LAND PATTERN SO18W Search Results

LAND PATTERN SO18W Result Highlights (5)

Part	Manufacturer	Description
HMC1126ACEZ	Analog Devices	24-LGA
HMC1126ACEZ-R7	Analog Devices	24-LGA
ADRF5731BCCZN-R7	Analog Devices	16 lead LGA
ADRF5721BCCZN-R7	Analog Devices	16 lead LGA
ADRF5731BCCZN	Analog Devices	16 lead LGA

LAND PATTERN SO18W Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
land pattern ssop28 Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder	Original	PDF
land pattern ssop28 Abstract: SO18W SSOP20 LAND PATTERN so24w SO20w package 11-365 land pattern for SSOP smd sot 23/5 IPC-SM-782 SSOP-20 Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder	Original	PDF
land pattern ssop28 Abstract: land pattern for SSOP16 SBFA015A SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56 Text: Application Report SBFA015A - January 1998 - Revised May 2003 SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Cost and performance requirements continue to push the packaging of electronic systems into smaller and smaller spaces. At one time, the standard center-to-center pin spacing was 100 mils 0.1" on through-hole parts (DIPs).	Original	PDF	SBFA015A land pattern ssop28 land pattern for SSOP16 SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56

Catalog Datasheet

MFG & Type

PDF

Document Tags

land pattern ssop28

Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN
Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder

Original

PDF

land pattern ssop28

Abstract: SO18W SSOP20 LAND PATTERN so24w SO20w package 11-365 land pattern for SSOP smd sot 23/5 IPC-SM-782 SSOP-20
Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder

Original

PDF

land pattern ssop28

Abstract: land pattern for SSOP16 SBFA015A SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56
Text: Application Report SBFA015A - January 1998 - Revised May 2003 SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Cost and performance requirements continue to push the packaging of electronic systems into smaller and smaller spaces. At one time, the standard center-to-center pin spacing was 100 mils 0.1" on through-hole parts (DIPs).

Original

PDF

SBFA015A land pattern ssop28 land pattern for SSOP16 SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56