LGA voiding
Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style
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AN3311
MC1320x
MC1321x
LGA voiding
AN3281
Lead Free reflow soldering profile BGA
AN1902
AN3311
fr-5 laminate
BGA PACKAGE thermal resistance Freescale
bga PCB footprint
reflow profile FOR LGA COMPONENTS
LGA PACKAGE thermal resistance Freescale
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AN3281
Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style
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AN3311
MC1320x
MC1321x
AN3281
LGA voiding
LGA PACKAGE thermal resistance Freescale
reflow profile FOR LGA COMPONENTS
"LGA footprint"
lga components
AN1902
AN3311
BGA cte
fr-5 laminate
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LGA rework
Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules
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AN3241
MC1320x
MC1321x
LGA rework
AN2920
cte table flip chip substrate
Solder Paste, Indium reflow process control
LGA voiding
AN1902
AN3241
BGA cte
reflow profile FOR LGA COMPONENTS
ceramic rework
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size 0204 capacitor
Abstract: z104m
Text: LGA Low Inductance Capacitors 0204/0306/0508/0805 Land Grid Arrays AVX has introduced a revolutionary new capacitor for low inductance applications. Low inductance LGA land grid array capacitors have virtually the equivalent high frequency performance of 8-terminal IDC’s
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Untitled
Abstract: No abstract text available
Text: LGA Low Inductance Capacitors 0204/0306/0508/0805 Land Grid Arrays AVX has introduced a revolutionary new capacitor for low inductance applications. Low inductance LGA land grid array capacitors have virtually the equivalent high frequency performance of 8-terminal IDC’s
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LICC
Abstract: kyocera mlcc military capacitors lga components
Text: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown
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S-LGA0M806-N
LICC
kyocera mlcc
military capacitors
lga components
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Untitled
Abstract: No abstract text available
Text: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector
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UL94V-0,
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lga 115
Abstract: No abstract text available
Text: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector
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EIA 364-60
Abstract: EIA-364-60 EIA-364-32 Socket-F Tyco AMD thermal design retention mechanism LGA1207 EIA-364-20 EIA-364-21 LF-LGA1207 LGA socket
Text: lever actuated Land Grid Array LGA 1207 position socket LGA1207 and LF-LGA1207 1. SCOPE 1.1. Content Product specification 108-78375 24 AUG 2006 Rev.A This specification covers performance, tests and quality requirements for the Tyco Electronics lever actuated Land Grid Array (LGA) socket F 1207.
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LGA1207
LF-LGA1207
EIA 364-60
EIA-364-60
EIA-364-32
Socket-F Tyco
AMD thermal design retention mechanism
EIA-364-20
EIA-364-21
LF-LGA1207
LGA socket
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Untitled
Abstract: No abstract text available
Text: LGA Low Inductance Capacitors 0204/0306/0805 Land Grid Arrays Land Grid Array LGA capacitors are the latest family of low inductance MLCCs from AVX. These new LGA products are the third low inductance family developed by AVX. The innovative LGA technology sets a new standard for low inductance MLCC performance.
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solLG22
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Untitled
Abstract: No abstract text available
Text: LGA Low Inductance Capacitors 0204/0306/0508/0805 Land Grid Arrays AVX has introduced a revolutionary new capacitor for low inductance applications. Low inductance LGA land grid array capacitors have virtually the equivalent high frequency performance of 8-terminal IDC’s (Inter-Digitated Capacitors) but are built in a simplified 2 terminal package.
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LGA48
Abstract: No abstract text available
Text: LAND GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC LGA-48P-M01 48-pin Plastic LGA Land pitch 1.00 mm Land matrix 6x8 Sealing method Resin seal LGA-48P-M01 48-pin Plastic LGA (LGA-48P-M01) Note: The actual shape of corners may differ from the dimension.
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LGA-48P-M01
48-pin
LGA-48P-M01)
024x5)
MCM-M003-2-1
45x48
018x48)
LGA48
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10-LEAD
Abstract: No abstract text available
Text: DATE: 01/26/09 DESCRIPTION: 10-Lead, Thin Leadframe Land Grid Array TLLGA PACKAGE CODE: XA10 DOCUMENT CONTROL #: PD-2095 09-0064 REVISION: -
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10-Lead,
PD-2095
10-LEAD
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leadframe
Abstract: No abstract text available
Text: DATE: 01/28/09 DESCRIPTION: 8-Lead, Thin Leadframe Land Grid Array TLLGA PACKAGE CODE: XA8 DOCUMENT CONTROL #: PD-2081 09-0065 REVISION: A
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PD-2081
leadframe
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RT3PE3000L CQ256
Abstract: No abstract text available
Text: Revision 3 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array
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MIL-STD-883
RT3PE3000L CQ256
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Microsemi Military Products Selection Guide
Abstract: RT3PE3000L RT3PE600L CCGA 472 mechanical drawing CQ208 CQ256 LG484 AND SOC LG484
Text: Revision 2 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array
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MIL-STD-883
Microsemi Military Products Selection Guide
RT3PE3000L
RT3PE600L
CCGA 472 mechanical drawing
CQ208
CQ256
LG484 AND SOC
LG484
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Untitled
Abstract: No abstract text available
Text: Revision 5 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array
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RT3PE3000L CQ256
Abstract: CG484 RT3PE3000L LG484 CCGA CCGA 472 CCGA 472 mechanical drawing RT3PE600L IO30PDB1V1 IO283PDB7V1
Text: Revision 5 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array
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MIL-STD-883
RT3PE3000L CQ256
CG484
RT3PE3000L
LG484
CCGA
CCGA 472
CCGA 472 mechanical drawing
RT3PE600L
IO30PDB1V1
IO283PDB7V1
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RT3PE3000L CQ256
Abstract: RT3PE3000L CQ256 RT3PE600L IO30PDB1V1 IO283PDB7V1 actel package mechanical drawing
Text: Revision 4 Radiation-Tolerant ProASIC3 Low Power Spaceflight Flash FPGAs with Flash*Freeze Technology Features and Benefits MIL-STD-883 Class B Qualified Packaging • Ceramic Column Grid Array with Six Sigma Copper-Wrapped Lead-Tin Columns • Land Grid Array
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RT3PE3000L CQ256
RT3PE3000L
CQ256
RT3PE600L
IO30PDB1V1
IO283PDB7V1
actel package mechanical drawing
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Untitled
Abstract: No abstract text available
Text: Aries Land Grid Array Socket, 16x16 Grid, 256 Pin, [.050] 1.27 Pitch FEATURES: • Uses same surface mount soldering technology as BGA devices. • LGA device is accurately aligned and seated in socket base prior to mounting of top. • Controlled contact deflection.
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16x16
256-LGA16001-V1
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BGA Package 0.35mm pitch
Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
Text: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed
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CH-1072
BGA Package 0.35mm pitch
E-tec Interconnect
.65mm bga land pattern
1072 Diode, SMD
3M Touch Systems
bpw 50
TEC Driver
8 pin ic base socket round pin type lead
qualitek
BGA reflow guide
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Untitled
Abstract: No abstract text available
Text: Package outline HLLGA48R: plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.25 mm D SOT863-1 A B land 1 index area E e1 L1 v w b e 13 M M y1 C C A B C A y 24 L C 25 12 e e2 Eh 1 36 land 1 index area 48 37 Dh
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HLLGA48R:
OT863-1
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Untitled
Abstract: No abstract text available
Text: Package outline HLLGA68R: plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm D SOT838-1 A B land 1 index area E e1 L1 L v w b e 18 M M y1 C C A B C A C y 34 35 17 e e2 Eh 1 land 1 index area 51 68 52
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HLLGA68R:
OT838-1
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sot819
Abstract: 14L15
Text: Package outline Philips Semiconductors HLLGA28: plastic thermal enhanced low profile land grid array package; 28 lands; body 6 x 6 x 1.4 mm D SOT819-1 A B land 1 index area E e1 v w b e L1 8 M M y1 C C A B C A C y 14 L 15 7 e e2 Eh 21 1 land 1 index area 28
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HLLGA28:
OT819-1
sot819
14L15
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