LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
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JEDEC MS-026
Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
JEDEC MS-026
MS-026
Amkor mold compound
lqfp 7x7 tray
jedec MS-026-A
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lqfp 7x7 tray
Abstract: MS-026 7X748LD amkor
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
lqfp 7x7 tray
MS-026
7X748LD
amkor
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561AB
Abstract: lqfp 7x7 LQFP 7x7 package
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS LQFP−32, 7x7 CASE 561AB−01 ISSUE O DOCUMENT NUMBER: STATUS: 98AON30893E ON SEMICONDUCTOR STANDARD REFERENCE: Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 32 LEAD LQFP, 7X7
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LQFP-32,
561AB-01
98AON30893E
561AB
561AB
lqfp 7x7
LQFP 7x7 package
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Techpoint
Abstract: 100L JESD51-2 JESD51-7 lqfp 7x7 tray QFP 128 bonding
Text: LQFP Low Profile Quad Flat Pack • 7 x 7mm to 28 x 28mm body sizes • 32 to 208 lead counts • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 28 x 28mm STATS ChipPAC’s LQFP is a low profile 1.4mm version of the QFP. The LQFP is a leadframe based, plastic encapsulated
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LQFP Package tray
Abstract: JEDEC TRAY DIMENSIONS tray container dimensions
Text: TRAY CONTAINER UNIT : mm 10 x 25=250 113.4 135.9 PPE NEC 135° C MAX. A' 9.60 11.25 12.60 LQFP7 × 7× 1.4 A 9.60 12.20 11.10 292.8 315.0 322.6 SECTION A-A' 9.60 5.62 (6.35) 7.62 6.82 Applied Package 48-pin Plastic LQFP (Fine Pitch)(1.4mm thick) 64-pin Plastic LQFP (Fine Pitch)(1.4mm thick)
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48-pin
64-pin
SSD-A-H7499
LQFP Package tray
JEDEC TRAY DIMENSIONS
tray container dimensions
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Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 48 LEAD LQFP 7x7mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # LQFP7x7-48LD-PL-1 Rev A ECN 022312HC05 Originator E. dlSantos Change New release UNIT MM [INCHES] Reason Per George C.
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LQFP7x7-48LD-PL-1
022312HC05
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1632CG
Abstract: M30260F6T-48P
Text: M16C/26T 29-May-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :SP-T2A Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF
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M16C/26T
29-May-06
M30260F6T-48P]
768kHz
/-20x10-6
1x10-6W
1632CG
M30260F6T-48P
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LQFP 7x7 package
Abstract: SSPT7 ssp-t7
Text: M16C/26T 06-Jul-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :SSP-T7 Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF
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M16C/26T
06-Jul-06
M30260F6T-48P]
768kHz
/-20x10-6
65kohm
1x10-6W
LQFP 7x7 package
SSPT7
ssp-t7
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VT-200
Abstract: No abstract text available
Text: M16C/26T 06-Jul-06 Evaluation of Subsystem Clock Oscillation Circuit [M30260F6T-48P] LQFP 7x7 0.5mm pitch Measurement conditions :3.3V Model Vcc=3.0V to 5.5V :VT-200 IC Frequency :Fo=32.768kHz Frequency tolerance :dF/Fo= +/-20x10-6 Load capacitance :CL=12.5pF
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M16C/26T
06-Jul-06
M30260F6T-48P]
VT-200
768kHz
/-20x10-6
50kohm
1x10-6W
VT-200)
VT-200
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F741583
Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001
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EN-4085S2K3
96mils
L3/260C
UL94-V0
TMS471R1F138
85C/85
3/260C
F741583
sp3721d
d741667bpgf
F741583PGF
f721501apgf
tnetv901apag
F711862PGE
F721730EPBK
f721905pag
F731891PDV
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auto iris control
Abstract: DC auto iris CCD 22 pin ccd b/w camera eia 309H 510H auto iris driver dc iris driver High speed CCD camera A7H1
Text: Ai2410 A1 PROs Signal Processor for Single-Chip CCD B/W Camera 64 pin LQFP 7x7 Description The Ai2410 is a signal processor for CCD B/W camera application. It combines CCD analog signal processor, timing logic controller and vertical into one single chip.
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Ai2410
Ai2410
auto iris control
DC auto iris
CCD 22 pin
ccd b/w camera eia
309H
510H
auto iris driver
dc iris driver
High speed CCD camera
A7H1
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SSP-T7-FL
Abstract: nec 44pin uPD78F0588GA-48P NEC MCU IC CD 3102 SSP-T7F
Text: 78K0/Kx2-L 21-Aug-09 Evaluation of a Low Frequency Clock Oscillation Circuit SSP-T7-FL 6.0pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :SSP-T7-FL Frequency :Fo=32.768kHz IC 1.33uWmax
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78K0/Kx2-L
21-Aug-09
uPD78F0588GA-48P
NE-200L-F
768kHz
33uWmax
/-20x10
1x10-6F
65kohm
78K0/KC2-L
SSP-T7-FL
nec 44pin
NEC MCU
IC CD 3102
SSP-T7F
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MS-6G
Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f
Text: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :
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Z200-PCN-PA20070101
14X20MM
14X14MM
G600F)
48LQFP
SB5627
W6694ACD
SB5627001
MS-6G
ms-7g
sa5522
SUMITOMO g600f
W83303D
w99682bcdg
W55U01-A2
ms 6g
w89c35d
g600f
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nec 44pin
Abstract: uPD78F0582GB uPD78F0588GA-48P VT-200 NEC MCU
Text: 78K0/Kx2-L 09-Sep-09 Evaluation of a Low Frequency Clock Oscillation Circuit VT-200-FL 6.0pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New VT-200-FL NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :VT-200-FL Frequency :Fo=32.768kHz
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78K0/Kx2-L
09-Sep-09
VT-200-FL
uPD78F0588GA-48P
VT-200-FL
NE-200L-F
768kHz
33uWmax
/-20x10
nec 44pin
uPD78F0582GB
VT-200
NEC MCU
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uPD78F0588GA-48P
Abstract: nec 44pin uPD78F0582GB VT-200 RL246
Text: 78K0/Kx2-L 09-Sep-09 Evaluation of a Low Frequency Clock Oscillation Circuit VT-200-FL 3.7pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New VT-200-FL NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :VT-200-FL Frequency :Fo=32.768kHz
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78K0/Kx2-L
09-Sep-09
VT-200-FL
uPD78F0588GA-48P
VT-200-FL
NE-200L-F
768kHz
50uWmax
/-20x10
nec 44pin
uPD78F0582GB
VT-200
RL246
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uPD78F0588GA-48P
Abstract: nec 44pin
Text: 78K0/Kx2-L 21-Aug-09 Evaluation of a Low Frequency Clock Oscillation Circuit SSP-T7-FL 3.7pF with uPD78F0588GA-48P [LQFP 7x7 0.5mm pitch] Measurement conditions : 3.0V New NE-200L-F SSP-T7-FL Vdd=1.8 to 5.5V Model :SSP-T7-FL Frequency :Fo=32.768kHz IC 0.50uWmax
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78K0/Kx2-L
21-Aug-09
uPD78F0588GA-48P
NE-200L-F
768kHz
50uWmax
/-20x10
1x10-6F
65kohm
nec 44pin
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RTL8150
Abstract: 8150L rtl8150l EEPROM+93C46+CONTENTS
Text: RTL8150 M REALTEK SINGLE-CHIP USB To FAST ETHERNET CONTROLLER WITH MII INTERFACE RTL8150L(M) 1 Features: ! RTL8150LM supports MII interface ! Supports Wake-On-LAN function and remote wakeup (Magic Packet*, LinkChg and Microsoft wake-up frame). ! RTL8150L supports 48 pins LQFP
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RTL8150
RTL8150L
RTL8150LM
MS-026
100LD
14x14x1
LQ100
8150L
EEPROM+93C46+CONTENTS
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ze 003
Abstract: 48-PIN
Text: 48-PIN PLASTIC LQFP FINE PITCH (7x7) HD D detail of lead end 36 A3 25 37 c 24 θ L Lp E L1 HE (UNIT:mm) 13 48 1 12 ZE e ZD b x M S A A2 S y S NOTE Each lead centerline is located within 0.08 mm of its true position at maximum material condition. A1 ITEM
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48-PIN
P48GA-50-GAM
ze 003
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Untitled
Abstract: No abstract text available
Text: TC7320 Six Pair, N- and P-Channel Enhancement-Mode MOSFET Features General Description ► ► ► ► ► ► ► ► ► The Supertex TC7320FG consists of a six pairs of high voltage, low threshold, N- and P-channel MOSFETs in a 32-lead LQFP package. All of the MOSFETs have integrated gate-to-source
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TC7320
TC7320FG
32-lead
MS-026,
DSFP-TC7320
B020808
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Untitled
Abstract: No abstract text available
Text: TC7320 Six Pair, N- and P-Channel Enhancement-Mode MOSFET Features General Description ► ► ► ► ► ► ► ► ► The Supertex TC7320 consists of a six pairs of high voltage, low threshold, N- and P-channel MOSFETs in a 32-lead LQFP package. All of the MOSFETs have integrated gate-to-source
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TC7320
32-lead
MS-026,
DSFP-TC7320
B041408
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7x7x1.4
Abstract: MS-026 JEDEC MS-026
Text: F R E E S C A L E SEMICONDUCTOR, A L L R IG H T S RESERVED. INC. MECHANICAL TITLE : 48 LEAD LQFP, 7X7X1.4 PKG, 0.5 PI7CH, 4.5X4.5 EXPOSED PAD O UTLINE DOCUMENT CA S E PR IN T VERSIO N NO: 9 8 A S A 0 0 1 7 3 D NUMBER: 2 0 0 3 - 0 1 STANDARD: JEDEC MS-026
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OCR Scan
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98ASA00173D
MS-026
5M-1994.
7x7x1.4
JEDEC MS-026
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