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    LAND PATTERN FOR SC70 Search Results

    LAND PATTERN FOR SC70 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    LAND PATTERN FOR SC70 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern

    tssop 16 exposed pad stencil

    Abstract: C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 tssop 16 exposed pad stencil C1316C SOIC 8 pcb pattern qfn 88 stencil SOIC 16 narrow body exposed pad pcb pattern 1316C land pattern for TSsOP 16 land pattern for TSSOP 24 pin jedec package MO-220 QFN-32 SOIC 8 narrow body pcb pattern

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    C1316C

    Abstract: LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10
    Text: Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and Packaging Electronic Circuits surface


    Original     		PDF IPC-SM-782. SC-70 10/02A C1316C LPCC-16 land pattern for msOP 8 SOIC 8 pcb pattern jedec package MO-220 QFN-32 16 soic smd pcb footprint land pattern for TO 92 qfn 32 land pattern qfn32 land pattern land pattern for msOP 10

    200123K

    Abstract: QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction Surface Mount Guidelines for Leadless Packages This Application Note provides sample PCB land pattern dimensions for a variety of leaded and leadless packages. These


    Original     		PDF IPC-SM-782) 200123K 200123K QFN 88 land pattern LGA-28 land pattern SOIC 8 pcb pattern

    1206 land pattern

    Abstract: NOMCA MPMA HTRN
    Text: Land Patterns www.vishay.com Vishay Dale Thin Film Vishay Dale Thin Film Land Patterns 1. Scope This technical note provides sample land patterns for Vishay Dale Thin Film SMT resistive products. The following drawings are based on IPC-SM-782 Surface Mount Design and Land Pattern Standard. These drawings are for reference only Vishay Thin


    Original     		PDF IPC-SM-782 M/D55342 12-Jun-15 1206 land pattern NOMCA MPMA HTRN

    Untitled

    Abstract: No abstract text available
    Text: UM5304EEXF Quad Channel Low Capacitance ESD Protection Array UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been


    Original     		PDF UM5304EEXF UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 UM5304EEXF

    Untitled

    Abstract: No abstract text available
    Text: UM5304EEXF Quad Channel Low Capacitance ESD Protection Array UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5304EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been


    Original     		PDF UM5304EEXF UM5304EEAF UM5304EEBF UM5304EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 UM5304EEXF

    Untitled

    Abstract: No abstract text available
    Text: UM5204EEXF Quad Channel Low Capacitance ESD Protection Array UM5204EEAF UM5204EEBF UM5204EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 General Description UM5204EEXF are surge rated diode arrays designed to protect high speed data interfaces. This series has been


    Original     		PDF UM5204EEXF UM5204EEAF UM5204EEBF UM5204EECF SC70-6/SC88/SOT363 SC89-6/SOT563/SOT666 TSOP-6/SOT23-6 UM5204EEXF

    Untitled

    Abstract: No abstract text available
    Text: UESD6V8L4A/B Low Capacitance Quad Line ESD Protection Diode Array UESD6V8L4A SC70-5/SC88A/SOT353 UESD6V8L4B SC89-5/SOT553/SOT665 General Description The UESD6V8L4A/B of TVS diode array is designed to protect sensitive electronics from damage or latch-up due to ESD, for use in applications where board space is at a premium. It is unidirectional device and may be


    Original     		PDF SC70-5/SC88A/SOT353 SC89-5/SOT553/SOT665

    Untitled

    Abstract: No abstract text available
    Text: 95040 PA2011 Low RDSON SPDT Analog Switch. ANALOG PRODUCTS DIVISION Description Features • • • • • Low Voltage Operation 1.8 V to 3.3 V Low On-Resistance - rON: 1.8  at 2.7 V Low Charge Injection Low Voltage Logic Compatible DFN-6 Package or SC70-6 Package


    Original     		PDF PA2011 SC70-6 PA2011

    95040

    Abstract: PA2011SC 16 chanel input switch analog PA2011SC-T7
    Text: 95040 PA2011 Low RDSON SPDT Analog Switch. ANALOG PRODUCTS DIVISION Features • • • • • Description Low Voltage Operation 1.8 V to 3.3 V Low On-Resistance - rON: 1.8  at 2.7 V Low Charge Injection Low Voltage Logic Compatible DFN-6 Package or SC70-6 Package


    Original     		PDF PA2011 SC70-6 PA2011 95040 PA2011SC 16 chanel input switch analog PA2011SC-T7

    IPC-7527

    Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
    Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: 2SA2029FHA / 2SA1774EB / 2SA1774 2SA1774FRA / 2SA1576UB // 2SA1576A 2SA1576AFRA / 2SA1037AKFRA 2SA2029 / 2SA1774EB / 2SA1576UB / 2SA1037AK Datasheet PNP -150mA -50V General Purpose Transistors AEC-Q101 Qualified Outline Parameter Value VCEO IC 50V 150mA


    Original     		PDF 2SA2029FHA 2SA1774EB 2SA1774 2SA1576UB 2SA1576A 2SA1037AK 2SA2029 2SA1774FRA

    Untitled

    Abstract: No abstract text available
    Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v01.0109 SC70 E – 6 LEAD 2x2 mm PLASTIC SC70 PACKAGE PACKAGE OUTLINES SC70 (E) Package Outline Drawing


    Original     		PDF

    land pattern for sot109-1

    Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
    Text: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products


    Original     		PDF DO-35 DO-41 DO-34 OD80C OD123F HXSON12) OT983 land pattern for sot109-1 TSSOP-8 footprint and soldering sot-23 SOD87 footprint

    MO-203-AA

    Abstract: a 4x transistor land pattern sc70-5 MO-203AA SC70-5 eiaj SC70
    Text: Plastic Packages for Integrated Circuits Small Outline Transistor Plastic Packages SC70-5 P5.049 D VIEW C e1 5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE INCHES 5 SYMBOL 4 E CL 1 2 CL 3 e E1 b CL 0.20 (0.008) M C C CL A A2 SEATING PLANE A1 -C- PLATING


    Original     		PDF SC70-5) 5M-1994. MO-203AA. MO-203-AA a 4x transistor land pattern sc70-5 MO-203AA SC70-5 eiaj SC70

    SOT23-6 p-mos MARKING 57

    Abstract: MARKING CODE tw SOT23-6 UM3301DBV
    Text: UM3301 1-Bit Bidirectional Voltage-Level Translator with Auto Direction sensing and ±15kV ESD Protection UM3301 CSP6/SOT23-6/SC70-6 General Description UM3301 is 1-bit bidirectional voltage level translator with auto direction sensing and ±15kV ESD protection. This 1-bit noninverting translator uses two separate configurable power-supply rails.


    Original     		PDF UM3301 UM3301 CSP6/SOT23-6/SC70-6 SOT23-6 p-mos MARKING 57 MARKING CODE tw SOT23-6 UM3301DBV

    low voltage reset SC70-3

    Abstract: ILC5061 ILC5061AM23 ILC5061AM25 ILC5061AM26 ILC5061AM27 ILC5061AM28 ILC5061AM29 ILC5061AM31 top marking sot23-3
    Text: www.fairchildsemi.com ILC5061 Power Supply reset Monitor with 1% Precision Features Description • • • • • • All-CMOS design in SOT-23 or SC70 package ±1% precision in Reset Detection Only 1µA of Iq 2mA of sink current capability Built-in hysteresis of 5% of detection voltage


    Original     		PDF ILC5061 OT-23 low voltage reset SC70-3 ILC5061 ILC5061AM23 ILC5061AM25 ILC5061AM26 ILC5061AM27 ILC5061AM28 ILC5061AM29 ILC5061AM31 top marking sot23-3

    marking M8Y

    Abstract: marking n1y ILC5061 ILC5061AM23X ILC5061AM25X ILC5061AM26X ILC5061AM27X ILC5061AM28X ILC5061AM29X ILC5061AM31X
    Text: www.fairchildsemi.com ILC5061 Power Supply reset Monitor with 1% Precision Features Description • • • • • • All-CMOS design in SOT-23 or SC70 package ±1% precision in Reset Detection Only 1µA of Iq 2mA of sink current capability Built-in hysteresis of 5% of detection voltage


    Original     		PDF ILC5061 OT-23 ILC5061 marking M8Y marking n1y ILC5061AM23X ILC5061AM25X ILC5061AM26X ILC5061AM27X ILC5061AM28X ILC5061AM29X ILC5061AM31X

    2SA1774

    Abstract: No abstract text available
    Text: 2SA2029 / 2SA1774EB / 2SA1774 / 2SA1576UB / 2SA1576A / 2SA1037AK Datasheet PNP -150mA -50V General Purpose Transistors Outline Parameter Value VCEO IC 50V 150mA VMT3 EMT3F Collector Collector Base Base Emitter Emitter 2SA2029 SC-105AA Features


    Original     		PDF 2SA2029 2SA1774EB 2SA1774 2SA1576UB 2SA1576A 2SA1037AK -150mA 150mA 2SA2029 SC-105AA)

    2SC4081UB

    Abstract: No abstract text available
    Text: 2SA2029 / 2SA1774EB / 2SA1774 / 2SA1576UB / 2SA1576A / 2SA1037AK Datasheet PNP -150mA -50V General Purpose Transistors Outline Parameter Value VCEO IC 50V 150mA VMT3 EMT3F Collector Collector Base Base Emitter Emitter 2SA2029 SC-105AA Features


    Original     		PDF 2SA2029 2SA1774EB 2SA1774 2SA1576UB 2SA1576A 2SA1037AK -150mA 150mA 2SA2029 SC-105AA) 2SC4081UB

    2SC4081UB

    Abstract: No abstract text available
    Text: 2SA2029 / 2SA1774EB / 2SA1774 / 2SA1576UB / 2SA1576A / 2SA1037AK Datasheet PNP -150mA -50V General Purpose Transistors lOutline Parameter Value VCEO IC -50V -150mA VMT3 EMT3F Collector Collector Base Base Emitter Emitter 2SA2029 SC-105AA lFeatures 1) General Purpose.


    Original     		PDF 2SA2029 2SA1774EB 2SA1774 2SA1576UB 2SA1576A 2SA1037AK -150mA -150mA 2SA2029 SC-105AA) 2SC4081UB

    Untitled

    Abstract: No abstract text available
    Text: ALPHA & OMEGA Document No. SEMICONDUCTOR, LTD. PO—000 1 2 Version rev F SC70 PACKAGE OUTLINE OJ 1_L c O.lOnn b RECOMMENDED LAND PATTERN SYMBOLS sJD Ö 1 r 0.65 in cr> 0,60 UNIT: mm A Al A2 b c D E e el El L DIMENSIONS IN MILLIMETERS MIN 0.00 0.7 0.15 0.08


    OCR Scan     		PDF PO--000