M24RF64A1 Search Results

M24RF64A1 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
LRIS64K Abstract: DSASW003741 Text: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):	Original	TN0193 LRIS64K LRIS64K M24RF64A1 DSASW003741	PDF

Catalog Datasheet

Type

Document Tags

PDF

LRIS64K

Abstract: DSASW003741
Text: TN0193 Technical note LRIS64K bumped die description Product information • Product name: LRIS64K Wafer and die features July 2010 Wafer diameter: 8 inches Wafer thickness: 180 µm Die identification: M24RF64A1 Die finishing front side : SiO2 Die finishing (back side):

Original

TN0193 LRIS64K LRIS64K M24RF64A1 DSASW003741

PDF