2338 philips
Abstract: philips 2338 2338 resistor 2338 resistor philips philips resistor 0805 2338 2338 734
Text: Preliminary Specification Philips Components Trimmable Resistor Chip Size 0805 0/-20% and 0/-30% FEATU RES Lower assembly costs o o o • o—. £ E -H Cutting speed = 30 to 300 mm/s Q. Q. O O Trimming Instructions with YAG-laser showing typical values for:
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T004121
2338 philips
philips 2338
2338 resistor
2338 resistor philips
philips resistor 0805 2338
2338 734
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Untitled
Abstract: No abstract text available
Text: PAGE Wire Wound Chip Inductors 1/3 ——O-Series 0402 1005 /5514 Features 1. Coil body of ceramic material. 2. Contact area of pure tin with a nickel barrier layer. 3. Windings are created by laser-cutting of the copper layer and are –for protection – completely lacquer-coated.
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180mm,
27x10400
6096A.
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Untitled
Abstract: No abstract text available
Text: PAGE Wire Wound Chip Inductors 1/3 ——O-Series 0402 1005 /5514 Features 1. Coil body of ceramic material. 2. Contact area of pure tin with a nickel barrier layer. 3. Windings are created by laser-cutting of the copper layer and are –for protection – completely lacquer-coated.
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180mm,
6096A.
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c 5516
Abstract: No abstract text available
Text: PAGE Wire Wound Chip Inductors 1/3 ——O-Series 0603 1608 /5516 Features 1. Coil body of ceramic material. 2. Contact area of pure tin with a nickel barrier layer. 3. Windings are created by laser-cutting of the copper layer and are –for protection – completely lacquer-coated.
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180mm,
27x10X1
800MHz
6096A.
c 5516
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221-51
Abstract: No abstract text available
Text: PAGE Wire Wound Chip Inductors 1/3 ——O-Series 0603 1608 /5516 —— Features 1. Coil body of ceramic material. 2. Contact area of pure tin with a nickel barrier layer. 3. Windings are created by laser-cutting of the copper layer and are –for protection – completely lacquer-coated.
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180mm,
6096A.
221-51
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sem 5025
Abstract: gs 31 thermal printer head Al2O3 HA-96-2 AS970 amorphous head laser cutting circuit drilling machine applications
Text: アルミナ基板〔Al2O3〕 ALUMINA SUBSTRATES [ Al2O3 ] The Alumina substrates are produced under severe quality control with carefully selected high-purity Alumina materials that ensures stable quality and excellent characteristics. 回路部品 CIRCUIT CERAMICS
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bolometer
Abstract: bolometer application LASER BURN circuit diagram l41c LZT983 garnet Trimming
Text: JOHANSON LASERtrim Tuning Application Notes ACTIVE TRIMMING CHARACTERISTICS OF LASERtrim® CHIP CAPACITORS LASER TRIMMING PROCESS INTRODUCTION LASERtrim® chip capacitors are laser adjustable surface mount multi-layer ceramic MLCC capacitors intended for active trimming applications in various RF circuits.
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gs32
Abstract: Maruwa substrate amorphous head AS970 maruwa network resistor
Text: MARUWA GENERAL CATALOG ALUMINA SUBSTRATES [ Al2O3 ] The Alumina substrates are produced under severe quality control with carefully selected high-purity Alumina materials that ensures stable quality and excellent characteristics. a Features State : Good smoothness/flatness with less porosity due to fine particles. Excellent in adhesion with thick/thin film materials.
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110160m
Max430m
gs32
Maruwa substrate
amorphous head
AS970
maruwa
network resistor
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Untitled
Abstract: No abstract text available
Text: PBW J GEC PLESSEY CT3193-1.4 PLANAR INSERTED FERRITE SUBSTRATES FOR MICROWAVE INTEGRATED CIRCUITS GPS have the capability to supply a variety of metalised substrates manufactured using the state-of-the-art pattern plating technique. * FILMS: ADHESION LAYER
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CT3193-1
500HMz
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Untitled
Abstract: No abstract text available
Text: VISHAY BEYSCHLAG www.vishay.com Resistors Application Note Using Laser Trimmable Resistors By Thomas Bluhm PURPOSE AND APPROACH Recently, trimmable resistors have been in high demand due to their properties. Many manufacturers of electronic equipment see the benefits of using these components in
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30-Oct-13
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Fujikura panda fiber
Abstract: No abstract text available
Text: High-power pulsed fiber lasers and their evolution Yoshihiro Terada,1 Michihiro Nakai,1 and Yasuhiro Oba1 Fujikura has achieved an output power of 30 W from a Q-switched pulsed fiber laser with a pulse width about 100 ns for the first time in the world. Following the achievement, we
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B84p-I
B518aVIII10,
Fujikura panda fiber
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maxim CODE TOP MARKING
Abstract: maxim TOP MARKING maxim package marking UCSP maxim assembly of code without underfill Solder paste stencil life INCOMING INSPECTION solder paste MAXIM Assembly Locations
Text: 1 Maxim Integrated Products Assembly and Packaging Group Application Notes Wafer-Level Ultra-Chip-Scale Package 1.0 Introduction to Ultra-Chip-Scale Package UCSP The packaging technology in the Ultra-Chip-Scale Package (UCSP) enables the integrated circuit
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enhan/198
maxim CODE TOP MARKING
maxim TOP MARKING
maxim package marking
UCSP
maxim assembly of code
without underfill
Solder paste stencil life
INCOMING INSPECTION solder paste
MAXIM Assembly Locations
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Precision Monolithics OP07
Abstract: No abstract text available
Text: MT-037 TUTORIAL Op Amp Input Offset Voltage DEFINITION OF INPUT OFFSET VOLTAGE Ideally, if both inputs of an op amp are at exactly the same voltage, then the output should be at zero volts. In practice, a small differential voltage must be applied to the inputs to force the
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MT-037
Precision Monolithics OP07
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cd-rom circuit diagram
Abstract: cd-rom ic focus signal servo track 100 pin ic with feedback
Text: SM9404AF Read Channel IC for DVD-RAM/ROM NIPPON PRECISION CIRCUITS INC. OVERVIEW The SM9404AF is a read channel IC for DVD-RAM 4.7Gbyte , ROM (1/2- to 4x-speed), and CD-ROM (4×to 32-speed). FEATURES • ■ ■ ■ ■ ■ ■ ■ ■ Equalizer for waveform equivalence
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SM9404AF
SM9404AF
32-speed)
NC0010AE
cd-rom circuit diagram
cd-rom ic focus signal
servo track 100 pin ic with feedback
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CD Laser pickup focus tracking
Abstract: No abstract text available
Text: Panasonic Hologram Unit HUL7001 Hologram Unit Index mark for No.l U nit : mm For optical inform ation processing • Features il" T¡gi r • Smaller package size achieved through micro-mirror integration 4.8 X 8.2 X 4.3 mm • Focus error signal detection : SSD method
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HUL7001
CD Laser pickup focus tracking
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CD Laser pickup focus tracking
Abstract: CD laser pickup assembly OPTICAL PICKUP PANASONIC CD OPTICAL PICKUP PANASONIC optical CD pickup assembly HUL7001 hologram unit "focus error signal" 805nm OPTICAL laser pickup
Text: Panasonic Hologram Unit HUL7001 Hologram Unit Index mark for No.l Unit : mm For optical information processing • F eatures • Sm aller package size achieved through m icro-m irror integration 4.8 X 8.2 X 4.3 mm • Focus error signal detection : SSD method
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HUL7001
CD Laser pickup focus tracking
CD laser pickup assembly
OPTICAL PICKUP PANASONIC CD
OPTICAL PICKUP PANASONIC
optical CD pickup assembly
HUL7001
hologram unit
"focus error signal"
805nm
OPTICAL laser pickup
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schematic diagram of ip camera
Abstract: of IC micro A 741 schematic diagram ip camera diagram co2 tester power supply tester schematic diagram the working of the IC 741 as an oscillator L7270 OF IC 741 main working power supply laser co2 CCD CAMERA
Text: PATENT PENDING DUV Laser Application IC MICRO ABLATOR L7270 Allows selective removal of just the IC passivation film polyimides, SiN, etc. and upper metallization layer (Al, etc.). 30µm Strips away aluminum pattern DUV laser beam SiN passivation film Aluminum pattern
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L7270
S-164-40
TLAS1016E01
schematic diagram of ip camera
of IC micro A 741
schematic diagram ip camera
diagram co2 tester
power supply tester schematic diagram
the working of the IC 741 as an oscillator
L7270
OF IC 741 main working
power supply laser co2
CCD CAMERA
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Untitled
Abstract: No abstract text available
Text: 3 Stack Pulsed Laser Diode L11854-307-05 Features Radiant peak output power: > =21 W Peak emission wavelength: 905 nm Emitting area size: 70 mm x 10 mm Applications Laser range finder Security Measuring instruments Absolute maximum ratings Top(c = 25 ℃)
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L11854-307-05
17ewin
SE-164
LPLD2017E03
B1201
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FX888
Abstract: No abstract text available
Text: Pro Soldering Tool Kit Page 1 of 1 Pro Soldering Tool Kit This is a complete DIY Soldering kit that includes a Panavise circuit board holder and has instructional "How to Solder" directions etched right on its base. The kit includes a Hakko #FX888 soldering station, small pair of
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FX888
10013/List/0/SortField/4/ProductID/856/De
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CD laser pickup assembly
Abstract: ultrasonic movement DETECTOR CIRCUIT DIAGRAM HUL7001 "focus error signal" OPTICAL PICKUP PANASONIC CD panasonic disk drive cw-8124
Text: Hologram Unit HUL7001 Hologram Unit Unit : mm M Di ain sc te on na tin nc ue e/ d 0.3 11.2±0.2 8.2±0.2 ø8.0 +0 –0.05 Smaller package size achieved through micro-mirror integration (4.8 x 8.2 × 4.3 mm) 1 2 3 4 5 6 O Y (0.2) (0.5) Reference plane Focus error signal detection : SSD method
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HUL7001
CD laser pickup assembly
ultrasonic movement DETECTOR CIRCUIT DIAGRAM
HUL7001
"focus error signal"
OPTICAL PICKUP PANASONIC CD
panasonic disk drive cw-8124
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1064 nm
Abstract: RLTCO-1064-400W
Text: RLTCO-1064-400W TECHNICAL DATA High Power Infrared Diode Pumped Solid State Laser Features Applications • • • • • • • • • Output Power: 400 W 1064 nm Emission Wavelength Small Size, Compact Package Water-Cooled, High Efficiency High Beam Quality, Stability and Reliability
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RLTCO-1064-400W
1064 nm
RLTCO-1064-400W
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1064 nm
Abstract: RLTCO-1064-500W
Text: RLTCO-1064-500W TECHNICAL DATA High Power Infrared Diode Pumped Solid State Laser Features Applications • • • • • • • • • Output Power: 500 W 1064 nm Emission Wavelength Small Size, Compact Package Water-Cooled, High Efficiency High Beam Quality, Stability and Reliability
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RLTCO-1064-500W
1064 nm
RLTCO-1064-500W
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1064 nm
Abstract: RLTCO-1064-300W
Text: RLTCO-1064-300W TECHNICAL DATA High Power Infrared Diode Pumped Solid State Laser Features Applications • • • • • • • • • Output Power: 300 W 1064 nm Emission Wavelength Small Size, Compact Package Water-Cooled, High Efficiency High Beam Quality, Stability and Reliability
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RLTCO-1064-300W
1064 nm
RLTCO-1064-300W
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OPTICAL PICKUP PANASONIC CD
Abstract: CD laser pickup assembly ultrasonic movement DETECTOR CIRCUIT DIAGRAM HUL7001 CD Laser pickup focus tracking optical pickup unit ultrasonic movement detector
Text: Hologram Unit HUL7001 Hologram Unit Unit : mm Index mark for No.1 pin on reverse side 4.8 x 8.2 × 4.3 mm Y Reference plane Focus error signal detection : SSD method Reference plane Apparent emitting point SEC. X-O-Y Apparent emitting point Reference plane
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HUL7001
OPTICAL PICKUP PANASONIC CD
CD laser pickup assembly
ultrasonic movement DETECTOR CIRCUIT DIAGRAM
HUL7001
CD Laser pickup focus tracking
optical pickup unit
ultrasonic movement detector
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