF summary material content, BI Technologies Corporation Index Item Material Name Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide Material Mass mg Composition (mg) 1309-37-1 8051-03-4 1313-99-1 1317-38-0 2410 2048.5 120.5
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HM31-20050LF
744ide
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Untitled
Abstract: No abstract text available
Text: HM12-03501LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-03501LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM12-15001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-15001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM31-21050LF summary material content, BI Technologies Corporation Index Item Material Name Element Composition Ferric Oxide Zinc Oxide Nickel Oxide Cupric Oxide Material Mass mg Composition (mg) 1309-37-1 8051-03-4 1313-99-1 1317-38-0 1870 1589.5 93.5 93.5
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HM31-21050LF
7440-Oxide
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Untitled
Abstract: No abstract text available
Text: HM12-01001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-01001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM41-20105LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc
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HM41-20105LF
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Untitled
Abstract: No abstract text available
Text: HM12-06001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-06001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM12-02502LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-02502LF
TB2272
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methanol
Abstract: No abstract text available
Text: 21-Jul-09 HM72A-06R47LFTR summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Tooled Part 2 COIL Wire 3 LEAD Lead Frame Ink 4 MARKING Ink Element Composition CAS No Material Mass Composition g (g) Iron Magnesium Silicon
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21-Jul-09
HM72A-06R47LFTR
78-93-3ame
methanol
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Untitled
Abstract: No abstract text available
Text: HM41-10812LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc
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HM41-10812LF
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Untitled
Abstract: No abstract text available
Text: HM12-16001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-16001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM41-12020LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core NY UEW-H 2 WIRE Triple Insulation 3 4 BODY SOLDER Holder Lead Free Solder CAS No Material Mass mg Composition (mg) Nickel Zinc Ferrite Manganese Zinc
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HM41-12020LF
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Untitled
Abstract: No abstract text available
Text: HM54-44R42VLF summary material content, BI Technologies Corporation Index Item Material Name Element Composition CAS No Material Mass mg Composition (mg) 7439-89-6 - 1730 1712.7 10.38 6.92 1 CORE Toroid Core Iron Binder Lubricant 2 WIRE NY UEW-H Copper Polyurethane (PU)
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HM54-44R42VLF
HM54-50R60VLF
HM54-60R86VLF
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Untitled
Abstract: No abstract text available
Text: HM12-07001LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE Toroid Core 3 WIRE NY UEW 4 5 6 BASE ADDHESIVE SOLDER Holder Epoxy TB2272 Lead Free Solder CAS No Material Mass mg Composition (mg) Iron(Fe) Lubricant (Lube)
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HM12-07001LF
TB2272
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Untitled
Abstract: No abstract text available
Text: HM69-10R025LF summary material content, BI Technologies Corporation Index Item Material Name 1 CORE NP2 2 COIL Copper Strip 3 SOLDER Lead Free Solder Element Composition CAS No Material Mass Composition g (g) Fe2O3 Mn3O4 ZnO 1309-37-1 1317-35-7 1314-13-2
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HM69-10R025LF
HM69-20R050LF
HM69-80R30LF
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Untitled
Abstract: No abstract text available
Text: BHCL 322522 summary material content, BI Technologies Corporation Index 1 Item CORE Material Name Element Composition CAS No Material Mass mg Composition (mg) 11.00 6.490 1.320 0.990 2.200 Ferrite Fe2O3 NiO CuO ZnO 1309-37-1 1313-99-1 1317-38-0 1314-13-2
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Untitled
Abstract: No abstract text available
Text: M Series Pin and Socket Connectors Catalog 82003 Revised 8-96 Material Specifications Contacts Material Specifications The material composition and construction of AMP contacts encompass vary ing price ranges and performance characteris tics. Specific materials and
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OCR Scan
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MIL-M-14,
E28476
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