Untitled
Abstract: No abstract text available
Text: BRIGHT LED ELECTRONICS CORP. BWL-3A4F01F SINCE 1981 ● Features: 1. Input power: 4W. 2. Chip material: R：AlGaInP, Face up chip ;G：InGaN ;B：InGaN, Flip chip. 3. Emitted color: Red ;Green ;Blue. 4. High lumen output. 5. High flux density. 6. Low power consumption.
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BWL-3A4F01F
350mA
350mA
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BWL-2B1A01
Abstract: No abstract text available
Text: BRIGHT LED ELECTRONICS CORP. BWL-2B1A01 SINCE 1981 ● Features: 1. Input power: 1W. 2. Chip material: InGaN, Flip chip. 3. Emitted color: White. 4. High lumen output. 5. High flux density. 6. Low power consumption. 7. Efficient heat transfer. 8. Add extra heat sink is necessary.
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BWL-2B1A01
350mA)
BWL-2B1A01
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Untitled
Abstract: No abstract text available
Text: BRIGHT LED ELECTRONICS CORP. BWL-3A4A04H SINCE 1981 ● Features: 1. Input power: 4W. 2. Chip material: InGaN, Flip chip. 3. Emitted color: White. 4. High lumen output. 5. High flux density. 6. Low power consumption. 7. Efficient heat transfer. 8. The emitting color meets SAE standard.
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BWL-3A4A04H
700mA)
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BWL-2B1G01
Abstract: No abstract text available
Text: BRIGHT LED ELECTRONICS CORP. BWL-2B1G01 SINCE 1981 ● Features: 1. Input power: 1W. 2. Chip material: InGaN, Flip chip. 3. Emitted color: Green. 4. High lumen output. 5. High flux density. 6. Low power consumption. 7. Efficient heat transfer. 8. Add extra heat sink is necessary.
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BWL-2B1G01
350mA)
BWL-2B1G01
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lm 1315
Abstract: LM121
Text: BRIGHT LED ELECTRONICS CORP. BWL-3A4A04H-H1 SINCE 1981 ● Features: 1. Input power: 4W. 2. Chip material: InGaN, Flip chip. 3. Emitted color: White. 4. High lumen output. 5. High flux density. 6. Low power consumption. 7. Efficient heat transfer. 8. The emitting color meets SAE standard.
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BWL-3A4A04H-H1
700mA)
lm 1315
LM121
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marking code B1 inductor
Abstract: VLF4012AT220MR51 led flip-chip
Text: NCP5010 Product Preview 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device has been designed with high−efficiency for use in portable applications and is capable of
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NCP5010
NCP5010/D
marking code B1 inductor
VLF4012AT220MR51
led flip-chip
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Untitled
Abstract: No abstract text available
Text: NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable
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NCP5010
NCP5010
NCP5010/D
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BC847BD
Abstract: TDK TRACE CODE INFORMATION C1608X5R1E105MT
Text: NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable
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NCP5010
NCP5010/D
BC847BD
TDK TRACE CODE INFORMATION
C1608X5R1E105MT
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C1608X5R0J475MT
Abstract: GRM185R61A105KE36 A108B A114 A115 JESD22 JESD78 NCP5010 VLF4012AT C1608X5R1E105MT
Text: NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable
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NCP5010
NCP5010
NCP5010/D
C1608X5R0J475MT
GRM185R61A105KE36
A108B
A114
A115
JESD22
JESD78
VLF4012AT
C1608X5R1E105MT
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0603 footprint IPC
Abstract: C1608X5R0J475MT A108B A114 A115 JESD22 JESD78 NCP5010 VLF4012AT led flip-chip
Text: NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high−efficiency for use in portable
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NCP5010
NCP5010
NCP5010/D
0603 footprint IPC
C1608X5R0J475MT
A108B
A114
A115
JESD22
JESD78
VLF4012AT
led flip-chip
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0603 footprint IPC
Abstract: A108B A114 A115 JESD22 JESD78 NCP5010 VLF4012AT DT1608C-223
Text: NCP5010 Product Preview 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal
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NCP5010
NCP5010
NCP5010/D
0603 footprint IPC
A108B
A114
A115
JESD22
JESD78
VLF4012AT
DT1608C-223
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underfill
Abstract: EM HEATSINK PROFILE Swatch Group wristwatch lcd flip chip bga 0,8 mm ceramic pin grid array package wire bond ACF COG DSAE005753 acf film watch IC
Text: EM-MARIN Gold or Solder Chip Bumping, the choice is application dependent. Author: Jörg Jasper, EM-Marin Evolution In the late 1960s, Swiss watchmakers developed highvolume tape-automated-bonding TAB technology in order to meet the requirement to put the watch IC into
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1960s,
Th-9/00
underfill
EM HEATSINK PROFILE
Swatch Group
wristwatch lcd
flip chip bga 0,8 mm
ceramic pin grid array package wire bond
ACF COG
DSAE005753
acf film
watch IC
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Untitled
Abstract: No abstract text available
Text: Technology introduction CHAPTER 13 1 Semiconductor process technology 1-1 Silicon process technology 1-2 Compound semiconductor process technology 2 Assembly technology 2-1 2-2 2-3 2-4 2-5 Packages for diverse needs Flip chip bonding Dicing Module products
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Untitled
Abstract: No abstract text available
Text: BRIGHT LED ELECTRONICS CORP. SINCE 1981 DATA SHEET ●DEVICE NUMBER：BWL-3A3W01S-H1 SHEET DATE 1 2 3 4 5 CONTENTS 2005.05.20 1.0 1.0 1.0 1.0 1.0 Preliminary 2005.10.11 1.1 1.1 1.1 1.1 1.1 P1-P5 2006.02.10 2.0 2.0 2.0 2.0 2.0 P1-P5 佰鴻工業股份有限公司
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NUMBERBWL-3A3W01S-H1
BWL-3A3W01S-H1
12VDC.
350mA)
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"0.4mm" bga "ball collapse" height
Abstract: cga 624 ibm semi reflow temperature bga
Text: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier D. J. Alcoe, T. E. Kindl, J. S. Kresge, J. P. Libous, C. L. Tytran-Palomaki, R. J. Stutzman IBM Corporation Endicott, New York Biography Dr. David J. Alcoe joined IBM in 1982 and is the
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w/2116
"0.4mm" bga "ball collapse" height
cga 624
ibm semi
reflow temperature bga
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L6372
Abstract: IEC1131 L6372DP L6372FP SO20
Text: L6372 OCTAL INDUSTRIAL INPUT INTERFACE PRODUCT PREVIEW INPUT STATUS MONITORING BY MEANS OF CURRENT LEVELS DETECTION EXTERNALLY PROGRAMMABLE UPPER CURRENT LEVEL INPUT OPEN LINE DETECTION INPUT PROTECTION BY MEANS OF INTERNAL DIODES CLAMPING TO GROUND AND SUPPLY VOLTAGE
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L6372
L6372
L6372DP
Powerdip16
L6372FP
IEC1131
L6372DP
L6372FP
SO20
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GRM40X7R104K25
Abstract: 68c11 MC68HC11 PLCC52 MC68HC811E9 GRM230Y5V106Z10 D206 DIP8 RS232 MAX232 rx led DB9RA 74HC259 motorola D213 user guide
Text: AND8073/D Using the NCN6000 Smart Card Interface Demo Board V1.1 User Manual Prepared by: Michael Bairanzade Applications Engineering Thierry Caritoux Applications Engineering http://onsemi.com APPLICATION NOTE • Asynchronous type Smart card Synchronous cards are
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AND8073/D
NCN6000
NCN6000.
NCN6000
NCN6000/D,
r14525
GRM40X7R104K25
68c11
MC68HC11 PLCC52
MC68HC811E9
GRM230Y5V106Z10
D206 DIP8
RS232 MAX232 rx led
DB9RA
74HC259
motorola D213 user guide
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Untitled
Abstract: No abstract text available
Text: Adafruit Motor Shield V2 for Arduino Created by Ladyada Last updated on 2014-03-26 11:15:07 AM EDT Guide Contents Guide Contents 2 Overview 4 FAQ 6 Install Headers & Terminals 11 Installing Standard Headers 11 Installing Terminal Blocks and more 13 Installing with Stacking Headers
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unipolar stepper motor 5v
Abstract: No abstract text available
Text: Adafruit Motor Shield V2 for Arduino Created by lady ada Last updated on 2014-04-14 05:15:09 PM EDT Guide Contents Guide Contents 2 Overview 4 FAQ 7 Install Headers & Terminals 12 Installing Standard Headers 12 Installing Terminal Blocks and more 14 Installing with Stacking Headers
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subwoofer 1000 watts amplifier
Abstract: 12v subwoofer amp circuits 500w mosfet based pulse width modulation inverter high subwoofer 1000 watts amplifier LX1585 lx1691 350w power amplifier stereo subwoofer pcb 1722 12v class d amplifier 40W high subwoofer 100 watts amplifier
Text: VOLUME New product guide Subwoofer Center Channel 11 Left Front LX1722 Right Front The LX1721 / LX1722 is a high performance Class-D stereo controller IC targeted for high efficiency audio requirements. Ideal for battery powered products, portable systems or space
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LX1722
LX1721
LX1722
subwoofer 1000 watts amplifier
12v subwoofer amp circuits
500w mosfet based pulse width modulation inverter
high subwoofer 1000 watts amplifier
LX1585
lx1691
350w power amplifier stereo
subwoofer pcb 1722
12v class d amplifier 40W
high subwoofer 100 watts amplifier
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80500 TRANSISTOR
Abstract: Vo 80500 TRANSISTOR HE 80500 HE 80500 TRANSISTOR CT 80500 80500+TRANSISTOR GR-900 double slug tuner varactor diode q factor measurement Silicon Power Cube
Text: Application Note 80500: Tuning Diodes L introduction In recent years continuous development of tuning varactors - voltage controlled capacitors - together with an increased commercial and military use has led to sub stantial improvement in Q, reproducibility, and reliability.
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Figure81sketches
DKV6550B
DVH6791,
80500 TRANSISTOR
Vo 80500 TRANSISTOR
HE 80500
HE 80500 TRANSISTOR
CT 80500
80500+TRANSISTOR
GR-900
double slug tuner
varactor diode q factor measurement
Silicon Power Cube
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ELC-1300-25
Abstract: 6605 SP EPD-550 EPD-660-5 SMD A1W ultraviolet sensor flame 2x430 elj-660-225 ELJ-810-248 ELC-630-13
Text: Chips ♦ visible ♦ infrared ♦ special design AutoSelective Photodiodes ♦ ultraviolet ♦ visible ♦ infrared LEDs, SMDs in different designs ♦ visible ♦ infrared ♦ high-power ♦ high-speed Type Designation System LED Chips: L C 1234 Light emitting
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ELC-660-199
ELC-1300-25
6605 SP
EPD-550
EPD-660-5
SMD A1W
ultraviolet sensor flame
2x430
elj-660-225
ELJ-810-248
ELC-630-13
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MC68B21CP
Abstract: xcm916x1cth16 transistor marking code 12W SOT-23 sg379 MC68B54P XC68HC805P18CDW mc68b50cp MC2830 NE555N CHN NE555N
Text: SG379/D REV 7 Semiconductor Products Sector NORTH AMERICA SALES AND DISTRIBUTION PRICE LIST THIS BOOK IS IN COMPUTER SORT PRODUCT CLASSIFICATION – Please see General Information Section 1.3 EFFECTIVE DATE: JANUARY 10, 1998 General Information 1 Cross References
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SG379/D
1N965BRL
ZEN15V
1N751AS
1N967BRL
ZEN18V
1N751ASRL
1N968BRL
ZEN20V
MC68B21CP
xcm916x1cth16
transistor marking code 12W SOT-23
sg379
MC68B54P
XC68HC805P18CDW
mc68b50cp
MC2830
NE555N
CHN NE555N
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BGA heatsink compressive force
Abstract: BGA Solder Ball compressive force PowerPC 970 MULTIPLE EFFECT EVAPORATOR bga thermal cycling reliability original Coffin-Manson Equation underfill SMT underfill 100C reflow temperature bga
Text: Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards*, Hope Chambers*, Mukta Farooq*, Lewis Goldmann*, Amir Salehi* *IBM Microelectronics, 2070 Route 52, Hopewell Jct, NY 12533 *Apple Computer, 1 Infinite Loop, Cupertino, CA 95014
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64-bit
BGA heatsink compressive force
BGA Solder Ball compressive force
PowerPC 970
MULTIPLE EFFECT EVAPORATOR
bga thermal cycling reliability
original Coffin-Manson Equation
underfill SMT
underfill
100C
reflow temperature bga
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