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    LQFP 7X7 PACKAGE Search Results

    LQFP 7X7 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    LQFP 7X7 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    561AB

    Abstract: lqfp 7x7 LQFP 7x7 package
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP−32, 7x7 CASE 561AB−01 ISSUE O DOCUMENT NUMBER: STATUS: 98AON30893E ON SEMICONDUCTOR STANDARD REFERENCE: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 32 LEAD LQFP, 7X7


    Original     		PDF LQFP-32, 561AB-01 98AON30893E 561AB 561AB lqfp 7x7 LQFP 7x7 package

    1632CG

    Abstract: M30260F6T-48P
    Text: M16C/26T 29-May-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :SP-T2A Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF


    Original     		PDF M16C/26T 29-May-06 M30260F6T-48P] 768kHz /-20x10-6 1x10-6W 1632CG M30260F6T-48P

    LQFP 7x7 package

    Abstract: SSPT7 ssp-t7
    Text: M16C/26T 06-Jul-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :SSP-T7 Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF


    Original     		PDF M16C/26T 06-Jul-06 M30260F6T-48P] 768kHz /-20x10-6 65kohm 1x10-6W LQFP 7x7 package SSPT7 ssp-t7

    VT-200

    Abstract: No abstract text available
    Text: M16C/26T 06-Jul-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :VT-200 IC Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF


    Original     		PDF M16C/26T 06-Jul-06 M30260F6T-48P] VT-200 768kHz /-20x10-6 50kohm 1x10-6W VT-200) VT-200

    SSP-T7-F

    Abstract: 78k0/kc2 mcu 48pin uPD78F0582GB NE-200L-F SSP-T7-FL uPD78F0581GA nec 44pin uPD78F0588GA-48P uPD78F0583GA
    Text: 78K0/Kx2-L 21-Aug-09 Evaluation of a Low Frequency Clock Oscillation Circuit SSP-T7-F 7.0pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V NE-200L-F SSP-T7-F Vdd=1.8 to 5.5V Model :SSP-T7-F Frequency :Fo=32.768kHz IC 3.11uWmax


    Original     		PDF 78K0/Kx2-L 21-Aug-09 uPD78F0588GA-48P NE-200L-F 768kHz 11uWmax /-20x10 1x10-6F 65kohm -925k SSP-T7-F 78k0/kc2 mcu 48pin uPD78F0582GB NE-200L-F SSP-T7-FL uPD78F0581GA nec 44pin uPD78F0583GA

    uPD78F0588GA-48P

    Abstract: nec 44pin
    Text: 78K0/Kx2-L 21-Aug-09 Evaluation of a Low Frequency Clock Oscillation Circuit SSP-T7-FL 3.7pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :SSP-T7-FL Frequency :Fo=32.768kHz IC 0.50uWmax


    Original     		PDF 78K0/Kx2-L 21-Aug-09 uPD78F0588GA-48P NE-200L-F 768kHz 50uWmax /-20x10 1x10-6F 65kohm nec 44pin

    SSP-T7-FL

    Abstract: nec 44pin uPD78F0588GA-48P NEC MCU IC CD 3102 SSP-T7F
    Text: 78K0/Kx2-L 21-Aug-09 Evaluation of a Low Frequency Clock Oscillation Circuit SSP-T7-FL 6.0pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :SSP-T7-FL Frequency :Fo=32.768kHz IC 1.33uWmax


    Original     		PDF 78K0/Kx2-L 21-Aug-09 uPD78F0588GA-48P NE-200L-F 768kHz 33uWmax /-20x10 1x10-6F 65kohm 78K0/KC2-L SSP-T7-FL nec 44pin NEC MCU IC CD 3102 SSP-T7F

    nec 44pin

    Abstract: uPD78F0582GB uPD78F0588GA-48P VT-200 NEC MCU
    Text: 78K0/Kx2-L 09-Sep-09 Evaluation of a Low Frequency Clock Oscillation Circuit VT-200-FL 6.0pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New VT-200-FL NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :VT-200-FL Frequency :Fo=32.768kHz


    Original     		PDF 78K0/Kx2-L 09-Sep-09 VT-200-FL uPD78F0588GA-48P VT-200-FL NE-200L-F 768kHz 33uWmax /-20x10 nec 44pin uPD78F0582GB VT-200 NEC MCU

    uPD78F0588GA-48P

    Abstract: nec 44pin uPD78F0582GB VT-200 RL246
    Text: 78K0/Kx2-L 09-Sep-09 Evaluation of a Low Frequency Clock Oscillation Circuit VT-200-FL 3.7pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New VT-200-FL NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :VT-200-FL Frequency :Fo=32.768kHz


    Original     		PDF 78K0/Kx2-L 09-Sep-09 VT-200-FL uPD78F0588GA-48P VT-200-FL NE-200L-F 768kHz 50uWmax /-20x10 nec 44pin uPD78F0582GB VT-200 RL246

    7x7x1.4

    Abstract: 932AA
    Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 48 LEAD LQFP, 7x7, 0.5P CASE 932AA−01 ISSUE A SCALE 2:1 DATE 13 OCT 2008 4X 0.2 Y T-U Z D PIN 1 CORNER D/2 Z 48 1 36 5 T e/2 DETAIL K 37 U G E G E1 E/2 E1/2 12 T, U, Z 25 DETAIL K NOTE 9 13 24 D1/2 D1 4X BASE METAL


    Original     		PDF 932AA-01 932AA 7x7x1.4 932AA

    TQ32

    Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
    Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*


    Original     		PDF Jul-00 Oct-00 Jan-01 Apr-01 Jul-01 Oct-01 10X10, TQ32 ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6

    JEDEC MS-026

    Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
    Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers


    Original     		PDF MS-026 JEDEC MS-026 MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A

    lqfp 7x7 tray

    Abstract: MS-026 7X748LD amkor
    Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers


    Original     		PDF MS-026 lqfp 7x7 tray MS-026 7X748LD amkor

    A2 diode

    Abstract: transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4
    Text: : Available, : Under development Plastic QFP Fine Pitch Nominal Dimensions (mm) Lead Pitch Classification (mm) Pin Counts 48 64 72 80 88 100 120 144 160 176 208 216 240 256 272 304 376 QFP 7x7 TQFP QFP 10 × 10 TQFP QFP 12 × 12 TQFP QFP 14 × 14 LQFP 0.5


    Original     		PDF S176GM-50-3EU, S176GM-50-8EU-2 S208GD-50-5ML-2 S208GD-50-5EL-1 P208GD-50-LML, S208GD-50-8EU-2 S216GM-40-8EV P240GN-50-LMU, S256GD-40-LMV, S272GP-50-LMU, A2 diode transistor A2 3eb data lmu a2 TQFP 32 PACKAGE 272-pin TQFP 100 Pitch 0,4

    tray qfn 6x6

    Abstract: tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5
    Text: Supertex Packaging Specifications Suffix Package Type B1 B2 FB FG FG FG FG GA GA K1 K1 K2 K4 K4 K5 K6 K6 K6 K6 K6 K6 K6 K6 K6 K6 K7 K7 K7 K7 K7 K7 LG L / LL MG MG N2 N3 N3 N5 N8 NG NG P P P P PG PG PG PG PJ PJ PJ SG T TG WG WG WG WG 26L BCC 84L BCC+ 64B FCBGA


    Original     		PDF O-236AB OT-23) OT-23 O-220 O-252 OT-223 QFN00/Reel 490/Tray tray qfn 6x6 tqfp 7x7 tray QFN tray 5x5 QFN tray QFn Package tray QFN tray qfn 4x4 QFN tray 4x4 LQFP Package tray 6x6 TRAY tray QFN 5x5

    nec 44 pin LQFP

    Abstract: BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages
    Text: CHAPTER 3 SURFACE MOUNT PACKAGES 3.1 LINEUP OF SURFACE MOUNT IC PACKAGES 3.2 LIST OF SURFACE MOUNT IC PACKAGES 1 Plastic SOP (Small Outline Package) (2) Ceramic WSOP (Small Outline Package with Window) (3) Plastic shrink SOP (Shrink Small Outline Package)


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 nec 44 pin LQFP BGA and QFP Package 256-pin BGA drawing 14 pin ic 28-pin QFP nec 44-pin qfp 44-Pin QFN 65A1 nec 44-pin LQFP ic packages

    789104a

    Abstract: nec 44 pin LQFP 78F9116A 78f9136a 78F9418AGC 789124A 30-pin nec 78F9468 78F9328 30PIN
    Text: HOME SOLUTIONS PRODUCTS TECHNOLOGY HIGHLIGHTS SUPPORT COMPANY PROFILE NEWS AND EVENTS MICROCOMPUTER Microcomputer HOME Product Overview 8bit 78K0S Series : Development Environment NEC Electronics Tools Programming Environment Product Lineup Development Environment


    Original     		PDF 78K0S 44-pin 10x10) 30-pin 789104a nec 44 pin LQFP 78F9116A 78f9136a 78F9418AGC 789124A 30-pin nec 78F9468 78F9328 30PIN

    HLQFP 176 Package

    Abstract: FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20
    Text: IC Package Line-up As of July, 2009 ● : In mass production ○ : Under development Package name DIP SDIP Package dimensions mm mil 6.3x8.84 (300) 6.3x9.6 (300) 6.3x19 (300) 6.3x19.2 (300) 6.3x24.5 (300) 13.4x35.6 (600) 6.3x19 (300) 8.9x28 (400) 13x36.72 (600)


    Original     		PDF 13x36 13x45 14x37 17x56 17x57 O-92L OT-25 10x10 15x15 HLQFP 176 Package FBGA Package 14x14 121 bga 10x10 BGA 27X27 pitch 23X23 lfbga 12X12 1.0/Daewon BGA 7x7 hssop TQFP 14X20 TSOP 14X20

    PWM example sTM8l

    Abstract: STM8L151 ufdfpn8 footprint STM8AF6223 STM8AF62 STM8L101 stm8l152 STM8AF5288 stm8l151F2 STM8AF5268
    Text: STM8 product families STMicroelectronics 8‑bit microcontrollers www.st.com/mcu STM8 8‑bit microcontrollers The STM8 is a platform of technologies, IPs and tools which forms the basis of STMicroelectronics’ comprehensive family of 8‑bit microcontrollers. These cover a wide range of applications from low‑power and


    Original     		PDF BRSTM80610 PWM example sTM8l STM8L151 ufdfpn8 footprint STM8AF6223 STM8AF62 STM8L101 stm8l152 STM8AF5288 stm8l151F2 STM8AF5268

    MS-026 lqfp 80

    Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
    Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging


    Original     		PDF

    tqfp 7x7

    Abstract: 10X10 14X14 LQFP 7x7 package
    Text: TQFP Packaging Capabilities Surface Mount Description packages with a nominal body thickness of 1.0mm. This package finds many applications where size and weight are a critical factor. The Thin Quad Flatpack TQFP plastic package family is a reduced thickness plastic surface mount package.


    Original     		PDF GA00050PM7/00 tqfp 7x7 10X10 14X14 LQFP 7x7 package

    LQFP-48 thermal pad

    Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


    Original     		PDF

    TQFP 100 pin ic

    Abstract: 208ld
    Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /


    Original     		PDF

    tray 20 x 14

    Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
    Text: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type


    Original     		PDF E04102 tray 20 x 14 BGA 31 x 31 tray bga trays tray bga 17 bga tray