LGC-KP609
Abstract: LGA-S601LC LGA-S620LC
Text: Optical Fiber Connectors MU-Type Optical Fixed Attenuator Optical Fixed Attenuator MU-Type MU-Type Optical Fixed Attenuator Item number Mode Attenuation Quantity and Tolerance LGA-S601KCA 1±0.5dB LGA-S603KCA 3±1.0dB LGA-S605KCA LGA-S610KCA Single Mode 5±1.5dB
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LGA-S601KCA
LGA-S603KCA
LGA-S605KCA
LGA-S610KCA
LGA-S615KCA
LGA-S620KCA
100mW
LGC-KP609)
LGA-S601LC
LGA-S603LC
LGC-KP609
LGA-S620LC
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Untitled
Abstract: No abstract text available
Text: Optical Fiber Connectors SC-Type Optical Fixed Attenuator Optical Fixed Attenuator SC-Type SC-Type Optical Fixed Attenuators Item number Mode Attenuation Quantity and Tolerance LGA-SHP305S 5±1.5dB LGA-SHP310S 10±1.5dB LGA-SHP320S Optical Max Resistance Input
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LGA-SHP303S
LGA-SHP305S
LGA-SHP310S
LGA-SHP315S
LGA-SHP320S
LGA-SHP325S
LGA-SHP330S
LGA-G303L
LGA-G305L
LGA-G310L
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LGA-G103
Abstract: No abstract text available
Text: Optical Fiber Connectors FC-Type Optical Fixed Attenuator Optical Fixed Attenuator FC-Type FC-Type Optical Fixed Attenuator Mode Single Mode 10±1.5dB LGA-SE115C 15±1.5dB LGA-SE120C 20±1.5dB LGA-SHPE105C 5±1.5dB LGA-SHPE110C 10±1.5dB Single Mode 1.55 Single Mode
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LGA-SE103C
LGA-SE105C
LGA-SE110C
LGA-SE115C
LGA-SE120C
LGA-SHPE105C
LGA-SHPE110C
LGA-SHPE115C
LGA-SHPE120C
LGA-SHPE125C
LGA-G103
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Untitled
Abstract: No abstract text available
Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-3000K and i7-3000 Processor Series for the LGA-2011 Socket
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LGA-2011
i7-3960X
i7-3000K
i7-3000
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LGA 2011 Socket diagram
Abstract: LGA2011 LGA 2011 Socket 3930k ddr3 controller transistors F6 DD52 BJ13 VCCD01 pcie gen 2 payload i7-3930
Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series for the LGA-2011 Socket
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LGA-2011
i7-3960X
i7-39xxK
i7-38xx
LGA 2011 Socket diagram
LGA2011
LGA 2011 Socket
3930k
ddr3 controller
transistors F6 DD52
BJ13
VCCD01
pcie gen 2 payload
i7-3930
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LGA1366
Abstract: LGA 1366 socket LGA 1366
Text: Introducing Sockets and Hardware for LGA 1366 Processors TE Connectivity’s surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The
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socket lga 1156
Abstract: LGA1156 socket 1156 Intel lga 1156 lga 1156
Text: Introducing Sockets and Hardware for LGA 1156 Processors TE Connectivity’s surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever
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lga 1366
Abstract: LGA1366 1981837-1 1981467-1 1939739-1 1981837-2
Text: Introducing Sockets and Hardware for LGA 1366 Processors Tyco Electronics’ surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1366 processor. The contacts have .64mm diameter solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The
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lga 1156
Abstract: socket lga 1156 LGA1156 tyco reference Socket gold Intel lga 1156 Intel nor flash
Text: Introducing Sockets and Hardware for LGA 1156 Processors Tyco Electronics’ surface mount LGA socket was designed for use with Intel’s Core i7 LGA 1156 processor. The contacts have solder balls for surface mount onto the PCB, while the top side provides a cantilever beam interface to the package. The integrated lever
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Solder ball shear
Abstract: No abstract text available
Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.
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13x30
Solder ball shear
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.
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13x30
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Untitled
Abstract: No abstract text available
Text: SPECIFICATIONS Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Electrical Contact Resistance : 18 mΩ max.
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reflow profile FOR LGA COMPONENTS
Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
Text: Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion’s power converter packages utilize module package technology to form Land Grid Array LGA packages. LGA module package technology provides additional
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EN53x0D
reflow profile FOR LGA COMPONENTS
LGA PACKAGE thermal resistance
an103r
paste profile
solder joint
AN103
lga components
LGA land pattern
stencil
Enpirion
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Solder ball shear
Abstract: LGA resistance
Text: SPECIFICATIONS VR 372 LGA/BGA power connector LGA SMT Type 1.27X1.5mm [.05X.06”] Pitch 372 Pos. Mechanical Socket compression force:165N min.,372N max. Durability: 20 Cycles min. Solder Ball Shear Force: 500g min. Electrical Contact Resistance : 18 mΩ max.
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13x30
Solder ball shear
LGA resistance
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LGA16 footprint
Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents
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TN0018
LGA16 footprint
TN0018
lga16 land pattern
LGA16 L footprint
788755
LGA voiding
LGA16
JESD97
LGA14
lga16 land
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LGA voiding
Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style
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AN3311
MC1320x
MC1321x
LGA voiding
AN3281
Lead Free reflow soldering profile BGA
AN1902
AN3311
fr-5 laminate
BGA PACKAGE thermal resistance Freescale
bga PCB footprint
reflow profile FOR LGA COMPONENTS
LGA PACKAGE thermal resistance Freescale
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AN3281
Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style
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AN3311
MC1320x
MC1321x
AN3281
LGA voiding
LGA PACKAGE thermal resistance Freescale
reflow profile FOR LGA COMPONENTS
"LGA footprint"
lga components
AN1902
AN3311
BGA cte
fr-5 laminate
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LICC
Abstract: kyocera mlcc military capacitors lga components
Text: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown
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S-LGA0M806-N
LICC
kyocera mlcc
military capacitors
lga components
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X-RAY INSPECTION
Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as
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AN2265/D
26mm-0
X-RAY INSPECTION
LGA Application Notes motorola
12x12mm BGA package thermal resistance
LGA Application Notes
pitch 0.4mm BGA
solder wire 0.3 mm
lga components
s3527
LGA PACKAGE thermal resistance
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lga16 land pattern
Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and
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TN0018
lga16 land pattern
LGA16 footprint
TN0018
LGA 16L
4x4x1
LGA16 L footprint
LGA16
LGA land pattern
ST LGA-16
JESD97
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land pattern 0805
Abstract: T5500
Text: FL02M653.02 - Page 1 of 2 Product Family: Bessel Absorptive Filter—5th Order, LGA Part Number Series: FL5-LGA Series Construction: Features: • High Purity Alumina Substrate Nickel alloy thin-film resistive element
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FL02M653
-10dB
100mA
100Mohm
50Vdc
land pattern 0805
T5500
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T5500
Abstract: thin film filter
Text: FL02M651.03 - Page 1 of 3 Product Family: Bessel Absorptive Filter—7th Order, LGA Part Number Series: FL7-LGA Series Construction: Features: • High Purity Alumina Substrate Nickel alloy thin-film resistive element
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FL02M651
T5500
thin film filter
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SE115
Abstract: LGA-SE103C LGA-SE110C LGA-SE115C LGA-SE120C
Text: t HONDA TSUSHIN KOGYO CO., LTD. Optical fiber connector FC-type optical fixed attenuator Optical fixed Attenuator FC-type jF C T y p e Optical Fixed Attenuator Item number Mode Attenuation and Tolerance LGA-SE103C 3±1.0dB LGA-SE105C 5±1.5dB LGA-SE110C Single Mode
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LGA-SE103C
LGA-SE105C
LGA-SE110C
LGA-SE115C
LGA-SE120C
-10mW
LGA-SHPE105C
LGA-SIIPE110C
LGA-SHPE115C
LGA-SHPE120C
SE115
LGA-SE103C
LGA-SE110C
LGA-SE115C
LGA-SE120C
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LGS-5A-15-OV-R
Abstract: Lambda Hybrid LGS-FA-28-OV-R lambda lgs f 28 ov r LGS-FA-15-0V-R lambda lg lgs-eea lambda lga f lambda lgs-eea-15 lambda LAS
Text: 5 YEAR GUARANTEED SWITCHING Lambda LG and LGA series Features—LG and LGA series 5-year guaranteed switching power supplies Sprague computer grade hermetically sealed 10-year life electrolytic capacitor 4 package sizes up to 190A, up to 48 Volts Hermetically sealed semiconductors
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LAS-3800
MIL-T-27C
MIL-STD-810C,
MIL-I-6181D
10-year
I--13
LGS-5A-15-OV-R
Lambda Hybrid
LGS-FA-28-OV-R
lambda lgs f 28 ov r
LGS-FA-15-0V-R
lambda lg
lgs-eea
lambda lga f
lambda lgs-eea-15
lambda LAS
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