14X14
Abstract: SF-BGA196D-B-11 pitch 0.4mm BGA
Text: C Package Code: BGA196D D See BGA pattern code to the right for actual pattern layout Y Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) 13.50mm [0.531"] 0.50mm [0.020"] X Top View (reference only) 3.74mm [0.147"] 0.30mm [0.012"] dia. 1.00mm pitch typ. 0.508 mm [0.020"]
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BGA196D
FR4/G10
14X14
SF-BGA196D-B-11
14X14
pitch 0.4mm BGA
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PDF
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SF-BGA196A-B-11
Abstract: BGA196A
Text: D Package Code: BGA196A C 16.51mm [0.650"] See BGA pattern code to the right for actual pattern layout Y 1.91mm [0.075"] 0.76mm [0.030"] 16.51mm [0.650"] X Top View reference only 1.91mm [0.075"] 1.27 mm [0.050"] 2 0.36mm [0.014"] dia. 5.33mm 3.74mm [0.147"]
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BGA196A
SF-BGA196A-B-11
BGA196A
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PDF
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xilinx topside marking
Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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Original
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UG112
UG072,
UG075,
XAPP427,
xilinx topside marking
xilinx part marking
pcb footprint FS48, and FSG48
smd code v36
CF1752
reballing
recommended layout CSG324
BGA reflow guide
XC2VP7 reflow profile
SMD MARKING CODE C1G
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PDF
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qfn 3x3 tray dimension
Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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Original
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UG112
UG072,
UG075,
XAPP427,
qfn 3x3 tray dimension
XCDAISY
BFG95
XC5VLX330T-1FF1738I
pcb footprint FS48, and FSG48
WS609
jedec so8 Wire bond gap
XC3S400AN-4FG400I
FFG676
XC4VLX25 cmos 668 fcbga
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PDF
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xilinx part marking
Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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Original
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UG112
UG072,
UG075,
XAPP427,
xilinx part marking
xilinx topside marking
UG112
qfn 3x3 tray dimension
FGG484
HQG160
reballing
top marking 957 so8
FF1148
fcBGA PACKAGE thermal resistance
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PDF
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XILINX/part marking Hot
Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the
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Original
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UG112
UG072,
UG075,
XAPP427,
XILINX/part marking Hot
SMT, FPGA FINE PITCH BGA 456 BALL
PC84/PCG84
XCDAISY
TT 2076
XC2VP7 reflow profile
SPARTAN-II xc2s50 pq208
sn63pb37 solder SPHERES
qfn 3x3 tray dimension
HQG160
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PDF
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BFG95
Abstract: No abstract text available
Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL
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Original
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UG112
UG072,
UG075,
XAPP427,
BFG95
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PDF
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FBGA-484
Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
Text: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly
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Original
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FBGA484
SI-SX32-ACQ256SFG484
SI-SX72-ACQ256SFG484)
SI-SX72-ACQ256SFG484
CQ256
FG484
SI-SX72ACQ256SFG484)
FBGA-484
A54SX32A-CQ256
actel FG484 package mechanical drawing
B22 filament base
land pattern QFP 208
SX72
A54SX32A-FG484
silicone paste p4
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PDF
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LS-BGA196E-61
Abstract: No abstract text available
Text: Top View 0.8mm [0.031"] 12mm [0.472"] 0.8mm [0.031"] 0.8mm typ. 12mm [0.472"] 10.4mm square 1 3.52mm [0.139"] 1.68mm [0.066"] 2 0.2mm dia. [0.008"] Side View 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non clad
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FR4/G10
14x14
LS-BGA196E-61
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PDF
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LS-BGA196F-41
Abstract: No abstract text available
Text: 23.00mm [0.906"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 23.00mm [0.906"] Top View 1 Side View 3.76mm [0.148"] 1.68mm [0.066"] Ø 0.20mm [0.008"] ±0.0005" 2 21.00mm [0.827"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.
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FR4/G10
20x20
LS-BGA196F-41
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PDF
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LS-BGA196G-41
Abstract: No abstract text available
Text: 17.00mm [0.669"] 1.00mm [0.039"] 1.00mm [0.039"] 1.00mm typ. 17.00mm [0.669"] Top View 1 3.76mm [0.148"] 1.68mm [0.066"] Side View Ø 0.20mm [0.008"] ±0.0005" 2 15.00mm [0.591"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.
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FR4/G10
16x16
LS-BGA196G-41
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PDF
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LS-BGA196D-41
Abstract: No abstract text available
Text: 17.00mm [0.669"] 2.00mm [0.079"] 2.00mm [0.079"] 1.00mm typ. 17.00mm [0.669"] Top View 1 Side View 3.76mm [0.148"] 1.68mm [0.066"] 2 Ø 0.20mm [0.008"] ±0.0005" 13.00mm [0.512"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material.
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FR4/G10
14x14
LS-BGA196D-41
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PDF
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smd transistor mark E13
Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue
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SSYZ015B
smd transistor mark E13
Modified Coffin-Manson Equation Calculations
senju solder paste m10 f12
A10D10
P6K6
BGA reflow guide
Senju metal flux T5
k5m6
K793
T4V4
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PDF
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PCB design for very fine pitch csp package
Abstract: Senju 179GHH 37K-1 B12-246 Modified Coffin-Manson Equation Calculations Senju metal solder paste 160 e7 Semicon volume 1 SSYZ015A
Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015A Second Edition – September 1999 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue
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Original
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SSYZ015A
PCB design for very fine pitch csp package
Senju
179GHH
37K-1
B12-246
Modified Coffin-Manson Equation Calculations
Senju metal solder paste
160 e7
Semicon volume 1
SSYZ015A
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PDF
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
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pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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Turn-Key
Abstract: Adapters Sockets Product Presentations Giga-snaP™ BGA SMT Adapters Receptacles Prototyping Adapters Surface Mount Package Emulation Probing and Analysis Adapters BGA Sockets
Text: RoHS ISO w i t h 900 d 08 20 i g n : 1 es Certified Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . 2 Catalog 26 Receptacles . . . . . . . . . . . . . . . . . . . . . 22 Package Conversion For Production Applications . . . . 24-25
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75GHz
50-80grams
Turn-Key
Adapters
Sockets
Product Presentations
Giga-snaP™ BGA SMT Adapters
Receptacles
Prototyping Adapters
Surface Mount Package Emulation
Probing and Analysis Adapters
BGA Sockets
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PDF
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footprint jedec MS-026 TQFP
Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144
Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES
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PBGA 256 reflow profile
Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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land pattern BGA 196
Abstract: SF-BGA196E-B-05F bga 196 land pattern
Text: RoHS COMPLIANT 19.725mm [0.777"] 2.50mm [0.098"] 2.54mm [0.100"] 10.40mm [0.409"] 2.50mm [0.098"] 2.16mm [0.085"] 2.54mm [0.100"] A1 Top View 10.40mm [0.409"] 19.725mm [0.777"] 14.725mm [0.580"] 5.08mm [0.200"] 0.80mm typ. Threaded Insert Ø 0.60mm typ. [Ø 0.024"]
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725mm
FR4/G10
SF-BGA196E-B-05F
land pattern BGA 196
bga 196 land pattern
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PDF
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SF-BGA196C-B-05F
Abstract: No abstract text available
Text: RoHS COMPLIANT 22.725mm [0.895"] 2.50mm [0.098"] 13.00mm [0.512"] 2.50mm [0.098"] 2.54mm [0.100"] 2.74mm [0.108"] 2.36mm [0.093"] 22.725mm [0.895"] 13.00mm [0.512"] 17.725mm [0.698"] 1.00mm typ. [0.039"] 5.08mm [0.200"] Top View 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]
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725mm
FR4/G10
SF-BGA196C-B-05F
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PDF
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SF-BGA196C-B-05
Abstract: bga 196 land pattern
Text: 22.725mm [0.895"] 2.50mm [0.098"] 13.00mm [0.512"] 2.50mm [0.098"] 2.54mm [0.100"] 2.74mm [0.108"] 2.36mm [0.093"] 22.725mm [0.895"] 13.00mm [0.512"] 17.725mm [0.698"] 1.00mm typ. [0.039"] 5.08mm [0.200"] Top View 0-80 Threaded Insert Ø 0.60mm typ. [Ø 0.024"]
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725mm
FR4/G10
Sn63Pb37
SF-BGA196C-B-05
bga 196 land pattern
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PDF
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SF-BGA196E-B-05
Abstract: bga 196 land pattern
Text: 19.725mm [0.777"] 2.50mm [0.098"] 2.54mm [0.100"] 10.40mm [0.409"] 2.50mm [0.098"] 2.16mm [0.085"] Top View 2.54mm [0.100"] A1 10.40mm [0.409"] 19.725mm [0.777"] 14.725mm [0.580"] 0.80mm typ. [0.031"] 5.08mm [0.200"] Threaded Insert Ø 0.60mm typ. [Ø 0.024"]
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725mm
025mm
FR4/G10
Sn63Pb37
SF-BGA196E-B-05
bga 196 land pattern
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PDF
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SF-BGA196J-B-05
Abstract: 0619
Text: 20.725mm [0.816"] 2.50mm [0.098"] 3.04mm [0.120"] 10.40mm [0.409"] 2.50mm [0.098"] 2.54mm [0.100"] 2.66mm [0.105"] Top View 10.40mm [0.409"] 20.725mm [0.816"] 15.725mm [0.619"] 0.80mm typ. [0.031"] 5.08mm [0.200"] Threaded Insert Ø 0.60mm typ. [Ø 0.024"]
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725mm
FR4/G10
Sn63Pb37
SF-BGA196J-B-05
0619
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PDF
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