DC250V
Abstract: DEA P1
Text: • Taping Specifications 15.0mm pitch / lead spacing 7.5mm taping Straight type Lead Code: P3 ∆S e L W0 12.7mm pitch / lead spacing 5.0mm taping Straight type (Lead Code: P2) ∆S P2 ∆S D P e øD0 R P0 ∗ P3 N3 H0 Lead Code N3 Except DEF Series Code
|
Original
|
500pcs.
DC250V
DC500V
250pcs.
000pcs.
DC250V
DEA P1
|
PDF
|
QEB363GR
Abstract: QEB 123
Text: T-3/4, 2mm DIODE Ordering Information To order QEB or QSB subminiature products on tape and reel include the appropriate standard product part number and suffix code to specify the lead form and packaging method. QEB363GR Packaging Code Lead Form Code Standard Product Part Number
|
Original
|
QEB363GR
000/Reel
RS-481.
RS-481
QEB363GR
QEB 123
|
PDF
|
Aluminum Electrolytic Capacitors
Abstract: TR26 TR52 TR63
Text: Part Numbering System for Aluminum & Tantalum Electrolytic Capacitors ALUMINUM ELECTROLYTIC CAPACITORS Tolerance Code Capacitance Code Series 4 (3) (2) (1) (5) Rated Voltage (6) Optional Lead Configuration and Taping Code Size Code Examples: NSR 1R0 M 50V
|
Original
|
10x20
50Vdc
16Vdc
25x30
200Vdc
Aluminum Electrolytic Capacitors
TR26
TR52
TR63
|
PDF
|
5r6 inductor
Abstract: HWI453232 HWI453232-1R0 HWI453232-1R2 HWI453232-1R5 HWI453232-1R8 HWI453232-2R2 HWI453232-2R7 HWI453232-3R3 HWI453232-3R9
Text: MOLDED WIREWOUND CHIP INDUCTORS HWI453232 SERIES 1. PART NO. EXPRESSION : HW I 4 5 3 2 3 2 - 1 R 0 K F a (b) (c) (d)(e) (a) Series code (d) Tolerance code : K = ±10%, M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : 1R0 = 1.00uH 2. CONFIGURATION & DIMENSIONS :
|
Original
|
HWI453232
5r6 inductor
HWI453232-1R0
HWI453232-1R2
HWI453232-1R5
HWI453232-1R8
HWI453232-2R2
HWI453232-2R7
HWI453232-3R3
HWI453232-3R9
|
PDF
|
PR02
Abstract: PR01 PR03 22 194 13 CU 53 CU 53 table
Text: BCcomponents Product specification Professional power metal film resistors PR01/02/03 ORDERING INFORMATION Table 1 Ordering code indicating resistor type and packaging ORDERING CODE 23. . . BANDOLIER AMMOPACK TYPE PR01 LEAD ∅ (mm) TOL (%) RADIAL TAPED
|
Original
|
PR01/02/03
PR02
PR01
PR03
22 194 13
CU 53
CU 53 table
|
PDF
|
SMPI1354P3-2R2
Abstract: L-816 SMPI1354P3
Text: HIGH CURRENT MOLDED POWER INDUCTORS L816 SERIES 1. PART NO. EXPRESSION : L816-1R0MF a (a) Series code (d) F : Lead Free (b) Inductance code : 1R0 = 1.0uH (b) (c)(d) (c) Tolerance code : M = ±20% 2. CONFIGURATION & DIMENSIONS : NC 3.0 2.4 G H B NC 9.6 NC
|
Original
|
L816-1R0MF
SMPI1354P3-2R2
L-816
SMPI1354P3
|
PDF
|
L46R
Abstract: l468 FCI3216-Series 47nk
Text: FERRITE CHIP INDUCTORS L4 SERIES 1. PART NO. EXPRESSION : L4-47NK-10 a Series code (a) (b) Inductance code : 47N = 0.047uH (b) (c) (d) (d) 10 : Lead Free (c) Tolerance code : K = ±10%, M = ±20% 2. CONFIGURATION & DIMENSIONS : A D L H G B C PCB Pattern
|
Original
|
L4-47NK-10
047uH
85bililty
L46R
l468
FCI3216-Series
47nk
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Date: 20 April 2009 Lead-free product: Lead-free Second Level Interconnect (SLI) Equipment type: Server CPU Board Product Code: WX58BP (BOXWX58BP, BLKWX58BP)
|
Original
|
WX58BP
BOXWX58BP,
BLKWX58BP)
D85051-001
|
PDF
|
DP55WB
Abstract: No abstract text available
Text: Material Declaration Datasheet Restriction on Hazardous Substances RoHS Compliance Manufacturer: Intel Corporation Equipment type: Desktop CPU Board Product Code: DP55WB Date: 07 August 2009 Lead-free product: Lead-free Second Level Interconnect (SLI) RoHS Definitions :
|
Original
|
DP55WB
D85051-001
DP55WB
|
PDF
|
TSOP044-P-0400-1
Abstract: MAX4435
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction
|
Original
|
FPT-44P-M07
TSOP044-P-0400-1
44-pin
FPT-44P-M07)
F44016S-1C-2
TSOP044-P-0400-1
MAX4435
|
PDF
|
TSOP028-P-0400-3
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index FPT-28P-M07 EIAJ code : TSOP028-P-0400-3 28-pin plastic TSOP II Lead pitch 50 mil Package width 400 mil Lead shape Gullwing Lead bend direction
|
Original
|
FPT-28P-M07
TSOP028-P-0400-3
28-pin
FPT-28P-M07)
Moun004)
F28031S-1C-2
TSOP028-P-0400-3
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SHRINK SMALL OUTLINE L-LEADED PACKAGE 34 PIN PLASTIC FPT-34P-M01 EIAJ code : SSOP034-P-0375-1 34-pin plastic SSOP Lead pitch 1.00mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold FPT-34P-M01 34-pin plastic SSOP (FPT-34P-M01)
|
Original
|
FPT-34P-M01
SSOP034-P-0375-1
34-pin
FPT-34P-M01)
F34001S-3C-4
|
PDF
|
Untitled
Abstract: No abstract text available
Text: SHRINK SMALL OUTLINE L-LEADED PACKAGE 40 PIN PLASTIC FPT-40P-M04 EIAJ code : SSOP040-P-0450-2 Lead pitch 0.80mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 40-pin plastic SSOP FPT-40P-M04 40-pin plastic SSOP (FPT-40P-M04)
|
Original
|
FPT-40P-M04
SSOP040-P-0450-2
40-pin
FPT-40P-M04)
|
PDF
|
lead frame cu C194
Abstract: SB203 chip led C194 ICM7212AMIPL mold compound copper bond wire mold components
Text: Environmental Management and Materials Information Product Content Information for: ICM7212AMIPL No Lead−Free Qualified Moisture Sensitivity Level L1 Package Code Package Type Body Size Package Option Pin Count P40−1 PDIP .600" Standard 40 Lead Form1 Unit Weight
|
Original
|
ICM7212AMIPL
P40-1
UL-94
lead frame cu C194
SB203 chip led
C194
ICM7212AMIPL
mold compound
copper bond wire
mold components
|
PDF
|
|
|
EIA-296-E
Abstract: SnPb10 corrugated box
Text: Package Details - DO-201AD Mechanical Drawing Lead Code: Cathode band Packing options: Bulk - Packing Code: D D = White corrugated box with black conductive coating surface resistivity of <105 ohms per square . Bulk Packing Quantity: 500 Tape and Reel - Packing Code: A
|
Original
|
DO-201AD
EIA-296-E.
23-May
DO-201AD
1130mg
SnPb10
22-December
EIA-296-E
SnPb10
corrugated box
|
PDF
|
mono-kap
Abstract: K103-K
Text: Ordering Information Vishay Multilayer Ceramic Dipped Radial Capacitors C0G, X7R, and Y5V Dielectric Capacitors RADIAL ORDERING INFORMATION K 103 K 10 X7R F 5 3 H 5 PRODUCT TYPE CAPACITANCE CODE CAPACITANCE TOLERANCE SIZE CODE TEMP. CHAR. RATED VOLTAGE LEAD
|
Original
|
19-Jan-06
mono-kap
K103-K
|
PDF
|
336 108
Abstract: No abstract text available
Text: Radial Leaded Aluminum Electrolytic Capacitors Type TYRH 105°C Series Standard Product Table Type TYRH Series Rated Voltage V.DC Capacitance µF Code Case Size Dia x L Lead Pitch Case Code Dissipation Ripple Factor Current % * (mA)* Part Number 6.3 33 336
|
Original
|
TYRH0J476A11ML
TYRH0J107A11ML
TYRH0J227A11ML
TYRH0J337B11ML
TYRH0J477B11ML
336 108
|
PDF
|
EIA-296-E
Abstract: No abstract text available
Text: Package Details - DO-15 Mechanical Drawing Lead Code: Cathode band Packing options: Bulk - Packing Code: D D = White corrugated box with black conductive coating surface resistivity of <105 ohms per square . Bulk Packing Quantity: 1,000 Tape and Reel - Packing Code: A
|
Original
|
DO-15
EIA-296-E.
23-May
DO-15
SnPb10
27-September
EIA-296-E
|
PDF
|
DO-201
Abstract: SnPb20 EIA-296-E
Text: Package Details - DO-201 Mechanical Drawing Lead Code: Cathode band Packing options: Bulk - Packing Code: D D = White corrugated box with black conductive coating surface resistivity of <105 ohms per square . Bulk Packing Quantity: 500 Tape and Reel - Packing Code: A
|
Original
|
DO-201
EIA-296-E.
23-May
DO-201
SnPb20
19-July
SnPb20
EIA-296-E
|
PDF
|
KHD251
Abstract: THD30E1H475M 680MF KHD160E106M32A0T00 KHD251E106M99C0B00 100MF 10P1 THD30E1H335M 32K76 THD61E2A107M
Text: DIPPED RADIAL LEAD MULTILAYER CERAMIC CAPACITORS Radial Lead Type Down sized ?FEATURES 1. Small in size and wide capacitance range. Max. 680MF is available. 2. Temperature characteristic is Y5U in EIA code. 3. Superior humidity characteristic and long life.
|
Original
|
680MF
250Vdc
THD51E1H336M
THD60E1H476M
THD60E1H686M
THD60E1H107M
THD61E1H157M
THD61E1H227M
THD21E2A334MT
THD21E2A474MT
KHD251
THD30E1H475M
KHD160E106M32A0T00
KHD251E106M99C0B00
100MF
10P1
THD30E1H335M
32K76
THD61E2A107M
|
PDF
|
U13-C
Abstract: No abstract text available
Text: Ü13C CERAMIC CAPACITORS Taping Type Disc Ceramic Capacitor 'I; FS5 Type CODE r ITEM P , ¿S . ± D Body Diameter C Bodv Thickness cçi Lead Diameter ¿s r~ -O* \ / oD0 / =0 j ÍP1 F 12.7 ±0.3 25.4x10 Lead length from Hole Center Lead 3.85 3:0 7 127-1 5
|
OCR Scan
|
3SDS20
U13-C
|
PDF
|
TSOP032-P-0400-1
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M17 EIAJ code : TSOP032-P-0400-1 Lead pitch 50mil Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 32-pin plastic TSOP II (FPT-32P-M17) * : Resin protrusion. (Each side : 0.15 (.006) Max)
|
Original
|
FPT-32P-M17
TSOP032-P-0400-1
50mil
400mil
32-pin
FPT-32P-M17)
TSOP032-P-0400-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: ADVANCE INFORMATION in te i 8XC151 SA/SB HIGH-PERFORMANCE CHMOS MICROCONTROLLER Commercial/Express MCSi 51 Microcontroller Compatible Instruction Set Pin Compatible with 44-lead PLCC and 40-lead PDIP MCS 51 Sockets Fast Instruction Pipeline 16-bit Internal Code Fetch
|
OCR Scan
|
8XC151
44-lead
40-lead
16-bit
48Tosc
48Tqsc
83C151SB
87C151SB
|
PDF
|
FPT-20P-M04
Abstract: No abstract text available
Text: SHRINK SMALL OUTLINE L-LEADED PACKAGE 20 PIN PLASTIC FPT-20P-M04 EIAJ code : SSOP020-P-0225-2 20-pin plastic SSOP Lead pitch 0.65mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20mmMAX FPT-20P-M04 * : These dimensions do not include resin protrusion.
|
Original
|
FPT-20P-M04
SSOP020-P-0225-2
20-pin
20mmMAX
FPT-20P-M04)
FPT-20P-M04
|
PDF
|
