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    LGA JEDEC Search Results

    LGA JEDEC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HMC1126ACEZ Analog Devices 24-LGA Visit Analog Devices Buy
    HMC1126ACEZ-R7 Analog Devices 24-LGA Visit Analog Devices Buy
    ADRF5731BCCZN-R7 Analog Devices 16 lead LGA Visit Analog Devices Buy
    ADRF5721BCCZN-R7 Analog Devices 16 lead LGA Visit Analog Devices Buy
    ADRF5731BCCZN Analog Devices 16 lead LGA Visit Analog Devices Buy

    LGA JEDEC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-3000K and i7-3000 Processor Series for the LGA-2011 Socket


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    PDF LGA-2011 i7-3960X i7-3000K i7-3000

    LGA 2011 Socket diagram

    Abstract: LGA2011 LGA 2011 Socket 3930k ddr3 controller transistors F6 DD52 BJ13 VCCD01 pcie gen 2 payload i7-3930
    Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series for the LGA-2011 Socket


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    PDF LGA-2011 i7-3960X i7-39xxK i7-38xx LGA 2011 Socket diagram LGA2011 LGA 2011 Socket 3930k ddr3 controller transistors F6 DD52 BJ13 VCCD01 pcie gen 2 payload i7-3930

    LGA16 footprint

    Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents


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    PDF TN0018 LGA16 footprint TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land

    lga16 land pattern

    Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and


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    PDF TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97

    LGA 2011 Socket diagram

    Abstract: BR17
    Text: Intel Core i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 1 Supporting Desktop Intel® Core™ i7-3960X and i7-3970X Extreme Edition Processor for the LGA-2011 Socket Supporting Desktop Intel® Core™ i7-39xxK and i7-38xx Processor Series


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    PDF LGA-2011 i7-3960X i7-3970X i7-39xxK i7-38xx LGA 2011 Socket diagram BR17

    picor

    Abstract: LGA rework JEDEC Drawing LGA reflow profile FOR LGA COMPONENTS MLCC rework PI2121 LGA Application Notes
    Text: Recommended PCB Design & Surface Mount Guidelines for Picor Corporation’s LGA Packages Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Page 1 Receiving PCB Footprint. . . . . . . . . . . . . . . . . . . . . . Page 1


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    PDF

    pcb warpage in ipc standard

    Abstract: JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029
    Text: Application Note AN-1028 Recommended Design, Integration and Rework Guidelines for International Rectifier’s BGA and LGA Packages by Kevin Hu, International Rectifier Table of Contents Page Introduction .1


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    PDF AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework JSTD033A reflow profile FOR LGA COMPONENTS AN1028 8015 j AN-1028 AN-1029

    Untitled

    Abstract: No abstract text available
    Text: 3M Textool Test and Burn-In Sockets ™ 1 3Innovation 3M Textool Test and Burn-In Sockets ™ ™ Table of Contents BGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 PGA/IPGA/SPGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12


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    PDF

    LGA voiding

    Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
    Text: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print


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    PDF LTM4600 CCL-HL-832 LGA voiding Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325

    Untitled

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: LGA 8 x 8 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


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    PDF J-STD-020

    Untitled

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: LGA 6 x 7 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


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    PDF J-STD-020

    LGA weight

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: LGA 4 x 4 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


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    PDF J-STD-020 LGA weight

    LGA weight

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: LGA 6 x 6 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


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    PDF J-STD-020 LGA weight

    "material declaration"

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: LGA 7 x 7 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


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    PDF J-STD-020 "material declaration"

    LSM9DS0

    Abstract: No abstract text available
    Text: LSM9DS0 iNEMO inertial module: 3D accelerometer, 3D gyroscope, 3D magnetometer Datasheet - production data Applications • Indoor navigation  Smart user interfaces  Advanced gesture recognition  Gaming and virtual reality input devices LGA-24 4x4x1.0 mm


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    PDF LGA-24 DocID024763 LSM9DS0

    Untitled

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: LGA 9 x 9 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


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    PDF J-STD-020

    Untitled

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: LGA 5 x 5 mm Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


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    PDF J-STD-020

    LIS2DH12

    Abstract: No abstract text available
    Text: LIS2DH12 MEMS digital output motion sensor: ultra-low-power high-performance 3-axis "femto" accelerometer Datasheet - production data Applications • Motion-activated functions  Display orientation  Shake control  Pedometer LGA-12 2.0x2.0x1 mm


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    PDF LIS2DH12 LGA-12 LIS2DH12 DocID025056

    Untitled

    Abstract: No abstract text available
    Text: BMA222 BMA222 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA222 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.15


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    PDF BMA222 BMA222 12-pin BST-BMA222-DS002-05

    LIS302DL c source

    Abstract: LIS302DL self test example AN2335 LIS302DL self test LIS302DL LIS302DL X Y Z smd code YL transistor smd ZH DO13 DO14
    Text: AN2335 Application note LIS302DL: 3-Axis - ±2g/±8g digital output ultracompact linear accelerometer Introduction This document is intended to give application notes for the low-voltage 3-axis digital output linear MEMS accelerometer provided in LGA package.


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    PDF AN2335 LIS302DL: LIS302DL LIS302DL c source LIS302DL self test example AN2335 LIS302DL self test LIS302DL X Y Z smd code YL transistor smd ZH DO13 DO14

    BMA120

    Abstract: bma220 IC BOSCH 44 z 04g BOSCH marking code BOSCH cross reference bosch map sensor Bosch microcontroller triaxial accelerometer sensor BMA22
    Text: BMA220 BMA220 Digital, triaxial acceleration Data sheet sensor Bosch Sensortec Data sheet Bosch Sensortec BMA220 data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.10


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    PDF BMA220 12-pin BST-BMA220-DS003-07 BMA120 IC BOSCH 44 z 04g BOSCH marking code BOSCH cross reference bosch map sensor Bosch microcontroller triaxial accelerometer sensor BMA22

    Untitled

    Abstract: No abstract text available
    Text: BMA222 BMA222 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA222 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.15


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    PDF BMA222 BMA222 12-pin BST-BMA222-DS002-05

    Untitled

    Abstract: No abstract text available
    Text: Restriction of Hazardous Substances RoHS Material Declaration: LGA 8L 4.9 x 3.2 mm (-315) Package type: RoHS compliant: Package total weight grams (g): Termination base alloy: Component terminal plating/surface finish: Max. reflow temperature rating (degrees Celsius):


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    PDF J-STD-020

    Untitled

    Abstract: No abstract text available
    Text: BMA250 BMA250 sensor Digital, triaxial acceleration Data sheet Bosch Sensortec Data sheet Bosch Sensortec BMA250 Data sheet Ordering code Please contact your Bosch Sensortec representative for the ordering code Package type 12-pin LGA Document revision 1.15


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    PDF BMA250 BMA250 12-pin BST-BMA250-DS002-05