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    LASER DICING Search Results

    LASER DICING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54F157/BFA Rochester Electronics LLC DATA SEL/MULTIPLEXER; QUAD 2-INPUT Visit Rochester Electronics LLC Buy
    54F251A/BEA Rochester Electronics LLC 54F251 - DATA SEL/MULTIPLEXER, 8-INPUT, WITH 3-STATE OUTPUTS - Dual marked (M38510/33905BEA) Visit Rochester Electronics LLC Buy
    54LS298/BEA Rochester Electronics LLC 54LS298 - DATA SEL/MULTIPLEXER, QUAD 2-INPUT, WITH STORAGE - Dual marked (M38510/30909BEA) Visit Rochester Electronics LLC Buy
    54S153/BEA Rochester Electronics LLC 54S153 - DATA SEL/MULTIPLEXER, DUAL 4-INPUT - Dual marked (M38510/07902BEA) Visit Rochester Electronics LLC Buy
    54LS298/BFA Rochester Electronics LLC 54LS298 - DATA SEL/MULTIPLEXER, QUAD 2-INPUT, WITH STORAGE - Dual marked (M38510/30909BFA) Visit Rochester Electronics LLC Buy

    LASER DICING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    650nm 5mw laser

    Abstract: ird300 laser range finder schematics 500mW 808nm infrared laser diode driver circuit 650nm laser diode 200mw circuit diagram of radar range finder LD-808-500G t15f-xyz-wm LD-808-1000G LD-650-5A
    Text: VCSEL, Green, Red & Infrared Laser Modules & Optical Transceivers by Lasermate VCSELs | Communication Lasers | Photodiode Receivers | Fiber Optical Transceivers | Book Store | On Sale Items | Green, Red, & Infrared Laser Diode Modules | Laser Diodes | Laser Accessories | Laser Products | Electroluminescent Products |


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    PDF 1550nm 650nm 5mw laser ird300 laser range finder schematics 500mW 808nm infrared laser diode driver circuit 650nm laser diode 200mw circuit diagram of radar range finder LD-808-500G t15f-xyz-wm LD-808-1000G LD-650-5A

    tunable lasers diode applications

    Abstract: United Epitaxy Company infrared laser diode nir source ir laser dh 499 cryocooler US Lasers
    Text: IR LASER DIODES 3 - 25 µm Introduction Company profile LASER COMPONENTS GmbH was founded in 1982 as a European distributor of high quality laser and opto-electronic components. In-house production of hard dielectric coatings for laser optics and rods began in 1986 and the company has


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    QB-PS-A01

    Abstract: JDSU laser power supply JDSU QB-PS Q301 Q333-HD Q20x q202h umbilical Q201-HD
    Text: COMMERCIAL LASERS High-Power Q-Switched Diode-Pumped Laser Q Series Key Features • Intracavity harmonic generation • Sealed laser head with Direct-Coupled Pump DCP design • Highest commercially available pulse energy and peak power • Superior pulse-to-pulse amplitude and energy stability


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    PDF 498-JDSU 5378-JDSU QB-PS-A01 JDSU laser power supply JDSU QB-PS Q301 Q333-HD Q20x q202h umbilical Q201-HD

    254 nm uv LED

    Abstract: Chiller umbilical connector UV diode 250 nm r134a Q302 Q303-HD 532 nm laser diode umbilical Q3-04
    Text: COMMERCIAL LASERS High-Power Q-Switched Diode-Pumped UV Laser Q Series Key Features • Highest commercially available pulse energy and peak power • Tighter process control due to superior energy stability enabled by unique intracavity harmonic generation


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    PDF 498-JDSU 5378-JDSU 254 nm uv LED Chiller umbilical connector UV diode 250 nm r134a Q302 Q303-HD 532 nm laser diode umbilical Q3-04

    VCSEL-ULM850-14-TT-F

    Abstract: No abstract text available
    Text: 14 Gbps VCSEL 850 nm 1x4 1x12 chip Vertical Cavity Surface-Emitting Laser  Cathode on top side  Unsealed 85% r.H./85°C certified  Suitable for wirebond and flipchip process  Preliminary ELECTRO-OPTICAL CHARACTERISTICS Chip Temperature = 25°C unless otherwise stated.


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    PDF Ith25 ULM850-14-TT-N0104Y ULM850-14-TT-N0112Y VCSEL-ULM850-14-TT-F

    water jet cutting machine control schematic

    Abstract: sic wafer 100 mm silicon mems microphone UCHIYA GaAs wafer dicing Chip free mems microphone TLASC0022EA DSASW005159 MEMS front of fabrication process
    Text: Stealth Dicing Technical Information for MEMS Table of Contents 1. Introduction 2. Problems with dicing in MEMS fabrication processes 2.1 Grinding wheel type blade dicing 2.2 Making dicing a completely dry process 3. Stealth dicing technology 3.1 Basic principle of stealth dicing


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    PDF TLAS9005E01 water jet cutting machine control schematic sic wafer 100 mm silicon mems microphone UCHIYA GaAs wafer dicing Chip free mems microphone TLASC0022EA DSASW005159 MEMS front of fabrication process

    TLASC0022EA

    Abstract: No abstract text available
    Text: Stealth Dicing Technical Information for MEMS 2 Table of Contents 1. Introduction 2. Problems with dicing in MEMS fabrication processes 2.1 Grinding wheel type blade dicing 2.2 Making dicing a completely dry process 3. Stealth dicing technology 3.1 Basic principle of stealth dicing


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    PDF TLAS9005E04 TLASC0022EA

    Adwill D-175

    Abstract: UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec
    Text: AN106920 Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 — 13 January 2009 Application note Document information Info Content Keywords Sawn wafers, UV dicing tape, handling and processing Abstract This application note gives hints and recommendations regarding correct


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    PDF AN106920 AN106920lusion Adwill D-175 UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec

    Untitled

    Abstract: No abstract text available
    Text: Dicing Improvements: Yield Enhancement, Throughput Increase and Die Size Reduction in M/A-COM’s GaAs Fab Robert Fox M/A-COM : Tyco Electronics, 100 Chelmsford Street, Lowell, MA 01851 USA phone: 978-656-2523, email: foxr@tycoelectronics.com ABSTRACT A strong wafer dicing operation is vital to the


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    Untitled

    Abstract: No abstract text available
    Text: Stealth Dicing Technical Information for MEMS ステルスダイシング技術資料 2 目 次 1. はじめに 2. MEMS製造工程用ダイシング技術と課題 2.1 砥石切削型ブレードダイシング 2.2 ダイシング工程の完全ドライプロセス化


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    PDF TLAS9005J05

    FBU 4J

    Abstract: TLASC0023JA mems UCHIYA DSASW005159 laser dicing
    Text: Stealth Dicing Technical Information for MEMS ステルスダイシング技術資料 2 目 次 1. はじめに 2. MEMS製造工程用ダイシング技術と課題 2.1 砥石切削型ブレードダイシング 2.2 ダイシング工程の完全ドライプロセス化


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    PDF TLASC0022JA TLAS9005J03 FBU 4J TLASC0023JA mems UCHIYA DSASW005159 laser dicing

    D2050

    Abstract: laser dicing
    Text: - TECHNICAL INFORMATION -MAR. 2005


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    receiver avalanche 1550 fiber 2.5

    Abstract: ORTEL DFB laser 1612 EMCORE TOSA for 10G ER
    Text: Fiber Optic Solutions for High-Speed Broadband CATV, FTTP, Wireless, Satcom & Multimedia Networks SATCOM CATV TRANSMITTERS & RECEIVERS FTTP VIDEO TRANSPORT Lasers Photodiodes WIRELESS EMCORE is a leading supplier of components, subsystems and systems for the broadband fiber optics market. Our long


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    ic 555 use with metal detector

    Abstract: DVD optical pick-up assembly CD laser pickup assembly bolometer detector Light Detector laser
    Text: Introduction CHAPTER 01 1 Light and opto-semiconductors 1-1 Light 1-2 Opto-semiconductors 2 Opto-semiconductor lineup 3 Manufacturing process of opto-semiconductors 1 Introduction 1. Light and opto-semiconductors 1-1 Light Definition of light Light, like radio waves, is a type of electromagnetic wave.


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    Light Detector laser

    Abstract: short distance measurement ir infrared diode
    Text: Opto-semiconductors Condensed Catalog HAMAMATSU PHOTONICS K.K. Our unique photonics technology delivers highly sophisticated opto-semiconductors with high-sensitivity and high-speed response. Hamamatsu Photonics has been at the cutting edge of photonics technology for 60 years. In that


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    PDF KOTH0001E15 Light Detector laser short distance measurement ir infrared diode

    led flip-chip

    Abstract: finger print sensor fine world LED top layer reflector LED lights manufacturing technology result of 200 prize bond mems projector Nanotec panasonicdenkocojp gpa antenna
    Text: 9A>IEJA • Visit the MIPTEC page of our website Panasonic Electric Works 3D Packaging Devices Please contact . MIPTEC Panasonic Electric Works Co., Ltd. Automation Controls Business Unit Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan


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    PDF AKCT1B106E 201005-2YT led flip-chip finger print sensor fine world LED top layer reflector LED lights manufacturing technology result of 200 prize bond mems projector Nanotec panasonicdenkocojp gpa antenna

    Fluke 8502A

    Abstract: 8502a dupont 951 green tape dupont 951 paste resistor thick film 6 mil poly 850C Paste Dupont palladium
    Text: Effect of Processing Variables on the Co-Fired Properties of Thick Film Resistors in LTCC Michael R. Ehlert and Patrick S. Munoz National Semiconductor Corp. 520 Superior Avenue Newport Beach, CA 92663 Phone 949 515-5252 FAX (949) 515-9612 michael.ehlert@nsc.com


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    500/250/arc xenon flash lamps

    Abstract: No abstract text available
    Text: Electron Tube Products Condensed Catalog HAMAMATSU PHOTONICS K.K. Development and production centers for light sensors, light sources, and application-specific products utilizing light to support a wide range of needs in medical diagnosis/treatment, chemical analysis,


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    PDF OTH0016E06 500/250/arc xenon flash lamps

    Untitled

    Abstract: No abstract text available
    Text: Technology introduction CHAPTER 13 1 Semiconductor process technology 1-1 Silicon process technology 1-2 Compound semiconductor process technology 2 Assembly technology 2-1 2-2 2-3 2-4 2-5 Packages for diverse needs Flip chip bonding Dicing Module products


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    R7600U-300

    Abstract: UV LED 300 nm uvtron R11715-01 CD laser pickup assembly R11410 R928, hamamatsu
    Text: Visit our new website to find out all about us The latest catalog and detailed product information are available from our website. Our website contains a wealth of information including our corporate profile, history and news, as well as product introductions, new technology briefs, exhibition / workshop / seminar introductions,


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    PDF OTH0022E02 R7600U-300 UV LED 300 nm uvtron R11715-01 CD laser pickup assembly R11410 R928, hamamatsu

    Untitled

    Abstract: No abstract text available
    Text: V i s h ay I n t e rt e c h n o l o g y, I n c . Resistors - Guide for RF and UWave Substrates AND TEC I INNOVAT O L OGY RF and UWave Substrates N HN THIN FILM SUBSTRATES O 19 62-2012 Thin Film Design Guide for RF and UWave Substrates This guide provides a roadmap for the design process covering the following information:


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    PDF VMN-PL0456-1207

    Thin Film Resistors SiCr

    Abstract: SiCr thin film TI SAC305 hfss 80Au-20Sn 3 to 10 GHz bandpass filter sac305 thermal conductivity 184394 ansoft SAC305 reflow bga
    Text: AT C / / A V X T H I N F I L M TECHNOLOGIES Engineered Thin Film Solutions TA B L E O F C O N T E N T S Introduction to ATC // AVX Thin Film Technologies .1 - 2


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    L9657

    Abstract: S10604
    Text: 2007 Vol.2 E x h i b i t i o n s NEWS 2007 Vol.2 NEWS Belgium / Denmark / France / Germany / Italy / Netherlands / North Europe & CIS / November Vision 2007 Stuttgart / Germany UKAEA (Oxford / UK) Productronica 2007 (Munich / Germany) 35th Scottish Microscopy Symposium


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    PDF SE-17141 52/1A RU-113054 L9657 S10604

    Untitled

    Abstract: No abstract text available
    Text: CUSTOM HYBRID THICK FILM AND THIN FILM CIRCUITS O o B • ■ ■ RAPID PROTOTYPING VOLUME PRODUCTION TIMELY DELIVERY COST-EFFECTIVE PRICING NICRO-PRECISION TS D E I ^0^7^14 □OOGGDb S MPT's lorge capacity, high thruput, load-lock produc tion system with: Microprocessor Controller, DC or RF


    OCR Scan
    PDF TaN-50-100