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    MAT10040 Search Results

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    MAT10040 Price and Stock

    MACOM MAT10040

    RF ATTENUATOR 4DB DIE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MAT10040 Tray 2,400 100
    • 1 -
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    • 100 $14.7937
    • 1000 $13.03279
    • 10000 $13.03279
    		Buy Now
    Mouser Electronics MAT10040 100
    • 1 -
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    • 100 $11.58
    • 1000 $11.58
    • 10000 $11.58
    		Buy Now
    Richardson RFPD MAT10040 1
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    MAT10040 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    MAT10040 M/A-Com RF/IF and RFID - Attenuators - RF ATTENUATOR 4DB DIE Original PDF

    MAT10040 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MSPD2018

    Abstract: MZBD-9161 ZENER 15B1 msd700 package inductance MSPD2018-H50 B20 zener diode glass MPN7320 MZBD9161 MLP7121 15B1 zener diode
    Text: Aeroflex / Metelics, Inc. Microwave Diodes & Passive Semiconductor Devices Microwave Diodes & Passive Semiconductor Devices Aeroflex / Metelics, Inc. Aeroflex / Metelics, Inc. East Coast Operations 54 Grenier Field Road, Londonderry, NH 03053 Tel: 603 641-3800


    Original     		PDF foc17091 MSPD2018 MZBD-9161 ZENER 15B1 msd700 package inductance MSPD2018-H50 B20 zener diode glass MPN7320 MZBD9161 MLP7121 15B1 zener diode

    MAT10030

    Abstract: Aeroflex / Metelics
    Text: Attenuator Pads MAT Series Datasheet RoHS General Information These fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped


    Original     		PDF

    MAT10030

    Abstract: MAT10060 MAT10020 MAT100 MAT10080 MAT10300 mat10010 MAT10070 MAT10040 MAT10100
    Text: Attenuator Pads MAT Series Datasheet RoHS General Information These fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped


    Original     		PDF