PA-DSO-1403
Abstract: PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6
Text: DIP to SO-Plug Prototyping Adapter Kits These adapters will convert a small outline land pattern to a DIP package. The adapter provides a solder down SOplug on the bottom and a detachable 300 or 600 mil wide open-frame DIP socket on the top. They are also available
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PA-SOF-D420-14/6
PA-SOF-D420-16/6
PA-SOF-D420-18/6
PA-SOF-D420-20/6
PA-SOF-D420-24/6
PA-SOF-D420-28/6
PA-SOF-D470-14/6
PA-SOF-D470-16/6
PA-SOF-D470-18/6
PA-SOF-D470-20/6
PA-DSO-1403
PA-DSO-4406
PA-SOF-D310-20/6
PA-SOF-D310-16/6
PA-SOF-D420-14/6
PA-SOF-D310-18/6
PA-SOF-D310-14/6
PA-SOF-D250-08/6
PA-SOF-D250-14/6
PA-SOF-D250-16/6
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IPC-7351A
Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
Text: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35
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IPC-7351A
DFN1006-2
OD-323
OD-123
OD-523
DFN1006-3
DFN1310H4-6
DFN1612-6
IPC-7351A,
AP02001
IPC-7351A
DFN1616-8
DFN2018-6
ipc SMB SMC
MELF pad layout
MiniMELF land pattern
MELF "Land Pattern"
DFN1411-3
land pattern for SOP
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240817
Abstract: SURFACE MOUNT TECHNOLOGY
Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,
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land pattern for sot109-1
Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products
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DO-35
DO-41
DO-34
OD80C
OD123F
HXSON12)
OT983
land pattern for sot109-1
TSSOP-8 footprint and soldering sot-23
SOD87 footprint
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Si8640BB
Abstract: No abstract text available
Text: Si8640/41/42/45 L O W - P OWER Q UAD - C HANNEL D IGITAL I SOLATOR Features High-speed operation DC to 150 Mbps No start-up initialization required Wide Operating Supply Voltage 2.5–5.5 V Up to 5000 VRMS isolation
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Si8640/41/42/45
60-year
Si8640BB
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TK12A10K3
Abstract: tk12a10k TK33A60V TPCA*8065 TK40E10K3 SSM6K407TU TPCA*8064 tk6a65d equivalent TPCA*8036 TK100G10N1
Text: Semiconductor Catalog 2012-3 MOSFETs SEMICONDUCTOR & STORAGE PRODUCTS http://www.semicon.toshiba.co.jp/eng C O N T E N T S 1 Features and Structures . 3 2 Toshiba’s MOSFET Product Lines and Part Numbering Schemes. 4
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TD9722
Abstract: No abstract text available
Text: Techcode DATASHEET Stereo, Differential Input Cap-Free Line Driver TD9722 General Description Features The TD9722 is a stereo, differential input, single supply,and cap-free line driver, which is available in SOP-14 and TSSOP-14 packages. The TD9722 is ground-reference output, and doesn’t need
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TD9722
TD9722
OP-14
TSSOP-14
TSSOP-14
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TD9721
Abstract: No abstract text available
Text: Techcode DATASHEET Stereo, Differential Input Cap-Free Line Driver TD9721 General Description Features The TD9721 is a stereo, differential input, single supply,and cap-free line driver, which is available in SOP-14 and TSSOP-14 packages. The TD9721 is ground-reference output, and doesn’t need
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TD9721
TD9721
OP-14
TSSOP-14
TSSOP-14
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STJ009
Abstract: No abstract text available
Text: STJ009 P-ch Trench MOSFET Portable Equipment Application Features Low drain-source On-resistance: RDS on =72mΩ (Max.) @VGS=-10V, ID=-2.7A Low gate charge: Qg=4.7nC (Typ.) High power and current handing capability RoHS compliant device SOP-8
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STJ009
14-JUN-13
KSD-T7F003-002
STJ009
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LH1540ACDTR
Abstract: LH1525ACD LH1540 LH1540ACD
Text: LH1540ACD/ACDTR 1 Form A SOP Solid-State Relay FEATURES • • • • • • • • • Package Dimensions in Inches mm High-speed Operation 1500 VRMS I/O Isolation Current-limit Protection High Surge Capability Linear, ac/dc Operation Clean, Bounce-free Switching
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LH1540ACD/ACDTR
E52744
LH1525ACD
1-888-Infineon
LH1540ACDTR
LH1540
LH1540ACD
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z44n
Abstract: mosfet z44n specification of mosfet irf IRF MOSFET driver IRF Power MOSFET code marking IRF n CHANNEL MOSFET 1N4148 marking SOT89 MARKING CODE CL sot89 Marking mosfet RL Z44N
Text: AP436 Synchronous Rectifier MOSFET Driver Features General Descriptions - VOUT slew-rate minimum 100V/uS @ CL=3000pF - IOUT sink & source =1.2 / 0.9 A - Safety considered. - Reduce power system thermal & increase system efficiency. - Pb-free packages: SOT89-5L, SOP-8L
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AP436
00V/uS
3000pF
OT89-5L,
AP436
z44n
mosfet z44n
specification of mosfet irf
IRF MOSFET driver
IRF Power MOSFET code marking
IRF n CHANNEL MOSFET
1N4148 marking
SOT89 MARKING CODE CL
sot89 Marking mosfet
RL Z44N
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AN4129
Abstract: FAN7601B
Text: FAN7601B Green Current Mode PWM Controller Features Description • • The FAN7601B is a programmable frequency green current mode PWM controller. It is specially designed for the offline adapter applications and the auxiliary power
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FAN7601B
300kHz
FAN7601B
AN4129
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FAN7601B
Abstract: 0306 8pin AN4129 FAN7601BGX AN412 FAN7601BMX FAN7601
Text: FAN7601B Green Current Mode PWM Controller Features Description • • The FAN7601B is a programmable frequency green current mode PWM controller. It is specially designed for the offline adapter applications and the auxiliary power
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FAN7601B
300kHz
FAN7601B
0306 8pin
AN4129
FAN7601BGX
AN412
FAN7601BMX
FAN7601
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uav design
Abstract: uav sensors uav electronic design microprocessor in ROBOT SYSTEMS garmin geko 201 pc controlled robot main project circuit diagram garmin garmin GPS 12 GPS Builder "laser range finder"
Text: Artificially Intelligent Autonomous Aircraft Navigation System Using a DT on an FPGA Star Award Artificially Intelligent Autonomous Aircraft Navigation System Using a Distance Transform on an FPGA Institution: Monash University Participants: Nathan William Smith
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A6278
Abstract: A6279 A6279EETTR-T A6279ELPTR-T Direct Replacement allegro
Text: A6278 and A6279 Serial-Input Constant-Current Latched LED Drivers with Open LED Detection Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A6278 and A6279 devices are specifically designed for LED display applications. Each of these BiCMOS devices
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A6278
A6279
A6279
A6279.
A6279EETTR-T
A6279ELPTR-T
Direct Replacement allegro
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A6278EAT
Abstract: a6278elwt
Text: A6278 and A6279 Serial-Input Constant-Current Latched LED Drivers with Open LED Detection Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A6278 and A6279 devices are specifically designed for LED display applications. Each of these BiCMOS devices
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A6278
A6279
A6279.
A6278EAT
a6278elwt
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A6278
Abstract: A6279 A6279EETTR-T A6279ELPTR-T
Text: A6278 and A6279 Serial-Input Constant-Current Latched LED Drivers with Open LED Detection Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A6278 and A6279 devices are specifically designed for LED display applications. Each of these BiCMOS devices
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A6278
A6279
A6279
A6279.
A6279EETTR-T
A6279ELPTR-T
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A6279EA-T
Abstract: A6279ELPTR-T A6279ELWTR-T A6278 A6278EA-T A6278ELPTR-T A6278ELWTR-T A6279
Text: A6278 and A6279 Serial-Input Constant-Current Latched LED Drivers with Open LED Detection Features and Benefits Description ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ The A6278 and A6279 devices are specifically designed for LED display applications. Each of these BiCMOS devices
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A6278
A6279
A6279
A6279.
A6279EA-T
A6279ELPTR-T
A6279ELWTR-T
A6278EA-T
A6278ELPTR-T
A6278ELWTR-T
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IPC-SM-782
Abstract: IPCSM-782 IPC-782 IPC782 SOJ 44 PCB land MELF "Land Pattern" land pattern for TSOP J-Lead, QFP ceramic
Text: Number One Systems IPC-SM-782 Library Supplementary Surface Mount Library for Easy-PC For Windows IPC-SM-782 Library The optional IPCSM-782 library contains supplementary component IPC782.CML and PCB symbol (IPC782.PSL) libraries for use with any variant of Easy-PC For Windows,
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IPC-SM-782
IPCSM-782
IPC782
IPC-SM-782,
IPC782"
IPC-782
SOJ 44 PCB land
MELF "Land Pattern"
land pattern for TSOP
J-Lead, QFP ceramic
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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Untitled
Abstract: No abstract text available
Text: Si844x/5x QSOP F O UR A N D F IVE - C HANNEL D IGITAL I SOLA TORS Features High-speed operation Up to 1000 VRMS isolation DC Precise timing typical to 150 Mbps No start-up initialization required Wide Operating Supply Voltage: 2.70–5.5 V
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Si844x/5x
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28F160
Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than
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BFG95
Abstract: No abstract text available
Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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UG112
UG072,
UG075,
XAPP427,
BFG95
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land pattern for TSsOP 16
Abstract: land pattern for TSSOP RL01 dj rw
Text: R E V 1 S 1ON S REV S YMM D E SC R IP T IO N B REDRAW ON C P O S . T O L . O F L E A D S WAS 0 . 1 3 ; UPDATE NOTE 1. D ADD LEAD PRO/E; FIN IS H ADD NOTE LAND PATTERN RECOM ENDATION CHANGE S H T . & UPDATE TO "B" E .C .N . DATE 113 2 3 02/16/1996 MS/CS 721
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OCR Scan
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MO-153,
SOMKT-MTD56
land pattern for TSsOP 16
land pattern for TSSOP
RL01
dj rw
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