Ceramic Capacitors 104
Abstract: mev-50a DXW21BN7511S SAYFP1G95AA0B00 ck 66 ul94v-0 lcd SAYFP897MCA0B00 SAFEB1G57KE0F00 SAWEN1G84 murata enc-03r MA300D1-1
Text: MURATA PRODUCTS 2009-2010 2009-2010 MURATA PRODUCTS !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice.
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K99E-27
Ceramic Capacitors 104
mev-50a
DXW21BN7511S
SAYFP1G95AA0B00
ck 66 ul94v-0 lcd
SAYFP897MCA0B00
SAFEB1G57KE0F00
SAWEN1G84
murata enc-03r
MA300D1-1
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Untitled
Abstract: No abstract text available
Text: Microwave Components/Modules Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Insertion Loss
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LDC32
LDC32900M03B-703
50ohm
50ohm
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Untitled
Abstract: No abstract text available
Text: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC31 Series 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate
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LDC31
LDC32
LDC43
50ohm
50ohm
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Untitled
Abstract: No abstract text available
Text: Microwave Components Microwave Components Chip Multilayer Hybrid Couplers Directional Coupler 1.6±0.1 0.6±0.1 1 (4) (5) (6) (3) (2) (1) 1.25±0.1 0.8±0.1 0.3±0.1 0.20+0.10/-0.15 0.2±0.1 LDC18906M17B-325 0.95±0.1 2.0±0.1 A (4) 0.2±0.1 0.3±0.1 (5)
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LDC18906M17B-325
LDC21836M20B-027
LDC55250M03B-200
LDC311G6003B-601
LDC32900M03B-703
LDC43850M03B-401
50ohm
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LDC32900M03B-703
Abstract: No abstract text available
Text: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Part Number
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LDC32
LDC32900M03B-703
50ohm
50ohm
LDC32900M03B-703
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Untitled
Abstract: No abstract text available
Text: Microwave Components 03.02.28 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate
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LDC311G6003B-601
LDC32900M03B-703
LDC43850M03B-401
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JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5139XZ
SMM5139XZ
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Untitled
Abstract: No abstract text available
Text: SMM5142XZ 17.7 – 23.6GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Balｌ • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • 10dB Conversion Gain • 2.6dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3
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SMM5142XZ
SMM5142XZ
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Size Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • 10dB Conversion Gain • 2.5dB Noise Figure • +2dBm Input Third Order Intercept Point IIP3
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SMM5139XZ
SMM5139XZ
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Untitled
Abstract: No abstract text available
Text: ES/SMM5144XZ Preliminary 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm
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ES/SMM5144XZ
30GHz
ES/SMM5144XZ
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LDC311G6003B-601
Abstract: LDC32900M03B-703 50-LOAD
Text: 高周波コンポーネンツ 05.05.30 チップ多層ハイブリッドカプラ 3dBハイブリッド 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1
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LDC311G6003B601
LDC32900M03B703
LDC43850M03B401
LDC55250M03B200
LDC311G6003B-601
LDC32900M03B-703
LDC43850M03B-401
LDC55250M03B-200
50-LOAD
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Untitled
Abstract: No abstract text available
Text: Microwave Components 03.06.12 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND
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LDC311G6003B-601
LDC32900M03B-703
50ohm
50ohm
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Untitled
Abstract: No abstract text available
Text: SMM5139XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier • Conversion Gain : 10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5139XZ
SMM5139XZ
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Untitled
Abstract: No abstract text available
Text: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Part Number
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LDC32
LDC32900M03B-703
50ohm
50ohm
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LDC311G6003B-601
Abstract: No abstract text available
Text: 高频元件 05.01.28 片状多层混合耦合器 3dB混合 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate
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LDC311G6003B-601
LDC32900M03B-703
LDC43850M03B-401
LDC55250M03B-200
LDC311G6003B-601
LDC32900M03B-703
LDC43850M03B-401
50ohm
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Untitled
Abstract: No abstract text available
Text: Microwave Components 04.10.20 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND
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LDC311G6003B-601
LDC32900M03B-703
50ohm
50ohm
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Untitled
Abstract: No abstract text available
Text: Preliminary ES/SMM5144XZ 24– 30GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, Low Noise Amplifier, LO Buffer Amplifier and x2 multiplier • Conversion Gain : 12dB • Input Third Order Intercept Point IIP3 :+2dBm
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ES/SMM5144XZ
30GHz
ES/SMM5144XZ
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Hybrid Couplers
Abstract: No abstract text available
Text: Microwave Components/Modules Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.2 2 (1) (4) (5) (6) 2.5±0.2 (3) 1.0±0.1 LDC32 Series 0.35±0.15 0.45±0.15 0.55±0.15 (4) : Out1 (1) : IN (5) : GND (2) : GND (3) : Terminate (6) : Out2 (in mm) Insertion Loss
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LDC32
LDC32900M03B-703
50ohm
50ohm
Hybrid Couplers
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JEP95 MS-028
Abstract: No abstract text available
Text: SMM5146XZ 12.7 – 15.4GHz Down converter MMIC FEATURES • Wafer Level Chip Scale Package with Solder Ball • Integrated Balanced Mixer, LO Buffer Amplifier, Low Noise Amplifier and x2 multiplier • 10dB Conversion Gain :10dB • Input Third Order Intercept Point IIP3 : +2dBm
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SMM5146XZ
10dBm
SMM5146XZ
JEP95 MS-028
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LDC31
Abstract: LDC32900M03B-703 LDC311G6003B-601 LDC43850M03B-401 LDC55250M03B-200 LDC43 LDC32
Text: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC31 Series 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate
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LDC31
LDC32
LDC43
50ohm
LDC32900M03B-703
LDC311G6003B-601
LDC43850M03B-401
LDC55250M03B-200
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Untitled
Abstract: No abstract text available
Text: Microwave Components Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC31 Series 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND (3) : Terminate
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LDC31
LDC32
LDC43
50ohm
50ohm
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LDC43850M03B-401
Abstract: LDC311G6003B-601 LDC32900M03B-703 LDC55250M03B-200
Text: Microwave Components 03.12.9 Chip Multilayer Hybrid Couplers 3dB Hybrid 0.9±0.1 3.2±0.15 2 (1) (4) (5) (6) (3) (2) (1) (4) (5) (6) LDC311G6003B-601 1.0±0.1 0.45±0.15 0.35±0.15 0.55±0.15 2.5±0.2 1.6±0.15 (3) 0.9±0.1 3.2±0.2 1.0±0.1 (1) : IN (2) : GND
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LDC311G6003B-601
LDC32900M03B-703
LDC43850M03B-401
50ohm
LDC43850M03B-401
LDC311G6003B-601
LDC32900M03B-703
LDC55250M03B-200
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MM5829-2700
Abstract: MM8030-2600 ANCL11G57SAA165 ANCL11G57 CSR BC5MM MICROCHIP 2012 SMD MARKING AS-M15SA-R CA0TB MEDIATEK z5v cap
Text: MURATA PRODUCTS 2010-2011 2010-2011 MURATA PRODUCTS !Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice.
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K99E-28
MM5829-2700
MM8030-2600
ANCL11G57SAA165
ANCL11G57
CSR BC5MM
MICROCHIP 2012 SMD MARKING
AS-M15SA-R
CA0TB
MEDIATEK
z5v cap
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