Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA208
OT631-2
OT631-2
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area
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LFBGA208:
OT966-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls B D SOT1019-1 A ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 3
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LFBGA208:
OT1019-1
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA208 package SOT631-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA208
OT631-1
OT631-1
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-3 B D A ball A1 index area A A2 A1 E detail X C e1 y1 C ∅v M C A B b e y ∅w M C U T R P e N M L K e2 J H G F E D C B A ball A1 index area
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LFBGA208:
OT631-3
MO-205
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MO-205
Abstract: sot631
Text: PDF: 2002 Aug 14 Philips Semiconductors Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-2 A B D ball A1 index area A A2 A1 E detail X C e1 ∅v M C A B ∅w M C b e y1 C y U T R P e
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LFBGA208:
OT631-2
MO-205
MO-205
sot631
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm B D SOT631-4 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M e L K e2 J H G F E D C B A ball A1 index area
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LFBGA208:
OT631-4
MO-205
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MO-205
Abstract: sot631
Text: PDF: 2003 Oct 20 Philips Semiconductors Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-3 B D A ball A1 index area A A2 A1 E detail X C e1 y1 C ∅v M C A B b e y ∅w M C U T R P e
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LFBGA208:
OT631-3
MO-205
MO-205
sot631
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MO-205
Abstract: LFBGA208
Text: PDF: 2002 Aug 19 Philips Semiconductors Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.25 mm SOT631-1 A B D ball A1 index area A A2 A1 E detail X C e1 ∅v M C A B b e y y1 C ∅w M C U T R P e
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LFBGA208:
OT631-1
MO-205
MO-205
LFBGA208
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MO-205
Abstract: sot631
Text: PDF: 2001 Oct 29 Philips Semiconductors Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.25 mm SOT631-1 A B D ball A1 index area A A2 A1 E detail X C e1 ∅v M C A B b e y y1 C ∅w M C U T R P e
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LFBGA208:
OT631-1
MO-205
MO-205
sot631
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LPC9221
Abstract: embedded c code to interface lpc2148 with sensor P89V51RD2 microcontroller LPC2148 i2c with sensor LPC925 p89v51rd2 LPC700 LPC2148 p89v51rd2 development board lpc1754
Text: April 2009 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from
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32-bit
LPC3000,
LPC2000,
LPC1000,
LPC900,
LPC700
80C51
LPC3000
LPC9221
embedded c code to interface lpc2148 with sensor
P89V51RD2 microcontroller
LPC2148 i2c with sensor
LPC925
p89v51rd2
LPC2148
p89v51rd2 development board
lpc1754
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LPC2148 i2c eeprom c code
Abstract: lcd c program using lpc2378 LPC2468 embedded c code to interface lpc2148 with sensor LPC932A1 LPC922 LPC932A lpc921 lpc935 ac motor control LPC2378 instruction cache
Text: August 2008 The choice for embedded technologies Our microcontroller offering combines the highest performance in Flash with the lowest power consumption in the smallest packages. A comprehensive portfolio of industryleading performers includes the latest 32-bit LPC3000, LPC2000, LPC1000, LH7A, LH7, and 8-bit LPC900, LPC700 and 80C51 families. We offer an easy migration path from
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32-bit
LPC3000,
LPC2000,
LPC1000,
LPC900,
LPC700
80C51
LPC3000
LPC2148 i2c eeprom c code
lcd c program using lpc2378
LPC2468
embedded c code to interface lpc2148 with sensor
LPC932A1
LPC922
LPC932A
lpc921
lpc935 ac motor control
LPC2378 instruction cache
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SPC560
Abstract: sdc 7500 sdc 7500 pwm control mc306 crystal 12,000 MHz Crystal oscillator SPC560 MIPS SPC560B40L3 ic lm 7500 SPC560B40 C 12 PH diode
Text: SPC560B40x, SPC560B44x, SPC560B50x SPC560C40x, SPC560C44x, SPC560C50x 32-bit MCU family built on the Power Architecture embedded category for automotive body electronics applications Preliminary data Features • High-performance 64 MHz e200z0h CPU – 32-bit Power Architecture™ Book E CPU
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SPC560B40x,
SPC560B44x,
SPC560B50x
SPC560C40x,
SPC560C44x,
SPC560C50x
32-bit
e200z0h
LQFP144
SPC560
sdc 7500
sdc 7500 pwm control
mc306 crystal
12,000 MHz Crystal oscillator
SPC560 MIPS
SPC560B40L3
ic lm 7500
SPC560B40
C 12 PH diode
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PCB layout guidelines for NXP MCUs in BGA packages
Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,
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AN10778
LPC175x,
LPC176x,
LPC177x,
LPC178x,
LPC181x,
LPC182x,
LPC183x,
LPC185x,
LPC431x,
PCB layout guidelines for NXP MCUs in BGA packages
LBGA256
AN10778
LPC2468 reflow solder profile
land pattern for TSOP 2 54 pin
NXP lpc
LPC175x
LFBGA256
lpc433x
TSOP 54 land pattern
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stepper motor stall
Abstract: st micro stepper motor driver instrument cluster stm stepper motor ic LCD Controller, STM LQFP144 LQFP176 DSI RGB Bridge display DSI to rgb bridge cluster stepper motor st micro gauge driver
Text: SPC560S50x, SPC560S60x 32-bit MCU for cluster applications with stepper motor, TFT graphic controller and LCD driver Data Brief Features • ■ ■ High performance 64 MHz e200z0h CPU – 32-bit Power Architecture book E CPU – Up to 60 MIPs operation
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SPC560S50x,
SPC560S60x
32-bit
e200z0h
12-entry
LFBGA208
16/23-channel
10-bit
stepper motor stall
st micro stepper motor driver instrument cluster
stm stepper motor ic
LCD Controller, STM
LQFP144
LQFP176
DSI RGB Bridge display
DSI to rgb bridge
cluster stepper motor
st micro gauge driver
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Texas Instruments Power Reference Design for Intel Core i7
Abstract: ARM720T LH79524 LH79524N0F100A0 LH79524N0F100A1 LH79525 LH79525N0Q100A0 LH79525N0Q100A1 XTAL32OUT
Text: LH79524/LH79525 A.1 System-on-Chip Product data sheet FEATURES • I2C Module • Highly Integrated System-on-Chip • Integrated Codec Interface Support Features (I2S) • High Performance: 76.205 MHz CPU Speed, 50.803 MHz maximum AHB clock (HCLK) • Watchdog Timer
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LH79524/LH79525
32-bit
ARM720TTM
LH79524:
LH79525:
16-bit
LH79524)
Texas Instruments Power Reference Design for Intel Core i7
ARM720T
LH79524
LH79524N0F100A0
LH79524N0F100A1
LH79525
LH79525N0Q100A0
LH79525N0Q100A1
XTAL32OUT
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ARM720T
Abstract: LH79524 LH79524N0F100A0 LH79524N0F100A1 LH79525 LH79525N0Q100A0 LH79525N0Q100A1 pk7 ur A4T10
Text: LH79524/LH79525 A.1 System-on-Chip Preliminary data sheet FEATURES • I2C Module • Highly Integrated System-on-Chip • Integrated Codec Interface Support Features (I2S) • High Performance: 76.205 MHz CPU Speed, 50.803 MHz maximum AHB clock (HCLK) • Watchdog Timer
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LH79524/LH79525
32-bit
ARM720TTM
LH79524:
LH79525:
16-bit
LH79524)
ARM720T
LH79524
LH79524N0F100A0
LH79524N0F100A1
LH79525
LH79525N0Q100A0
LH79525N0Q100A1
pk7 ur
A4T10
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Untitled
Abstract: No abstract text available
Text: SPC560B40x, SPC560B50x SPC560C40x, SPC560C50x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Datasheet − production data Features • High-performance 64 MHz e200z0h CPU – 32-bit Power Architecture® technology
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SPC560B40x,
SPC560B50x
SPC560C40x,
SPC560C50x
32-bit
e200z0h
LQFP100
LQFP144
LQFP64
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SPC563M64L5
Abstract: SPC563M64L7 BOSCH 227 100 142 sck 20150
Text: SPC563M64L5, SPC563M64L7 SPC563M60L5P, SPC563M60L7P 32-bit Power Architecture based MCU for automotive powertrain applications Datasheet − production data Features • 144 LQFP 20 mm x 20 mm Single issue, 32-bit Power Architecture® Book E compliant e200z335 CPU core complex
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SPC563M64L5,
SPC563M64L7
SPC563M60L5P,
SPC563M60L7P
32-bit
e200z335
32-channel
SPC563M64L5
BOSCH 227 100 142
sck 20150
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Untitled
Abstract: No abstract text available
Text: LH79524/LH79525 A.1 System-on-Chip Preliminary data sheet FEATURES • I2C Module • Highly Integrated System-on-Chip • Integrated Codec Interface Support Features (I2S) • High Performance: 76.205 MHz CPU Speed, 50.803 MHz maximum AHB clock (HCLK) • Watchdog Timer
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LH79524/LH79525
32-bit
ARM720Tâ
LH79524:
LH79525:
16-bit
LH79524)
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PHY Interface for the PCI Express
Abstract: PX1041A MO-205 sot631 PX1041A-EL1
Text: PX1041A PCI Express stand-alone X4 PHY Rev. 01 — 21 June 2007 Objective data sheet 1. General description The PX1041A is a high-performance, low-power, four-lane PCI Express electrical PHYsical layer PHY that handles the low level PCI Express protocol and signaling. The
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PX1041A
PX1041A
8b/10b
PHY Interface for the PCI Express
MO-205
sot631
PX1041A-EL1
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SPC560
Abstract: SPC560C50L3 FlexCAN SPC560B40L3 SPC560B64 SPC560C50 e200z Wakeup SPC560B40L3 FlexCAN SPC560B40L3 manual
Text: SPC560B40x, SPC560B50x SPC560C40x, SPC560C50x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Datasheet − production data Features • High-performance 64 MHz e200z0h CPU – 32-bit Power Architecture® technology
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SPC560B40x,
SPC560B50x
SPC560C40x,
SPC560C50x
32-bit
e200z0h
LQFP64)
LQFP100)
LQFP144)
SPC560
SPC560C50L3
FlexCAN SPC560B40L3
SPC560B64
SPC560C50
e200z
Wakeup SPC560B40L3
FlexCAN SPC560B40L3 manual
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C90FL
Abstract: SPC563M64 microsecond bus bosch bosch microsecond microsecond bus SPC563M60L3 bosch Knock sensor SPC563Mxx NEXUS CONNECTOR "microsecond bus"
Text: SPC563Mxx 32-bit Power Architecture based MCU for automotive powertrain applications Data Brief Features • Single issue, 32-bit PowerPCTM Book E compliant e200z335 CPU core complex – Includes variable length encoding VLE enhancements for code size reduction
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SPC563Mxx
32-bit
e200z335
32-channel
LQFP144
C90FL
SPC563M64
microsecond bus bosch
bosch microsecond
microsecond bus
SPC563M60L3
bosch Knock sensor
SPC563Mxx
NEXUS CONNECTOR
"microsecond bus"
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spc560b
Abstract: SPC560C SPC560B40L5 XBAR LFBGA-208 SPC56
Text: SPC560B40x, SPC560B50x SPC560C40x, SPC560C50x 32-bit MCU family built on the Power Architecture for automotive body electronics applications Features • ■ ■ High-performance 64 MHz e200z0h CPU – 32-bit Power Architecture® technology – Up to 60 DMIPs operation
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SPC560B40x,
SPC560B50x
SPC560C40x,
SPC560C50x
32-bit
e200z0h
LQFP64/45,
LQFP100/75,
LQFP144/123
spc560b
SPC560C
SPC560B40L5
XBAR
LFBGA-208
SPC56
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