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    LAND PATTERN FOR SOP Search Results

    LAND PATTERN FOR SOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    LAND PATTERN FOR SOP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100 PDF

    TSSOP 8PIN MARK 21

    Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
    Text: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP


    Original     		SC-82AB SC-88A OT-23-3 OT-23-5 OT-23-6 OT-89-3 OT-89-5 14-Pin 10-Pin 16-Pin TSSOP 8PIN MARK 21 land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P PDF

    PA-DSO-1403

    Abstract: PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6
    Text: DIP to SO-Plug Prototyping Adapter Kits These adapters will convert a small outline land pattern to a DIP package. The adapter provides a solder down SOplug on the bottom and a detachable 300 or 600 mil wide open-frame DIP socket on the top. They are also available


    Original     		PA-SOF-D420-14/6 PA-SOF-D420-16/6 PA-SOF-D420-18/6 PA-SOF-D420-20/6 PA-SOF-D420-24/6 PA-SOF-D420-28/6 PA-SOF-D470-14/6 PA-SOF-D470-16/6 PA-SOF-D470-18/6 PA-SOF-D470-20/6 PA-DSO-1403 PA-DSO-4406 PA-SOF-D310-20/6 PA-SOF-D310-16/6 PA-SOF-D420-14/6 PA-SOF-D310-18/6 PA-SOF-D310-14/6 PA-SOF-D250-08/6 PA-SOF-D250-14/6 PA-SOF-D250-16/6 PDF

    7402

    Abstract: ED-7402 land pattern for SOP DATA SHEET 7402 ED-7402-1 datasheet 7402 7402 data sheet
    Text: SOP LAND PATTERN DIMENSIONS e1 e1 I2 α L β1 β2 b b2 Dimension Parameter e 1.27 α β1 β2 γ 0.20 0.50 0.20 0.30 b2 e E I2 I2 L+ β 1 + β 2 b b2 e − γ Unit : mm Remark Washability of the printed-circuit board Soldering strength Pattern accuracy of the solder mask and visual inspection soldering.


    Original     		ED-7402-1 7402 ED-7402 land pattern for SOP DATA SHEET 7402 ED-7402-1 datasheet 7402 7402 data sheet PDF

    IPC-7351A

    Abstract: AP02001 DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP
    Text: Suggested Pad Layout Based on IPC-7351A Figure 1 Dimensions DFN1006-2 MiniMELF MELF SOD-323 SOD-123 SOD-523 SMA SMB SMC 9.3 Z 1.1 4.8 6.3 3.75 4.9 2.3 6.5 6.7 G 0.3 2.1 3.3 1.05 2.5 1.1 1.5 1.8 4.4 X 0.7 1.7 2.7 0.65 0.7 0.8 1.7 2.3 3.3 Y 0.4 1.3 1.5 1.35


    Original     		IPC-7351A DFN1006-2 OD-323 OD-123 OD-523 DFN1006-3 DFN1310H4-6 DFN1612-6 IPC-7351A, AP02001 IPC-7351A DFN1616-8 DFN2018-6 ipc SMB SMC MELF pad layout MiniMELF land pattern MELF "Land Pattern" DFN1411-3 land pattern for SOP PDF

    Y1 SOT-23

    Abstract: MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8
    Text: SUGGESTED PAD LAYOUT Based on IPC-7351A DFN1006-2 / DFN1006H4-2 / MiniMELF / MELF / SOD-323 / SOD-123 / SOD-523 / SMA / SMB / SMC C X G Y Z Dimensions Z G X Y C DFN1006-2 / MiniMELF DFN1006H4-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF SOD-123 SOD-323 SOD-523


    Original     		IPC-7351A DFN1006-2 DFN1006H4-2 OD-323 OD-123 OD-523 DFN1006H4-2 OD-123 OD-323 Y1 SOT-23 MELF pad layout DFN2020-3 ipc SMB SMC land pattern for TSsOP 16 IPC-7351A SOT-353 G5 SOD-323 land pattern SOD523 land pattern land pattern for msOP 8 PDF

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    CPC1225N

    Abstract: cpc1002 CPC1004N LCA715 "pin compatible" CPC1017N CPC1025N cpc1008 CPC1018N CPC1030N CPC1035N
    Text: Single Pole Normally Open: 1-Form-A CPC1008N 100 150 8 1500 2 1 2/0.5 4 Pin SOP CPC1016N 100 100 16 1500 2 1 2/0.5 4 Pin SOP CPC1017N 1500 1 1 10/10 4 Pin SOP 60 100 16 CPC1018N 60 600 0.8 1500 1 1 3/2 4 Pin SOP CPC1025N 400 120 30 1500 2 1 2/1 4 Pin SOP CPC1030N


    Original     		CPC1008N CPC1016N CPC1017N CPC1018N CPC1025N CPC1030N CPC1035N CPC1225N CPC1230N CPC1330 CPC1225N cpc1002 CPC1004N LCA715 "pin compatible" CPC1017N CPC1025N cpc1008 CPC1018N CPC1030N CPC1035N PDF

    SOP20 Package

    Abstract: SOP20 20 pin Package PSOP-20
    Text: 20-Pin Small Outline Package SOP20 Package Outline Dimensions Outline Dimensions 1.27 0.43 +0.07 –0.04 0 ～10゜ 0.8 ±0.2 0.25 M 13.3 max 0.1 Land Pattern Example Enlarged view of A A 0.1 +0.1 –0.05 1.5 ±0.2 12.8 ±0.2 1.9 max 0.685 typ. 0.25 10 +0.075


    Original     		20-Pin SOP20 Package SOP20 20 pin Package PSOP-20 PDF

    apx339

    Abstract: APX393 TSSOP-14L
    Text: APX393/APX339 LOW VOLTAGE RAIL-TO-RAIL INPUT DUAL/QUAD COMPARATORS General Description Features • • • • • • • • The APX393/339 are low voltage 2.5V to 5.5V dual and quad comparators. The APX393 is the dual version available in the 8-pin SOP and MSOP packages. The APX339 is the quad


    Original     		APX393/APX339 APX393/339 APX393 APX339 14-pin APX393/339 APX393/APX339 FEBRUARY2008 TSSOP-14L PDF

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


    Original     		PDF

    programming smt machine

    Abstract: pick and place robot tank water level control A5668-01 SURFACE MOUNT RESISTOR SMT Process application 741 heat exchanger wired pick and place robot water pumping machine control schematic
    Text: Leaded Surface Mount Technology SMT 7.1 7 Introduction Traditional through-hole Dual In-Line Package assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight, volume, and


    Original     		PDF

    pick and place robot

    Abstract: application of pick place robot qfp 0.4mm land pattern QFP 208 pick and place robot used for circuit assembling Surface mount SMA connector land pattern QFP 132 qfp 32 land pattern wired pick and place robot 300C
    Text: CHAPTER 7 SURFACE MOUNT TECHNOLOGY INTRODUCTION Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost weight volume and reliability at approximately 68L SMT allows production of more reliable assemblies at increased board density reduced


    Original     		IPC-SM-782 pick and place robot application of pick place robot qfp 0.4mm land pattern QFP 208 pick and place robot used for circuit assembling Surface mount SMA connector land pattern QFP 132 qfp 32 land pattern wired pick and place robot 300C PDF

    land pattern for sot109-1

    Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
    Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products


    Original     		DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint PDF

    Untitled

    Abstract: No abstract text available
    Text: Si8650/51/52/55 L O W P O W E R F I V E - C HANNEL D IGITAL I SOLATOR Features          High-speed operation DC to 150 Mbps No start-up initialization required Wide Operating Supply Voltage 2.5–5.5 V Up to 5000 VRMS isolation


    Original     		Si8650/51/52/55 60-year PDF

    SI8641

    Abstract: Si8641BD-A-IS Si8641BD-B-IS SI8642ED si8642bd-b-is si86xx Si8642ED-B-IS si8640 Si8640ED-B-IS Si8645BD-B-IS
    Text: Si8640/41/42/45 L O W - P OWER Q UAD - C HANNEL D IGITAL I SOLATOR Features  High-speed operation DC to 150 Mbps  No start-up initialization required  Wide Operating Supply Voltage 2.5–5.5 V  Up to 5000 VRMS isolation   


    Original     		Si8640/41/42/45 60-year SI8641 Si8641BD-A-IS Si8641BD-B-IS SI8642ED si8642bd-b-is si86xx Si8642ED-B-IS si8640 Si8640ED-B-IS Si8645BD-B-IS PDF

    Si8640BB

    Abstract: No abstract text available
    Text: Si8640/41/42/45 L O W - P OWER Q UAD - C HANNEL D IGITAL I SOLATOR Features  High-speed operation DC to 150 Mbps  No start-up initialization required  Wide Operating Supply Voltage 2.5–5.5 V  Up to 5000 VRMS isolation   


    Original     		Si8640/41/42/45 60-year Si8640BB PDF

    TK12A10K3

    Abstract: tk12a10k TK33A60V TPCA*8065 TK40E10K3 SSM6K407TU TPCA*8064 tk6a65d equivalent TPCA*8036 TK100G10N1
    Text: Semiconductor Catalog 2012-3 MOSFETs SEMICONDUCTOR & STORAGE PRODUCTS http://www.semicon.toshiba.co.jp/eng C O N T E N T S 1 Features and Structures . 3 2 Toshiba’s MOSFET Product Lines and Part Numbering Schemes. 4


    Original     		PDF

    TD9722

    Abstract: No abstract text available
    Text: Techcode DATASHEET Stereo, Differential Input Cap-Free Line Driver TD9722 General Description Features The TD9722 is a stereo, differential input, single supply,and cap-free line driver, which is available in SOP-14 and TSSOP-14 packages. The TD9722 is ground-reference output, and doesn’t need


    Original     		TD9722 TD9722 OP-14 TSSOP-14 TSSOP-14 PDF

    TD9721

    Abstract: No abstract text available
    Text: Techcode DATASHEET Stereo, Differential Input Cap-Free Line Driver TD9721 General Description Features The TD9721 is a stereo, differential input, single supply,and cap-free line driver, which is available in SOP-14 and TSSOP-14 packages. The TD9721 is ground-reference output, and doesn’t need


    Original     		TD9721 TD9721 OP-14 TSSOP-14 TSSOP-14 PDF

    BA1360

    Abstract: control ic for induction heating cooker epoxy adhesive paste cte table BA1360F
    Text: Monolithic ICs S m a ll S ma l l Outline Package Outline Package High-density packaging is strongly requested lor e le c ­ 2 Are package power smaller than M odel DIP? — tronic parts as the electronic equipment and devices are There is a difference with a single production unit. How­


    OCR Scan     		PDF

    STJ009

    Abstract: No abstract text available
    Text: STJ009 P-ch Trench MOSFET Portable Equipment Application Features  Low drain-source On-resistance: RDS on =72mΩ (Max.) @VGS=-10V, ID=-2.7A  Low gate charge: Qg=4.7nC (Typ.)  High power and current handing capability  RoHS compliant device SOP-8


    Original     		STJ009 14-JUN-13 KSD-T7F003-002 STJ009 PDF

    MARKING T6C

    Abstract: lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin
    Text: Technical Note PACKAGES LINE-UP FOR RF AND MICROWAVE DEVICES Document No. PX10051EJ35V0TN 35th edition Date Published March 2010 NS NEC Electronics Corporation 2001, 2010 Printed in Japan • The information in this document is current as of March, 2010. The information is subject to change


    Original     		PX10051EJ35V0TN G0706 MARKING T6C lga 1155 package Code T6S M33 TRANSISTOR 14SSOP QFN-36 LAND PATTERN 14LGA 36pin qfn marking 6-PIN PLASTIC TSON nec 44pin PDF

    land pattern for TSsOP 16

    Abstract: land pattern for TSSOP RL01 dj rw
    Text: R E V 1 S 1ON S REV S YMM D E SC R IP T IO N B REDRAW ON C P O S . T O L . O F L E A D S WAS 0 . 1 3 ; UPDATE NOTE 1. D ADD LEAD PRO/E; FIN IS H ADD NOTE LAND PATTERN RECOM ENDATION CHANGE S H T . & UPDATE TO "B" E .C .N . DATE 113 2 3 02/16/1996 MS/CS 721


    OCR Scan     		MO-153, SOMKT-MTD56 land pattern for TSsOP 16 land pattern for TSSOP RL01 dj rw PDF