TLR 308
Abstract: MLT 22 706 MLT 22 542 indigo MARKING 1F mlt 22 814 RK73G 0603 black marking color SG73P kt 814
Text: Appendix D marking and standard values KSE Part Designation RK73B RK73Z RK73H RK73G RK73A KSE Part Designation Color Body Marking 1F 01005 1H (0201) 1E (0402) 1J (0603) 2A (0805) 2B (1206) 2E (1210) 2H (2010) 3A (2512) 1F,1H 1E (0402) 1J (0603) 2A (0805)
|
Original
|
PDF
|
RK73Z
RK73H
RK73G
RK73A
RK73B
TLR 308
MLT 22 706
MLT 22 542
indigo
MARKING 1F
mlt 22 814
RK73G
0603 black marking color
SG73P
kt 814
|
SG73P-RT
Abstract: RK73G-RT MLT 22 634 SG73S-RT HV73-RT RK73H-RT WK73-RT
Text: Appendix D marking and standard values marking Color KSE Part Designation Body 1F 01005 1H (0201) 1E (0402) 1J (0603) RK73B 2A (0805) RK73B-RT 2B (1206) 2E (1210) 2H (2010) 3A (2512) 1F,1H 1E (0402) 1J (0603) RK73Z 2A (0805) RK73Z-RT 2B (1206) 2E (1210)
|
Original
|
PDF
|
RK73B
RK73B-RT
RK73Z
RK73Z-RT
RK73H
RK73H-RT
E-192
SG73P-RT
RK73G-RT
MLT 22 634
SG73S-RT
HV73-RT
WK73-RT
|
CND2A10Y
Abstract: No abstract text available
Text: CND resistors bussed square corner resistor array features • • • • • Manufactured to type RK73 standards Concave or convex terminations Less board space than individual chips Eight bussed resistor elements included in one array Marking: Marked with resistance value
|
Original
|
PDF
|
2B10V
1J10Y
2A10Y
1J10K
MIL-STD-202,
CND2A10Y
|
CND1J
Abstract: array resistor datasheet mil CND1J10K CND1J10Y RK73
Text: CND resistors bussed square corner resistor array features • • • • • • Manufactured to type RK73 standards Concave or convex terminations Less board space than individual chips Eight bussed resistor elements included in one array Marking: Marked with resistance value
|
Original
|
PDF
|
1J10VK
1J10Y
2B10V
MIL-STD-202,
CND1J
array resistor datasheet mil
CND1J10K
CND1J10Y
RK73
|
Untitled
Abstract: No abstract text available
Text: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Electrode Ceramic substrate IDENTIFICATION COATING COLOR TYPE MARKING White, 3 digits „•“ marks pin 1 & 6 White, 3 digits
|
Original
|
PDF
|
CND1J10VK,
CND2B10
CND1J10K
CND2B10V
CND1J10Y,
CND2A10Y
CND1J10
CND1J10Y
CND2B10
|
CND1J10Y
Abstract: CND2A10Y CND1J10VK
Text: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Electrode Ceramic substrate IDENTIFICATION COATING COLOR TYPE MARKING White, 3 digits „•“ marks pin 1 & 6 White, 3 digits
|
Original
|
PDF
|
CND1J10VK,
CND2B10
CND1J10K
CND2B10V
CND1J10Y,
CND2A10Y
CND1J10
CND2B10,
CND1J10Y
CND1J10VK
|
cnd2b10
Abstract: No abstract text available
Text: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Electrode Ceramic substrate IDENTIFICATION COATING COLOR TYPE MARKING White, 3 digits „•“ marks pin 1 & 6 White, 3 digits
|
Original
|
PDF
|
CND1J10K,
CND2B10
CND2B10V
CND1J10Y,
CND2A10Y
CND1J10K
CND1J10Y
CND2A10Y
CND1J10
|
Untitled
Abstract: No abstract text available
Text: CND resistors bussed square corner resistor array features • • • • • • Manufactured to type RK73 standards Concave or convex terminations Less board space than individual chips Eight bussed resistor elements included in one array Marking: Marked with resistance value
|
Original
|
PDF
|
2B10V
1J10Y
2A10Y
1J10K
MIL-STD-202,
|
Untitled
Abstract: No abstract text available
Text: Screw Connection Dual Level ̋"Plastic Body: Ron{cmidg"88.8"XQ ̋ Internal Bus: Uinxgr"rnctgd"corrgr ̋"Clamp: Jcrdgngd"stggn."gngctro/ rnctgd"witj"|inc"{gnnow"cjromctgd ̋"Screws: Utggn."|inc"rnctgd"" cnd"{gnnow"cjromctgd ̋"Marking: 4"snots"on"dotj"" sides
|
Original
|
PDF
|
34/46X
Uoni00203"
|
Untitled
Abstract: No abstract text available
Text: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS CONVEX OR CONCAVE TERM. DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Outer Electrode Ceramic substrate IDENTIFICATION COATING COLOR MARKING White, 3 digits „•“ marks pin 1 & 6
|
Original
|
PDF
|
CND1J10VK,
CND2B10
CND1J10K
CND2B10V
CND1J10Y,
CND2A10Y
D-25578
|
Untitled
Abstract: No abstract text available
Text: NETWORKS TECHNOLOGY OF TOMORROW BUSSED R-NETWORKS CONVEX OR CONCAVE TERM. DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Outer Electrode Ceramic substrate IDENTIFICATION COATING COLOR MARKING White, 3 digits „•“ marks pin 1 & 6
|
Original
|
PDF
|
CND1J10VK,
CND2B10
CND1J10K
CND2B10V
CND1J10Y,
CND2A10Y
D-25578
|
Untitled
Abstract: No abstract text available
Text: 6104500 5x20 Fuse ̋" Plastic Body: Rqn{cokfg"808 Fuse 6104110 5x20 LED 6104600 5x20 Disconnect ̋"Clamp: Jctfgpgf"uvggn."gngevtq/ rncvgf"ykvj"|kpe"{gnqy"ejtqocvgf ̋"Screws: Uvggn."|kpe"rncvgf"cpf" {gnnqy"ejtqocvgf ̋"Marking: 6"unqvu"qp"dqvj"ukfgu ̋"Tracking Resistance: "
|
Original
|
PDF
|
32/24X
|
CND1J
Abstract: CND1J10K CND1J10Y CND2B10 CND2B10V MARKING CND
Text: NETWORKS bussed r-networks CONVEX OR CONCAVE TERM. DUAL COMMON CND STRUCTURE 1 2 3 4 5 Protective coating Resistive Film Inner electrode Outer Electrode Ceramic substrate IDENTIFICATION COATING COLOR a b CND1J10VK , CND2B10 a CND1J10K Black CND2B10Vb CND1J10Y, CND2A10Y
|
Original
|
PDF
|
CND1J10VK
CND2B10
CND1J10Ka
CND2B10Vb
CND1J10Y,
CND2A10Y
D-25578
CND1J
CND1J10K
CND1J10Y
CND2B10
CND2B10V
MARKING CND
|
Untitled
Abstract: No abstract text available
Text: SS-217 Chip Networks Resistors Type CND2A10Y CERTIFIED 1. Scope of Application This specification applies to chip networks CND2A10Y produced by KOA Speer Electronics, Inc. 2. Type Designation The type designation shall be the following form: CND 2A 10 Y
|
Original
|
PDF
|
SS-217
CND2A10Y
CND2A10Y)
63mW/Element
|
|
|
TI QFN marking
Abstract: TPS59611
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE MATERIALS INFORMATION
|
Original
|
PDF
|
8-Apr-2009
TPS59611RHBR
TPS59611RHBT
TI QFN marking
TPS59611
|
2E9Z
Abstract: 2b5z
Text: KOA SPEER ELECTRONICS, INC. SS-217 R1 AHA 4/21/05 Chip Networks Resistors Type CNB & CND Series CERTIFIED CERTIFIED 1. Features • ■ ■ ■ Manufactured to type RK73 standards Four or eight bussed resistor elements included in one array Concave or convex termnations
|
Original
|
PDF
|
SS-217
1J10K
1J10Y
2A10Y
2B10V
2E9Z
2b5z
|
CND1J
Abstract: SS 3002 array resistor mil kt 814 CND1J10K CND1J10Y RK73
Text: SS-217 R2 6/4/07 1:29 PM Page 1 KOA SPEER ELECTRONICS, INC. SS-217 R2 AHA 6/04/07 Chip Networks Resistors Type CNB & CND Series CERTIFIED CERTIFIED 1. Features • ■ ■ ■ Concave or convex termnations Manufactured to type RK73 standards Four or eight bussed resistor elements included in one array
|
Original
|
PDF
|
SS-217
2005/95/EC
1J10K
1J10Y
2A10Y
2B10V
CND1J
SS 3002
array resistor mil
kt 814
CND1J10K
CND1J10Y
RK73
|
Untitled
Abstract: No abstract text available
Text: KOA SPEER ELECTRONICS, INC. SS-217 R4 AHA 8/16/12 Chip Networks Resistors Type CNB & CND Series CERTIFIED CERTIFIED 1. Features • Concave or convex termnations Manufactured to type RK73 standards ■ Four or eight bussed resistor elements included in one array ■ Less board space than individual chips
|
Original
|
PDF
|
SS-217
|
Untitled
Abstract: No abstract text available
Text: 0.500±0.02 12.70±0.61 0.22 5.59 0.083 2.11 0.16 4.00 0.19±0.006 4.7±0.15 0.211±0.012 5.35±0.30 0.45±0.006 11.4±0.15 0.083 2.11 Recommended Land Pattern 0.374 9.50 0.406 Max. 10.31 0.16 Max. 4.2 Input/ Output Input/ Output CND 0.0276±0.004 0.70±0.10
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE OPTION ADDENDUM
|
Original
|
PDF
|
11-Apr-2013
TPS59620RHAR
TPS59620RHAT
Level-2-260C-1
|
Cat3
Abstract: PAIR CAT3 25 Pair cable
Text: 25P Cat3 UTP with GEL , Direct burial Cable Specification 25x2×0.475 Cross Section Performance Electrical Characteristics: Impendance ohms Jacket Cndutor Insulation 17 16 18 6 5 15 19 7 4 14 2 20 8 1 3 12 13 21 9 10 11 25 22 23 24 Jacket Twisted pair Rip
|
Original
|
PDF
|
dB/100m)
ns/100m)
100x168
Cat3
PAIR
CAT3 25 Pair cable
|
Untitled
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact IMVP@list.ti.com. PACKAGE OPTION ADDENDUM
|
Original
|
PDF
|
1-May-2013
TPS51640ARSLR
Level-2-260C-1
1640A
TPS51640ARSLT
|
SN 4931
Abstract: No abstract text available
Text: Data sheet E 1/4.931 - 10497 CND. 4to precision resistor networks dual - in - line 22 – ceramic sandwich or conformal coating 45iV A dual - in - line ceramic package in an almost limitless variety of sizes and configurations. A rugged packaging technique with 4 - 22 leads that allows higher resistance integration than chip and wire ceramic packages.
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: TA4101F TOSHIBA TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC T A A 1 fl 1 F • M m ■ ■ ■ ■ UHF VHF MIX APPLICATION FEATURES • Double Balance circuit PIN ASSIGNMENT TOP VIEW MARKING 8 7 6 5 n n n n 8 7 6 5 n n n n / . / 4101F u
|
OCR Scan
|
PDF
|
TA4101F
4101F
860MHz
|
