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    LAND PATTERN QFP 132 Search Results

    LAND PATTERN QFP 132 Result Highlights (1)

    Part ECAD Model Manufacturer Description Download Buy
    BQ2052SN-A515 Texas Instruments Primary Lithium Gas Gauge W/High-Speed 1-Wire (HDQ) Interface, 3 Prgmable LED Patterns 16-SOIC -20 to 70 Visit Texas Instruments Buy

    LAND PATTERN QFP 132 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318 PDF

    Turn-Key

    Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
    Text:  RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25


    Original     		75GHz 50-80grams Turn-Key Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128 PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208 PDF

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


    Original     		PDF

    DC04 display

    Abstract: how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt
    Text: Quality And Reliability Report 2005 DC04-0001 Page 1 of 79


    Original     		DC04-0001 DC04 display how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt PDF

    Untitled

    Abstract: No abstract text available
    Text: RC64474 RC64475™ Prelim inary RISController™ Embedded 64-bit Microprocessor, based on RISCore4000™ Features Implements MIPS-III Instruction Set Architecture ISA 3.3V I/O * High performance 64-bit microprocessor, based on the RISCore4000 Minimized branch and load delays, through streamlined


    OCR Scan     		64-bit RISCore4000TM RC64474TM RC64475TM RISCore4000 RC4700-compatible 1000MB/ring IDT79RCXX PDF

    tsmc 0.35um 2p4m cmos

    Abstract: K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC
    Text: Quality And Reliability Report 2004 Period Covered: 2003


    Original     		DC04-0001 tsmc 0.35um 2p4m cmos K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC PDF

    Untitled

    Abstract: No abstract text available
    Text: Spartan-6 FPGA PCB Design and Pin Planning Guide UG393 v1.3 October 17, 2012 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG393 PDF

    xc6s

    Abstract: UG393 SPARTAN 6 UG393 v1.1 recommended layout CSG324 SPARTAN 6 UG393 DSP48A1 spartan 6 LX150 hyperlynx TUTORIALS xilinx FFT CSG324
    Text: Spartan-6 FPGA PCB Design and Pin Planning Guide UG393 v1.1 April 29, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG393 xc6s UG393 SPARTAN 6 UG393 v1.1 recommended layout CSG324 SPARTAN 6 UG393 DSP48A1 spartan 6 LX150 hyperlynx TUTORIALS xilinx FFT CSG324 PDF

    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


    Original     		SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4 PDF

    RJ63YC100

    Abstract: LR36B15 LR36b03 LR38627 RJ2321 LR388H3 IR2E67M pq1cx41h2zpq RJ2341 sharp RJ63YC100
    Text: CONTENTS Sharp Efforts Towards a Green Society . 2 Developing Devices with High Environmental Performance. 4 Raising the Level of Environmental Performance in Factories . 5 TFT LCD 6 LSI REG PACKAGES 32 CSP Chip Size Package .


    Original     		JQA-AU0212) ISO/TS16949: HT9A17E RJ63YC100 LR36B15 LR36b03 LR38627 RJ2321 LR388H3 IR2E67M pq1cx41h2zpq RJ2341 sharp RJ63YC100 PDF

    64F3062f25

    Abstract: H8/3062 64F3064f25 pin diagram of ic 741 diagram pc board ta 306-2 REJ09B0215-0600 H8/3062f 3062 MCU EF20 L2 h8 family
    Text: REJ09B0215-0600 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 16 H8/3062, H8/3062B Group Hardware Manual


    Original     		REJ09B0215-0600 H8/3062, H8/3062B 16-Bit Family/H8/300H H8/3062 HD6433062, HD6433061, HD6433060 64F3062f25 H8/3062 64F3064f25 pin diagram of ic 741 diagram pc board ta 306-2 REJ09B0215-0600 H8/3062f 3062 MCU EF20 L2 h8 family PDF

    64F3062f25

    Abstract: Nippon capacitors HD6433062 HD6433062B HD6433064B HD6433060 HD6433061 HD6433061B HD64F3062BF 64f3062
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		Unit2607 H8/3062, H8/3062B REJ09B0215-0600 64F3062f25 Nippon capacitors HD6433062 HD6433062B HD6433064B HD6433060 HD6433061 HD6433061B HD64F3062BF 64f3062 PDF

    mPD6252

    Abstract: Philips PM 2411 MPD78018F 78011FYGC-XXX-AB8 78011FYGC uPD78011F uPD78011FY uPD78012FY uPD78013F uPD78015F
    Text: mPD78018F, 78018FY SUBSERIES 8-BIT SINGLE-CHIP MICROCONTROLLER mPD78011F mPD78012F mPD78013F mPD78014F mPD78015F mPD78016F mPD78018F mPD78P018F 1994 mPD78011FY mPD78012FY mPD78013FY mPD78014FY mPD78015FY mPD78016FY mPD78018FY mPD78P018FY Document No. U10659EJ3V0UM00 3rd edition


    Original     		mPD78018F, 78018FY mPD78011F mPD78012F mPD78013F mPD78014F mPD78015F mPD78016F mPD78018F mPD78P018F mPD6252 Philips PM 2411 MPD78018F 78011FYGC-XXX-AB8 78011FYGC uPD78011F uPD78011FY uPD78012FY uPD78013F uPD78015F PDF

    A5625-01

    Abstract: A5620 land pattern for TSOP 2-86 a5609 28F001BX 28F010 28F020 outline of the heat sink for Theta JC A5644-01 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
    Text: Performance Characteristics of IC Packages 4.1 4 IC Package Electrical Characteristics As microprocessor speeds have increased and power supply voltages have decreased, the function of the microprocessor package has transitioned from that of a mechanical interconnect which


    Original     		PDF

    64F3062f25

    Abstract: Hitachi DSA002734 UA 741
    Text: Hitachi Single-Chip Microcomputer H8/3062 Series H8/3062 H8/3061 H8/3060 HD6433062 HD6433061 HD6433060 H8/3062B Series H8/3064B H8/3062B H8/3061B H8/3060B HD6433064B HD6433062B HD6433061B HD6433060B H8/3062F-ZTAT HD64F3062, HD64F3062R, HD64F3062B H8/3064F-ZTAT™


    Original     		H8/3062 H8/3061 H8/3060 H8/3064B H8/3062B H8/3061B H8/3060B HD6433062 HD6433061 64F3062f25 Hitachi DSA002734 UA 741 PDF

    64F3062F25

    Abstract: 64F3064f25 HD64F3062F25 64f3062f20 HD6433060 HD6433061 HD6433062 3060B 3062 MCU Mitsubishi NS20
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003.


    Original     		D-85619 D-85622 H8/300H H8/306x 25-Apr-02 H8/306x H8/3067 H8/3064 H8/3068F) 64F3062F25 64F3064f25 HD64F3062F25 64f3062f20 HD6433060 HD6433061 HD6433062 3060B 3062 MCU Mitsubishi NS20 PDF

    64F3062f25

    Abstract: 64F3064f25 HD6433060 HD6433061 HD6433062
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


    Original     		H8/3064F-ZTAT H8/3064 H8/3062F-ZTAT H8/3062 H8/3061 H8/3060 H8/3062B H8/3062F-ZTATTM, H8/3064F-ZTATTM 64F3062f25 64F3064f25 HD6433060 HD6433061 HD6433062 PDF

    T 705 scr

    Abstract: HD64F3062B Hitachi DSA00279
    Text: Hitachi Single-Chip Microcomputer H8/3062 Series H8/3062 H8/3061 H8/3060 HD6433062 HD6433061 HD6433060 H8/3062B Series H8/3064B H8/3062B H8/3061B H8/3060B HD6433064B HD6433062B HD6433061B HD6433060B H8/3062F-ZTAT HD64F3062, HD64F3062R, HD64F3062B H8/3064F-ZTAT™


    Original     		H8/3062 H8/3061 H8/3060 H8/3064B H8/3062B H8/3061B H8/3060B HD6433062 HD6433061 T 705 scr HD64F3062B Hitachi DSA00279 PDF

    LR36B03

    Abstract: LR35504 smoke alarm ic 555 PCB layout LQ080Y5DW30 LQ050T5DG01 LK400d3 LQ080Y5DW01 LQ080Y5DE30 453 8pin opto SHARP BS2F7VZ7395
    Text: CONTENTS Sharp Efforts Towards a Green Society . 2 TFT OPTOELECTRONICS LCD Modules . 8 LSI REG RF Analog CMOS IMAGE SENSORS CMOS Camera Modules Road Map . 13


    Original     		JQA-AU0212) ISO/TS16949: HT9A13E LR36B03 LR35504 smoke alarm ic 555 PCB layout LQ080Y5DW30 LQ050T5DG01 LK400d3 LQ080Y5DW01 LQ080Y5DE30 453 8pin opto SHARP BS2F7VZ7395 PDF

    qualcomm msm 8255

    Abstract: lm089hb1t04 GW 5819 DIODE IR3E11M1 IRM053U7 BS2F7VZ0165 lr36b11 LQ065T9DZ03 SHARP LM089HB1T04 LM081
    Text: ✲_❄on❏❆n❏•.❇m ✷❂❈❆ ✣ ✳❍❊❅❂❖, J❑l❖ ✥✣, ✥✣✣✪ ✦:✤✬ ✷M CONTENTS Advanced Measures for Environmental Conservation as Management Policy. PACKAGES


    Original     		A7887 JQA-QM3776 JQA-QMA11778 JQA-QM8688 qualcomm msm 8255 lm089hb1t04 GW 5819 DIODE IR3E11M1 IRM053U7 BS2F7VZ0165 lr36b11 LQ065T9DZ03 SHARP LM089HB1T04 LM081 PDF