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54112-108201000LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. |
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G80820100CSEU
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Amphenol Communications Solutions
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PCB Socket 2.54mm Pitch STR DIP,2x5Pin,G/F,NY6T, W=5.0mm,Housing=13.5mm,Tail=4.7mm,GAP=1.5mm, Mating H(PCB to PCB=19.0mm), RoHS,BAG |
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54112-808201000LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. |
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54122-108201050LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch |
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54122-108201000LF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 20 Positions |
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