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seam seal process

Abstract: LMC7255 Minco Products PC16552 LMC668
Text: N ANALYSIS OF VOLUME NO. 6 2000 DIE ASSEMBLY TECHNIQUES CONTENTS PAGE 1 ystem and board manufacturers that use bare die or flip-chip – such as National Semiconductor’s Die Products – have access to a wide variety of assembly methods that will produce high yield, high reliability systems. The following review of