LAND PATTERN FOR SSOP56 Search Results

LAND PATTERN FOR SSOP56 Result Highlights (6)

Part	ECAD Model	Manufacturer	Description	Download	Buy
GCM188D70E226ME36D		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for Automotive
GRM022C71A472KE19L		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM033C81A224KE01W		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM155D70G475ME15D		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM155R61J334KE01D		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose
GRM2195C2A333JE01D		Murata Manufacturing Co Ltd	Chip Multilayer Ceramic Capacitors for General Purpose

LAND PATTERN FOR SSOP56 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
land pattern ssop28 Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder	Original	PDF
land pattern ssop28 Abstract: SO18W SSOP20 LAND PATTERN so24w SO20w package 11-365 land pattern for SSOP smd sot 23/5 IPC-SM-782 SSOP-20 Text: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder	Original	PDF
land pattern ssop28 Abstract: land pattern for SSOP16 SBFA015A SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56 Text: Application Report SBFA015A - January 1998 - Revised May 2003 SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Cost and performance requirements continue to push the packaging of electronic systems into smaller and smaller spaces. At one time, the standard center-to-center pin spacing was 100 mils 0.1" on through-hole parts (DIPs).	Original	PDF	SBFA015A land pattern ssop28 land pattern for SSOP16 SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56
c6822 Abstract: pdcr 22 91185A558 transistor c6822 land pattern for SSOP56 CY8C21002-24PVXI pdcr9 SSOP20 LAND PATTERN transistor c3845 J1-0603 Text: PROPRIETARY INFORMATION: Information contained in this drawing is confidential. Copying, distributing or use in any matter, other than that specified by IRONWOOD ELECTRONICS, INC., is strictly prohibited and may be unlawful. If you have received this drawing in	Original	PDF	21X23 91185A558 CY8C21002-24PVXI CY3250-21X23 SSOP56 CY8C21002-24PVXI) XT-PSoC-15-20H-10-01 20-Pin PDCR-9323 121R-32400 c6822 pdcr 22 91185A558 transistor c6822 land pattern for SSOP56 CY8C21002-24PVXI pdcr9 SSOP20 LAND PATTERN transistor c3845 J1-0603
land pattern for TSOP 2-44 Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original	PDF
pioneer PAL 007 A Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions	Original	PDF
PAL 007 pioneer Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56 Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions	Original	PDF
TSOP-48 pcb LAYOUT Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010 Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original	PDF
LGA 1156 PIN OUT diagram Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and	Original	PDF