2450BM15A0002
Abstract: 5400BL15B100 2450BM14A0002 microwave product 2450AT42A100 STLC2690 inductor marking Johanson Technology 2450FB15L0001 bluetooth BC05 5400BL15B050
Text: CH EA ce /R lian HSmp Ro Co High Frequency Ceramic Solutions Antennas 88 MHz-10 GHz Baluns Capacitors (Hi Q, Low Loss) Chipset-Specific Impedance Matched Balun-Filters Couplers Diplexers Filters (Band-Pass, Low-Pass, etc) Inductors (Wirewound & Monolithic)
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Hz-10
2450BM15A0002
5400BL15B100
2450BM14A0002
microwave product
2450AT42A100
STLC2690
inductor marking
Johanson Technology 2450FB15L0001
bluetooth BC05
5400BL15B050
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2n2 j100
Abstract: No abstract text available
Text: CH EA ce /R lian on iti HSmp Ro Co Ed 12 20 High Frequency Ceramic Solutions Antennas 88 MHz-10 GHz Baluns Capacitors (Hi Q, Low Loss) Chipset-Specific Impedance Matched Balun-Filters Couplers Diplexers Filters (Band-Pass, Low-Pass, etc) Inductors (Wirewound & Monolithic)
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Hz-10
2n2 j100
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0900BL18B200
Abstract: S805D 500L41L120XG4 smd V05 2450BL15B200 substitution 0900BL18B100 SMD transistor package code V12 SMD package code V12 Johanson Dielectrics marking code v4t
Text: C e HlSianc Roomp High Frequency Ceramic Solutions Antennas Baluns Capacitors - Low Loss Couplers Combiners Diplexers Filters - Notch, BP, LP Inductors IPC’s Integrated Passive Components Modules 90 Hybrids Substrates 931 VIA ALONDRA, CAMARILLO, CALIFORNIA 93012 • TEL (805) 389-1166 • FAX (805) 389-1821
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TCAT-1103
0900BL18B200
S805D
500L41L120XG4
smd V05
2450BL15B200 substitution
0900BL18B100
SMD transistor package code V12
SMD package code V12
Johanson Dielectrics
marking code v4t
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MARKING CODE 213I
Abstract: No abstract text available
Text: IQMS-200, -210, -220, -230 Series MEMS OSCILLATORS Outline mm - IQMS-200, -201, -202, -203 Description 7.0±0.15 4 oscillators based on the latest MEMS technology with high performance and low jitter ▪▪ 7 x 5mm (IQMS-200, 201, 202, 203) ▪▪ 5 x 3.2mm (IQMS-210, 211, 212, 213)
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IQMS-200,
2002/95/EC
IQMS-210,
IQMS-220,
IQMS-230,
200MHz
MARKING CODE 213I
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Untitled
Abstract: No abstract text available
Text: High Frequency Ceramic Component Solutions 931 VIA ALONDRA, CAMARILLO, CALIFORNIA 93012 • TEL 805 389-1166 • FAX (805) 389-1821 2 www.johansontechnology.com Your Technology Partner With over 15 years of experience, Johanson Technology Incorporated can provide you
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ISO9001-certified
100/TRAY
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Au Sn eutectic
Abstract: No abstract text available
Text: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:
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MIL-S-883,
MIL-S-202,
210-C,
213-I,
204-G,
Au Sn eutectic
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Untitled
Abstract: No abstract text available
Text: SLC Microwave / Millimeterwave Capacitors Key Features • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:
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PDF
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MIL-S-202,
204-G,
MIL-S-883,
210-C,
213-I,
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Untitled
Abstract: No abstract text available
Text: SLC Microwave / Millimeterwave Capacitors Key Features • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:
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Original
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PDF
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MIL-S-883,
MIL-S-202,
210-C,
213-I,
204-G,
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Untitled
Abstract: No abstract text available
Text: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS Key FeaTuReS • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:
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MIL-S-202,
204-G,
MIL-S-883,
210-C,
213-I,
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500UDDB200JG4W
Abstract: No abstract text available
Text: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:
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Original
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PDF
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MIL-S-202,
204-G,
MIL-S-883,
210-C,
213-I,
500UDDB200JG4W
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Untitled
Abstract: No abstract text available
Text: SLC Microwave / Millimeterwave Capacitors Key Features • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Four SLC Device Types to Fit Many Applications:
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Original
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PDF
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MIL-S-883,
MIL-S-202,
210-C,
213-I,
204-G,
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gaas f25 marking code
Abstract: 471 E25 RF Transistors Ceramic MARKING F25 BD160
Text: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Six SLC Device Types to Fit Many Applications:
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Original
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PDF
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MIL-S-883,
MIL-S-202,
210-C,
213-I,
204-G,
gaas f25 marking code
471 E25
RF Transistors Ceramic MARKING F25
BD160
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Untitled
Abstract: No abstract text available
Text: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • SLC Device Types to Fit Many Applications:
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Original
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PDF
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MIL-S-883,
MIL-S-202,
210-C,
213-I,
204-G,
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Au Sn eutectic
Abstract: No abstract text available
Text: SLC MICROWAVE / MILLIMETERWAVE CAPACITORS KEY FEATURES • Ceramic SLC Low Profile Devices Exhibit Very High-Q / Low Insertion Loss, SRFs to 50 GHz • Thin Film Gold Electrodes Provide Superior Wire Bonding & Die Attach Performance • Six SLC Device Types to Fit Many Applications:
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Original
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PDF
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MIL-S-883,
MIL-S-202,
210-C,
213-I,
204-G,
Au Sn eutectic
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MARKING 213I
Abstract: 213I MIL-STD-20 SMC005
Text: OA Va KOA SPEER ELECTRONICS, INC. SS-231 AHA 3/14/02 M wSUrface Mount Resettable PPTC ISO9 \j¿ á Polymeric Positive Temp. Coefficient Devices CERTIFIED SFSMC & SFmSMC Series (1812 & 1210) 1. Features • Surface mounted chip package Surface mount packaging for automated assembly
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SS-231
SFSMC020
SFSMC050
SFSMC075
SFSMC110
SFSMC150
SFSMC160
SFmSMC005
SFmSMC035
SFmSMC050
MARKING 213I
213I
MIL-STD-20
SMC005
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RCA SK CROSS-REFERENCE
Abstract: CD4003 2N2505 TF408 1N4465 250PA120 2N3017 pt 3570 trw rf pa189 Semicon volume 1
Text: 1969 o < 00 x ic e uo <r\ *—4 rO O CM u J 'r < o o o CO r aJ. rfrr.~> y -< z X— < P“ -J Sem iconductor Annual At .0008" Dia. . . . there is no second source phire orifice insert. Tempress also created and supplied the tungsten carbide ultrasonic bonding tool and pioneered
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LTLS E3
Abstract: SO-8 LTLS e3 TFK 7 segment displays TFK U 212 B 80286 architecture bc 107 equivalent l4fl Scans-049 lc 3101 led TIL Display
Text: FliE FORMATS FOR POPUIAR PC SOFTWARE A PROGRAMMER'S REFERENCE Jeff W alden Computers n Read and write the data files of today’s most popular programs—in the same formats those programs use. MORE FHE FORMATS FOB POPU1AB PC SOFTWARE A PROGRAMMER'S REFERENCE
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