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    LGA-24 LAND PATTERN Search Results

    LGA-24 LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    UPA2371T1P-E1-A Renesas Electronics Corporation Nch Dual Power Mosfet 24V 6A 20Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2351T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 30V 5.7A 40Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2350T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 20V 6.0A 35Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation

    LGA-24 LAND PATTERN Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    LGA1366

    Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
    Text: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA


    Original     		LGA1366 LGA1366 1366-position 016mm Table12. Table12 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow PDF

    SI8233BD-C-IS

    Abstract: SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8233BD-C-IS SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A PDF

    WBSOIC-16

    Abstract: LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments       Two completely isolated drivers  Independent HS and LS inputs or in one package PWM input versions Up to 5 kVRMS input-to-output


    Original     		Si823x Si8230/1/2 SOIC-16 Si8233/4/5/6 LGA-14 SOIC-16 WBSOIC-16 LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS PDF

    Si8233BB-C-IS

    Abstract: LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments      Two completely isolated drivers  60 ns maximum propagation in one package delay Up to 5 kVRMS input-to-output  Independent HS and LS inputs or


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 Si8233BB-C-IS LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233 PDF

    Si8235-BA-C-IS1

    Abstract: LGA 32 land pattern silicon labs Si8233 si8230 SI823 SI8233-B-IM Si8238BBCIS1 E257455 SI8238AB-C-IS1 Si8237BBBIS1
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		Si823x Si8230/1/2/7 SOIC-16 Si8233/4/5/6/8 LGA-14 Si8235-BA-C-IS1 LGA 32 land pattern silicon labs Si8233 si8230 SI823 SI8233-B-IM Si8238BBCIS1 E257455 SI8238AB-C-IS1 Si8237BBBIS1 PDF

    SI8235

    Abstract: Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features   Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8235 Si8233 high side IGBT driver LGA145 SOIC127P600 LGA 32 land pattern SI8234AB-C-IS1 si8235bd-c-is LGA-145 si8236 PDF

    LGA land pattern

    Abstract: SI8233AB-C-IS1 LH2015 SI8235BB-C-IS1 LGA-14 si8233 Si8232 SOIC-16 SI8233AD-C-IS si8235
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 SOIC-16 LGA-14 LGA land pattern SI8233AB-C-IS1 LH2015 SI8235BB-C-IS1 LGA-14 si8233 Si8232 SI8233AD-C-IS si8235 PDF

    Untitled

    Abstract: No abstract text available
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		Si823x AEC-Q100 Si8230/1/2/7 Si8233/4/5/6/8 SOIC-16 SOIC-16 PDF

    Si8233

    Abstract: LGA-24 land pattern LGA PACKAGE thermal resistance
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 Si8233 LGA-24 land pattern LGA PACKAGE thermal resistance PDF

    Si8237/8

    Abstract: SI8233BD
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features       Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions


    Original     		Si823x AEC-Q100 Si8230/1/2/7 Si8233/4/5/6/8 SOIC-16 SOIC-16 Si8237/8 SI8233BD PDF

    lga 115

    Abstract: No abstract text available
    Text: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector


    Original     		UL94V-0, PDF

    pcb design of zigbee

    Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
    Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor


    Original     		CH370 pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32 PDF

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern PDF

    Untitled

    Abstract: No abstract text available
    Text: P R E L I M I N A RY QuietPower QPI-2L QPI-2, 12 Amp Active EMI Filter for DC-DC Converters Description Features QPI-2 The QPI-2 active EMI filter provides conducted common-mode CM and differential-mode (DM) attenuation from 150 kHz to 30 MHz. Active


    Original     		02/04/10M PDF

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT PDF

    MARKING T6C

    Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
    Text: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change


    Original     		PX10051EJ35V0TN G0706 MARKING T6C lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin PDF

    QAD-00046

    Abstract: SE5503A 5503A JESD22-A114 P802 S211 S2132 SE5503A-R QAD-00047 LGA land pattern
    Text: SE5503A Dual Band 802.11a/b/g/n Wireless LAN Front End Preliminary Information Applications ƒ ƒ ƒ ƒ ƒ Product Description The SE5503A is a complete 802.11a/b/g/n WLAN RF front-end module providing all the functionality of the power amplifiers, filtering, power detector, T/R switch,


    Original     		SE5503A 11a/b/g/n SE5503A IEEE802 DST-00320 QAD-00046 5503A JESD22-A114 P802 S211 S2132 SE5503A-R QAD-00047 LGA land pattern PDF

    13707RZ

    Abstract: 13707RZ-S02L inphi S02l inphi Converter Inphi NRZ inphi terms
    Text: 13707RZ 12.5 Gbps NRZ-to-RZ Converter Data Sheet Applications • • • • • NRZ-to-RZ data conversion with pulse width control SONET OC-192 linecards and equipment Long haul and ultra long haul transmission systems Mach-Zehnder optical modulators Broadband test and measurement equipment


    Original     		13707RZ OC-192 13707RZ 13707RZ-S02D, 13707RZ-S02 ISO-9001 13707RZ-S02L inphi S02l inphi Converter Inphi NRZ inphi terms PDF

    MMA7450L

    Abstract: MMA73x0L MMA7450LR1 MMA7450LR2 MMA7450LT Introduction to accelerometers
    Text: Document Number: MMA7450L Rev 2, 7/2007 Freescale Semiconductor Technical Data ±2g/±4g/±8g Three Axis Low-g Digital Output Accelerometer The MMA7450L is a Digital Output I2C/SPI , low power, low profile capacitive micromachined accelerometer featuring signal conditioning, a low


    Original     		MMA7450L MMA7450L MMA73x0L MMA7450LR1 MMA7450LR2 MMA7450LT Introduction to accelerometers PDF

    inphi

    Abstract: inphi Converter 13706RZ Inphi NRZ 13706RZ-S02L 13706RZ-S02LEVB LGA land pattern S02l
    Text: 13706RZ 12.5 Gbps NRZ-to-RZ Converter Data Sheet Applications • • • • • NRZ-to-RZ data conversion with pulse width control SONET OC-192 linecards and equipment Long haul and ultra long haul transmission systems Mach-Zehnder optical modulators Broadband test and measurement equipment


    Original     		13706RZ OC-192 13706RZ 13706RZ-S02D, 13706RZ-S02 ISO-9001 inphi inphi Converter Inphi NRZ 13706RZ-S02L 13706RZ-S02LEVB LGA land pattern S02l PDF

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


    Original     		LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325 PDF

    marking 6-PIN PLASTIC TSON

    Abstract: MARKING M53 MARKING CODE T5E RENESAS marking code 30SSOP Renesas 30SSOP marking code lga 1155 M33 TRANSISTOR Microwave Devices QFN-52 p5 6pin
    Text: PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Common Information www.renesas.com Rev.2.00 Oct 2010 Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please


    Original     		R50ZZ0001EJ0200 marking 6-PIN PLASTIC TSON MARKING M53 MARKING CODE T5E RENESAS marking code 30SSOP Renesas 30SSOP marking code lga 1155 M33 TRANSISTOR Microwave Devices QFN-52 p5 6pin PDF

    MAX2666

    Abstract: max2668
    Text: 19-5479; Rev 0; 8/10 TION KIT EVALUA BLE AVAILA Tiny Low-Noise Amplifiers for HSPA/LTE The MAX2666/MAX2668 are a family of low-noise amplifiers LNAs intended for use in HSPA mobile handsets. The LNAs provide three programmable gain states, delivering superior optimization for linearity and sensitivity versus traditional two-gain-state LNAs.


    Original     		MAX2666/MAX2668 MAX2666 2100MHz 2200MHz MAX2668 850MHz 1000MHz f0-0233 MAX2666/MAX2668 PDF