HXG-242
Abstract: ENV59
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-242+ 0.7 to 2.4 GHz The Big Deal Ceramic Package • Industry leading High IP3, 46 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-242+
HXG-242
ENV59
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Untitled
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Ampli er Module 50 HXG-122+ 0.5 to 1.2 GHz The Big Deal CeramicPackage • IndustryleadingHighIP3,47dBmtyp. • Integratedoptimizationcircuits • Linearitywithlowcurrentconsumption
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HXG-122+
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TB-641-242
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-242+ 0.7 to 2.4 GHz The Big Deal Ceramic Package • Industry leading High IP3, 46 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-242+
TB-641-242
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Mini-circuits marking code
Abstract: AH1415 OF MINICIRCUITS AVA-24 Mini-circuits marking code MBA-12 Mini-circuits date code MC1631
Text: Tape & Reel Packaging For Surface Mount Devices A utomation of surface-mount assembly by the use of pick-and-place equipment to handle tiny components has been enhanced by evolutionary improvements in tape-and-reel systems which can accommodate as many as 4000 parts on a 13-inch
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13-inch
D4-D041
M151620
D4D041
Mini-circuits marking code
AH1415
OF MINICIRCUITS AVA-24
Mini-circuits marking code MBA-12
Mini-circuits date code
MC1631
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HXG 242
Abstract: HXG-242 HXG242 M134020
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-242+ 0.7 to 2.4 GHz The Big Deal Ceramic Package • Industry leading High IP3, 46 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-242+
HXG 242
HXG-242
HXG242
M134020
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Untitled
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-242+ 0.7 to 2.4 GHz The Big Deal Ceramic Package • Industry leading High IP3, 46 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-242+
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PDF
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Untitled
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package • Industry leading High IP3, 47 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-122+
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M134172
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package • Industry leading High IP3, 47 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-122+
M134172
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PDF
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Untitled
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package • Industry leading High IP3, 47 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-122+
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HXG-122
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package • Industry leading High IP3, 47 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-122+
HXG-122
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Untitled
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package • Industry leading High IP3, 47 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-122+
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TB-641
Abstract: PL350
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-242+ 0.7 to 2.4 GHz The Big Deal Ceramic Package • Industry leading High IP3, 46 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-242+
TB-641
PL350
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Untitled
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package • Industry leading High IP3, 47 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-122+
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PDF
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Untitled
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package • Industry leading High IP3, 47 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-122+
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Untitled
Abstract: No abstract text available
Text: Mini-Circuits System In Package Ultra High IP3 Amplifier Module 50Ω HXG-122+ 0.5 to 1.2 GHz The Big Deal Ceramic Package • Industry leading High IP3, 47 dBm typ. • Integrated optimization circuits • Linearity with low current consumption ☛ LTE Performance
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HXG-122+
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Untitled
Abstract: No abstract text available
Text: PRODUCT CHANGE NOTICE PCN Form D4-E000-73 PCN#11-015 NOTIFICATION DATE: November 7, 2011 MODEL(S) AFFECTED: HXG-122+, HXG-242+ EXTENT OF CHANGE: Change of fit and form, existing footprint compatible, new footprint provided No change of function or performance
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D4-E000-73)
HXG-122+
HXG-242+
LZ1624
LZ1671
TR-F78,
D3-E040
PCN11-015-1
M87093
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